腾辉集团总部位于中国苏州,是一家全球领先的高品质覆铜箔基板(Copper Clad Laminate)和半固化片(Prepreg)制造销售商,产品广泛应用于各种印刷线路板(PCB)应用。腾辉拥有完整的独立研发能力并致力于持续改善及研发产品以满足客户需求。
腾辉集团足迹遍布全球,在亚洲、欧洲及美国都有制造、销售以及服务中心。
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17 十二月 2024
Ventec 确定泰国为最先进新的PCB 材料制造工厂所在地
13 十一月 2024
Ventec to become primary PCB materials supplier for Teltonika
14 十月 2024
Ventec 晉升 Bill Wang 為集團技術副總裁
10 十月 2024
Ventec于德国整合和升级欧洲生产和物流中心