tec-speed: High-speed/low-loss material technology
The ultimate choice for superior Signal Integrity performance
With the growing demand for high-reliability and high-speed computing & storage applications, the tec-speed laminates & prepreg brand unites one of the most comprehensive range of products in high-speed/low-loss PCB material technology. From mid-loss (Df 0.012) to ultra-low-loss (Df 0.003) specifications with Dk levels ranging between 3.8 and 2.8, tec-speed offers the ultimate in laminate technology and quality assurance through Ventec’s proprietary manufacturing and distribution network.
tec-speed combines technological innovation, high-performance and superior quality, offering excellent electrical properties for reliability and stability across a broad range of frequencies and temperatures. tec-speed materials are designed for applications where good Signal Integrity is essential, including: telecom, router, servers, backplane & daughter card designs, high-frequency & high-speed designs, automotive & satellite communication, navigation, GPS, hand-held products etc.
|Product Name||Industry Approval||Description|
|tec-speed 30.0 (VT-6710)||IPC4103 /8||Dk 10.2 ceramic-filled PTFE composite material|
|tec-speed 30.0 (VT-3703/3706)||IPC4103 /6 /7||Dk 3.0 & 6.15 ceramic-filled PTFE composite material|
|tec-speed 20.0||IPC4103||Dk 3.0-3.48 ceramic-filled hydrocarbon thermoset material|
|tec-speed 7.0 / 7.1||IPC-4101E /91 /102||High Tg200, ultra low loss & high thermal reliability.|
|tec-speed 6.0||IPC-4101E /91 /102||low Dk & very low Loss & Tg 170 Lead Free Assembly|
|tec-speed 4.0||IPC-4101E /126||mid Dk & lower Loss & Tg 190 Lead Free Assembly|
|tec-speed 3.0||IPC-4101E /130||mid Dk & low Loss & Tg 175 Halogen Free & Lead Free Assembly|
|tec-speed 2.1||IPC-4101E /97 /98 /99 /101 /126||mid Dk & low Loss & Tg 175 Lead Free Assembly|
|tec-speed 2.0||IPC-4101E /127 /128 /130||mid Dk & mid Loss & Tg 180 Halogen Free & Lead Free Assembly|