• VT-5A2 Laminate/Prepreg

    UL Approval: E214381 Version: A1 21/05/2023

    General Information

    Ventec offers a series of Ceramic Filled thermally conductive Laminates and Prepregs for multilayer PCB applications requiring thermal dissipation. Laminates and Prepregs provide ease of manufacture during ply-up. The prepreg provides higher thermal conductivity and flowability, which suits high power and heavy copper designs.

    • Thermal conductivity - 2.2W/mK, 8 times that of FR4
    • High Tg& High Td
    • Excellent thermal and insulation performance
    • Best-in-class Thermal Performance with T260 > 60 Minutes, T288 > 30 Minutes and T300 >15 Minutes
    • MOT up to 150℃ for 0.63mm and above
    • Lead-free assembly compatible
    • ROHS & WEEE compliant

    Application

    • Power Conversion
    • PDP, LED, Regulator for TV, Monitor Drives
    • Rectifier, Power supply
    • Automotive Electronics
    • Hybrid Multilayers Constructions
    • Other designs with thermal management requirement

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /

    The Prepreg exceeding shelf life should be retested.

    Laminate Properties

    Properties Sheet

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg IPC-TM-650 2.4.25 °C 170 minimum 190
    Td ASTM D3850 °C 340 minimum 375
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >30
    T300 IPC-TM-650 2.4.24.1 Minute 5 minimum >15
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second 10 minimum >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 29
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 220
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.0 maximum 2.1
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL 746B °C - 130 (Internal test 150)
    Electrical Properties
    Dielectric Constant @ 1GHz RC 90% IPC-TM-650 2.5.5.9 - 5.2 maximum 4.3
    Dissipation Factor @ 1GHz RC 90% IPC-TM-650 2.5.5.9 - 0.035 maximum 0.008
    Volume Resistivity After Moisture Resistence IPC-TM-650 2.4.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.4.17.1 MΩ-cm 1.0E+3 minimum 5.0E+7
    Surface Resistivity After Moisture Resistence IPC-TM-650 2.4.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.4.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum >1000 (40)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 0 (600)
    Arc Resistence ASTM D495 Second 60 minimum >150
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) / 6.8 (1.2)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 6.8 (1.2)
    Youngs Modulus IPC-TM-650 2.4.18.3 GPa - 20
    Poisson Ratio ASTM D638 - - 0.17
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.5 maximum 0.12
    Flammability UL-94 Rating - V-0
    Thermal Conductivity Z-axis ISO22007-2 W/mK - 2.2
    X-Y axis - 3.4
    Specific Heat ASTM E1269 J/gK - 0.895
    Specific Gravity ASTM D792 Method A g/cm3 - 2.2

    Note: All test data provided are typical values and not intended to be specification values.

    Availability

    Laminate

    Item Availability
    Copper Foil Hoz, 1oz, 2oz, 3oz
    Dielectric .003"(80um), .004"(100um), .006"(150um), .008"(200um), .012"(300um)
    Standard Size 37"*49", 41"*49", 43"*49", and Panels could be cut from above sizes.

    Prepreg

    Glass Fabric Press Thickness (um)
    1037 80
    106 110
    106 130

    Inner Layer

    Item Recommendation
    Surface Preparation Chemical treatment preferred
    D.E.S. Standard process
    Oxide Compatible with most oxide chemicals

    Press Condition

    Item Recommendation
    1. Heating rate (Rise of Rate) on Product 3-6℃/min (5~10℉/min)
    2. Full Pressure on Product ≥400psi in 5~10 minutes after pressing starts
    3. Curing Temperature & Time >60min at more than 180℃ (356℉) on Product
    4. Vacuuming should be continued until over 140℃(284℉) [Material Temperature]
    5. Cold Press condition: Keep Plate cooled by water; Pressure:100psi; Dwell: 60minutes

    Machining & Wet Processes

    Item Recommendation
    Drilling Excessive wear of carbide drill bits. Diamond coated drill bits preferred.
    Desmearing Alkaline permanganate or plasma
    Metallization Compatible with direct deposit or electroless copper processes
    Surface Finish Compatible with OSP, HASL, ENIG, etc. Bake prior to HASL.
    Punching&Routing Aggressive wear of machining tools

    Download TDS Datasheet