Product Name Industry Approval Description
VT-481 IPC-4101E /97 /98 /99 /101 Phenolic Cured, Filled FR4.0 Tg 155
VT-47 IPC-4101E /97 /98 /99 /101 /126 Phenolic Cured, Filled, Low CTE FR4.0 Tg 180
Hole Fill Prepreg IPC-4101E Lead-Free High Tg FR4 Prepreg, UL-V0 Polyimide Ceramic Filled Prepreg optimized for filling Metal Core PCBs

Organic FR4 phenolic cured substrates and ceramic-loaded hole-fill prepregs for environmentally conscious assembly offer choice, strength, resilience and stability over temperature, including high Tg and low CTE, for high reliability and assembly integrity.