option technologies

Option Technologies – a Ventec International Group Brand

Option Technologies is a long established masslam service provider that began trading in 1985. Acquired by Ventec in 2012 and incorporating offshore manufacturing capability, Ventec continues to offer masslam, 'masslam & drill', and 'masslam, drill & plate' solutions to our customers supplied under the Option brand name, which is recognized for technology, quality & service - if your requirements are for technology, quick-turn or simply capacity issues, then we can help. We supply mass-laminated multilayer panels to PCB manufacturers all over the world utilizing high quality laminates & prepregs manufactured by our parent company Ventec International Group. We have mass lamination, drilling & plating capacity in Taiwan and China, with logistics, engineering, technical & quality support based in our customer service centers in Europe & USA, allowing us to customize a supply chain optimized to meet your needs for fast deliveries and cost optimization.

Please contact your local Ventec International Group Service Center to discuss your masslam & drill requirements:

UK Germany USA
Email: sales@ventec-europe.com Email: salesde@ventec-europe.com Email: saleseast@ventec-usa.com
Tel: +44 1926-889822 Tel: +49 6352-753260 Tel: +1 630-4221627

Services

We offer an exclusive masslam & drilling service as detailed below:

  • Masslam, standard or express delivery for off-shore volume from Taiwan and China
  • Masslam & Drilling combined, standard or express delivery for off-shore volume from Taiwan and China

Products

  • Up to 12 layers
  • Masslam
  • Masslam & Drill
  • Masslam, Drill & Plate

Materials

Standard FR4 VT-42, VT-42C
High Tg VT-47, VT-447
CAF-Resistant FR4 VT-481, VT-47, VT-447
FR4 Halogen-Free VT-441, VT-447
Polyimide VT-901, VT-90H

Capabilities

layers 4, 6, 8, 10, 12 (layers)
Cu 1/3oz, Hoz, 1oz, 2oz, 3oz 
maximum panel size 24" x 30"
minimum panel size 12" x 16"
minimum core thickness 3mil H/H
minimum L/S 3/3 mil
minimum thickness of different layers 11mil (4L), 49mil (12L)
inter-layer alignment ±3mil
tolerance of forming size ±1mm
warp ˂0.75%
minimum hole size 0.15mm / 6mil
maximum hole size up to 10mm / 0.254"

Copper Plating (bonded panels only)

maximum panel size 21.97" x 24"
minimum panel size 14.6" x 13"
copper thickness typically 20μ
drill aspect ratio 6:1

Working to the guidelines of the IPC specification