Product Name Industry Approval Description
VT-464GS IPC-4101E /130 BT Material

IC Packaging Substrates

Enabling reliable IC packaging

With the rise of new types of ICs like BGA (ball grid array) and CSP (chip scale package), Ventec is at the forefront of product development for integrated circuit packaging (IC) substrates.

Our advanced technology materials deliver the properties & performance demanded by today's light weight, ever thinner and smaller advanced-function devices such as smart phones, laptops, wearables and special mil-aero applications.