|Product Name||Industry Approval||Description|
|VT-464GS||IPC-4101E /130||BT Material|
IC Packaging Substrates
Enabling reliable IC packaging
With the rise of new types of ICs like BGA (ball grid array) and CSP (chip scale package), Ventec is at the forefront of product development for integrated circuit packaging (IC) substrates.
Our advanced technology materials deliver the properties & performance demanded by today's light weight, ever thinner and smaller advanced-function devices such as smart phones, laptops, wearables and special mil-aero applications.