• VT-4BC Metal Base Laminate

    UL Approval: E214381 Version: 15/09/2023 15/09/2023

    General Information

    • Thermal conductivity -- 10 W/mK
    • Ceramic Filled
    • Halogen Free
    • Flammability UL94 V-0
    • MOT 155˚C
    • High Tg 180˚C
    • Suitable for High Temperature Applications

    Application

    • Super Bright Lighting
    • Power Modules (IGBT)
    • Controllers
    • Motor Drives
    • Rectifiers
    • Power Supply & Power Conversion

    Storage Condition

    Laminate
    Storage Condition Temperature Room
    Relative Humidity /

    Designation of IMS Laminate

    230110Designation graphic.jpg

    Laminate Properties

    Item Test Method (IPC-TM-650) or as noted Unit Dielectric Thickness
    100μm 125μm 150μm
    Thermal Conductivity ISO 22007-2 W/mK 10
    Thermal Impedance ISO 22007-2 ℃*in2/W 0.016 0.019 0.023
    Tg DSC 2.4.25 ℃ 180
    Td TGA ASTM D3850 ℃ 400
    Thermal Stress Solder Dip @ 288℃ 2.4.13.1 Minute >=5
    Hi-Pot Withstand DC 2.5.7.2 V 3000 4000 5000
    Breakdown Voltage AC 2.5.6.3 V 8000 9000 10000
    Dk @ 1MHz C-24/23/50 2.5.5.3 - 5.5
    Df @ 1MHz C-24/23/50 2.5.5.3 - 0.014
    Volume Resistance After Moisture 2.5.17.1 MΩ-cm 5.0E+8
    E-24/125 3.0E+7
    Surface Resistance After Moisture 2.5.17.1 MΩ 2.0E+7
    E-24/125 5.0E+6
    Peel Strength (1oz) As received 2.4.8 Lb/in 6
    CTI As received ASTM D3638 V 600
    Flammability As received UL94 Rating V-0
    RTI Electric UL94 ℃ 155
    Mechanical UL 746E ℃ 155

    (1) All test data provided are typical values and not intended to be specification values. (2) Hi-Pot proof test (600VDC) is performed 100% on the whole working panels (with copper foil). Any higher requirement of Hi-Pot test can be AABUS. (3) Breakdown test is a destructive test, which is done on substrate (without copper foil) of a random sample in the FQC laboratory. All test data provided are preliminary typical values and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Availability

    Metal Plate Selection

    Alloy Style Thermal Conductivity (W/mK) Hardness (HV) Tensile Strength (MPa) Density (g/cm3) CTE (ppm/ºC) Standard Thickness (mm)
    Al 5052H32 138 68 215 2.7 23.8 1.0, 1.5, 2.0, 3.0
    6061T6 167 95 276 2.7 23.6 1.0, 1.5, 2.0
    CTE II 170 45 189 2.7 19.0 1.0, 1.5, 2.0
    Cu C1100 386 95 310 8.9 16.8 1.0, 1.5, 2.0

    Remark: Additional thicknesses could be available upon request.

    Laminate

    Item Availability
    Dielectric Thickness 0.004” (100μm), 0.005” (125μm), 0.006” (150μm)
    Standard Size Imperial (inch) 18.11*24.02
    Metric (mm) 460*610
    Copper Foil Weight 2oz, 3oz, 4oz, 5oz, 6oz, 9oz, 14oz

    Remark: Additional thicknesses could be available upon request.

    Surface Finish for Al Plate

    Code Surface Finish
    None Default Brushing
    "A" Anodizing
    "ER I" High Emissivity

    Protective Film for Copper Plate

    Type Material Max Operation Temperature
    Standard PET 170℃
    High Temperature Polyimide 270℃

    Download TDS Datasheet