• VT-4B5H Metal Base Laminate

    UL Approval: E214381 Version: 23/08/2023 23/08/2023

    General Information

    Ventec offers thermally conductive dielectric without glass reinforcement which offers the following features:

    • Thermal conductivity -- 4.2 W/mK
    • Tg 180˚C
    • MOT 155˚C
    • Ceramic Filled
    • Halogen Free
    • Flammability UL94 V-0

    Application

    • High Beam & Low Beam
    • Power Conversion
    • Power Modulus
    • Motor Drives & Controllers
    • Rectifiers
    • Power Supply
    • Other high temperature and/or high voltage applications

    Laminate Properties

    Item Test Method (IPC-TM-650) Unit Dielectric Thickness
    50μm 75μm 100μm 150μm 200μm
    Thermal Conductivity ISO 22007-2 W/m*K 4.2
    Thermal Impedance ISO 22007-2 ℃*in2/W 0.019 0.029 0.038 0.057 0.076
    Tg DSC 2.4.25 ℃ 180
    DMA 2.4.24.4 210
    Td TGA ASTM D3850 ℃ 400
    Thermal Stress Solder Dip @ 288℃ 2.4.13.1 Minute ≥5
    Hi-Pot Proof Test DC 2.5.7.2 V >600
    Breakdown Voltage AC 2.5.6.3 V 4000 7000 8000 10000 12000
    Dk @ 1MHz C-24/23/50 2.5.5.3 - 4.8
    Df @ 1MHz C-24/23/50 2.5.5.3 - 0.016
    Volume Resistance After Moisture 2.5.17.1 MΩ-cm 5.0E+8
    E-24/125 3.0E+7
    Surface Resistance After Moisture 2.5.17.1 MΩ 2.0E+7
    E-24/125 5.0E+6
    Peel Strength (1oz Cu) As received 2.4.8 Lb/in 5
    CTI As received ASTM D3638 V 600
    Flammability As received UL94 Rating V-0
    RTI Electric UL 746E ℃ 155
    Mechanical 155

    Remark: (1) All test data provided are typical values and not intended to be specification values. (2) Hi-Pot proof test (600VDC) is performed 100% on the whole working panels (with copper foil). Any higher requirement of Hi-Pot test can be AABUS. (3) Breakdown test is a destructive test, which is done on substrate (without copper foil) of a random sample in the FQC laboratory. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Storage Condition

    Laminate
    Storage Condition Temperature Room
    Relative Humidity /

    Designation of IMS Laminate

    200526VT-4B5H-Designation.jpg.png

    Availability

    Metal Plate Selection

    Alloy Style Thermal Conductivity (W/mK) Hardness (HV) Tensile Strength (MPa) Density (g/cm3) CTE (ppm/℃) Standard Thickness (mm)
    Aluminum (Al) 5052H32 138 68 215 2.7 23.8 1.0, 1.5, 2.0, 3.0
    6061T6 167 95 276 2.7 23.6 1.0, 1.5, 2.0
    CTEII 170 45 189 2.7 19 1.0, 1.5, 2.0
    Copper (Cu) C1100 386 95 310 8.9 16.8 1.0, 1.5, 2.0

    Remark: Additional thicknesses could be available upon request.

    Laminate

    Item Availability
    Dielectric Thickness 0.002" (50μm), 0.003" (75μm), 0.004" (100μm), 0.006" (150μm), 0.008" (200μm)
    Standard Size Imperial (inch) 18.11”*24.02”, 20.08”*24.02”, 20.98”*24.02” (460mm*1220mm)
    Metric (mm) 460mm*610mm, 510mm*610mm, 533mm*610mm
    Copper Foil Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz

    Remark: Additional options could be available upon request.

    Surface Finish for Aluminum (Al) Plate

    Code Surface Finish
    None Default Brushing
    "A" Anodizing
    "ER I" High Emissivity

    Protective Film for Metal Plate

    Type Material Max Operation Temperature
    Standard Type PET 170℃
    High Temperature Type Polyimide 270℃

    Download TDS Datasheet