• VT-462SH No & Low Flow Prepreg

    UL Approval: E214381 Version: Prelim 1 12/01/2023 /127/128/130

    General Information

    tec-speed 6.0 H-LF (VT-462SH NF/LF) ultra low loss No Flow and Low Flow product is designed to meet friendly environment requirement. It has good bonding and thermal performance in applications of heat sink bonding and rigid-flex board, and have a minimal flow range with a consistent lamination.

    • High Speed / ultra low loss
    • Halogen Free & Lead Free Compatible
    • Optimized flow range

    Application

    Availability

    Type Glass Type Flow Range Pressed Thickness (100% Copper Remain)
    mil mm mil mm
    1067NF-50 1067 20~80 0.5~2 2.0 0.050
    1067NF-60 1067 20~80 0.5~2 2.4 0.060
    1078NF-80 1078 20~80 0.5~2 3.1 0.080

    * Measured by micrometer “NF” ---- No Flow PP
    1) Press Temperature ---- 171˚C
    2) 3plys per pressing
    3) Press Pressure ---- 200psi Built per IPC-TM-650 2.3.17.2

    Properties Test Method Units Typical Value
    Thermal Properties
    Electrical Properties
    Mechanical Properties
    Physical Properties
    Tg TMA IPC-TM-650 2.4.24 ℃ 200
    Td TGA ASTM D3850 ℃ 440
    Thermal Stress @288℃ IPC-TM-650 2.4.13.1 Second >300
    X,Y-axis CTE 30~125℃ IPC-TM-650 2.4.24 ℃ 12~15
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/℃ 70
    After Tg IPC-TM-650 2.4.24 ppm/℃ 240
    Dk (RC 60%) @10Ghz C24/23/50 IPC-TM-650 2.5.5.9 - 3.2
    Df (RC 60%) @10Ghz C24/23/50 IPC-TM-650 2.5.5.9 - 0.004
    Electrical Strength IPC-TM-650 2.5.6.2 KV/mm 54
    Breakdown Voltage D48/50 + D0.5/23 IPC-TM-650 2.5.6 KV 60
    Arc Resistance D48/50 + D0.5/23 IPC-TM-650 2.5.1 Second 120
    Peel Strength (1oz Cu) IPC-TM-650 2.4.8 lb/in 5-6
    Peel Strength with CVL IPC-TM-650 2.4.8 lb/in 7.0
    Moisture D24/23 IPC-TM-650 2.6.21 % 0.10
    Moisture Absorption after PCT 1 atm., 121˚C, 1 hour % 0.12
    Flammability UL-94 Rating V-0

    All test data provided are typical values and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

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