VT-447V CCL/Laminate VT-447V PP/Prepreg

UL Approval: E214381 Version: 19/12/2024 /127/128/130/154

Shelf life

Prepreg Laminate
Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
Relative Humidity < 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions In Handling

  • The prepreg exceeding shelf time should be retested.
  • Take care in handling thin core laminates as they are easily damaged.
  • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing And Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Dimension stability is the same as Standard FR4 material.
  • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
  • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

 

Prepreg Availability

E-Glass styles: 7628, 2116, 2113, 1087, 1080, 1067, 106, 1037, 1027, etc.

Prepreg Availability

PP Type Resin Content Press Thickness (mil) DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
7628 48% 7.90 4.46 4.36 4.31 4.31 0.012 0.013 0.013 0.014
7628 45% 7.50 4.52 4.42 4.37 4.37 0.012 0.013 0.013 0.014
2116 57% 4.90 4.20 4.10 4.05 4.05 0.013 0.014 0.014 0.015
2116 55% 4.70 4.25 4.15 4.10 4.10 0.013 0.014 0.014 0.015
2116 53% 4.40 4.30 4.20 4.15 4.15 0.013 0.014 0.014 0.015
2113 57% 3.90 4.20 4.10 4.05 4.05 0.013 0.014 0.014 0.015
1086 67% 3.50 3.95 3.85 3.80 3.80 0.014 0.015 0.015 0.016
1086 69% 3.80 3.90 3.80 3.75 3.75 0.014 0.015 0.015 0.016
1080 68% 3.20 3.93 3.83 3.78 3.78 0.014 0.015 0.015 0.016
1080 66% 3.00 3.98 3.88 3.83 3.83 0.014 0.015 0.015 0.016
1080 64% 2.7 4.03 3.93 3.88 3.88 0.014 0.015 0.015 0.016
1078 67% 3.00 3.95 3.85 3.80 3.80 0.014 0.015 0.015 0.016
1078 69% 3.20 3.90 3.80 3.75 3.75 0.014 0.015 0.015 0.016
106 73% 2.20 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
106 75% 2.40 3.75 3.65 3.60 3.60 0.014 0.015 0.015 0.016
1067 72% 2.00 3.83 3.73 3.68 3.68 0.014 0.015 0.015 0.016
1067 74% 2.40 3.78 3.68 3.63 3.63 0.015 0.016 0.016 0.017
1067 78% 2.80 3.69 3.59 3.54 3.54 0.015 0.016 0.016 0.017
1037 73% 1.80 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
1037 75% 2.00 3.75 3.65 3.60 3.60 0.015 0.016 0.016 0.017
1027 71% 1.50 3.85 3.75 3.70 3.70 0.014 0.015 0.015 0.016
1027 73% 1.60 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
1027 75% 1.80 3.75 3.65 3.60 3.60 0.015 0.016 0.016 0.017

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

Laminate Availability

Core thk. (Inches) Stack-up Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
0.002 1-1067 65% 3.85 3.75 3.70 3.70 0.015 0.016 0.016 0.017
0.003 1-2112 52% 4.13 4.08 4.03 4.03 0.013 0.014 0.014 0.015
0.004 1-2116 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015
0.004 2-1067 65% 3.85 3.75 3.70 3.70 0.015 0.016 0.016 0.017
0.005 1-2116 55% 4.04 3.99 3.94 3.94 0.014 0.015 0.015 0.016
0.006 1-1506 45% 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014
0.007 1-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014
0.008 1-7628 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015
0.008 2-2116 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015
0.010 2-2116 55% 4.04 3.99 3.94 3.94 0.014 0.015 0.015 0.016
0.012 2-1506 45% 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014
0.015 2-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
0.021 3-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.024 3-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.028 4-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.031 4-7628 44% 4.55 4.45 4.40 4.40 0.011 0.012 0.012 0.013
0.036 5-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
0.045 6-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
0.049 7-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.056 8-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.059 8-7628 44% 4.55 4.45 4.40 4.40 0.011 0.012 0.012 0.013

Press Condition

1. Heating rate(Rise of Rate) of material [Material Temperature]
Programmable Press: ≥3.0ºC/min

2. Curing Temperature & Time: >60min at more than 190ºC and peak temperature >200ºC

3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 80ºC

4. Vacuuming should be continued until over 140ºC [Material Temperature]

5. Cushion for pressure evenness is needed.

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Typical Drilling Parameters

- Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc - Please adjust drilling parameters after checking qualities of through holes - Suggest Drilling parameter as below:

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Chip Load (um/rev) Hit Counts
0.25 125 25 10~15 500
1.00 53 31 30~45 800

Desmearing Process

- Please test desmear rate and check whether the smear is cleaned clearly by SEM, Ventec could provide the specimen for pilot. - 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear is recommended. - Holding time from desmear to PTH process: < 2 hours

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