VT-447V CCL/Laminate VT-447V PP/Prepreg
UL Approval: E214381 Version: 19/12/2024 /127/128/130/154Shelf life
Prepreg | Laminate | |||
---|---|---|---|---|
Storage Condition | Temperature | < 23℃ (73℉) | < 5℃ (41℉) | Room |
Relative Humidity | < 55% | / | / | |
Shelf Life | 3 Months | 6 Months | 24 Months (airproof) |
Prepreg exceeding shelf life should be retested.
Precautions In Handling
- The prepreg exceeding shelf time should be retested.
- Take care in handling thin core laminates as they are easily damaged.
- If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
- Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.
Designing And Inner Layer Process
- Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
- Dimension stability is the same as Standard FR4 material.
- Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
- For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.
Prepreg Availability
E-Glass styles: 7628, 2116, 2113, 1087, 1080, 1067, 106, 1037, 1027, etc.Prepreg Availability
PP Type | Resin Content | Press Thickness (mil) | DK | DF | ||||||
---|---|---|---|---|---|---|---|---|---|---|
@ 1GHz | @ 2GHz | @ 5GHz | @ 10GHz | @ 1GHz | @ 2GHz | @ 5GHz | @ 10GHz | |||
7628 | 48% | 7.90 | 4.46 | 4.36 | 4.31 | 4.31 | 0.012 | 0.013 | 0.013 | 0.014 |
7628 | 45% | 7.50 | 4.52 | 4.42 | 4.37 | 4.37 | 0.012 | 0.013 | 0.013 | 0.014 |
2116 | 57% | 4.90 | 4.20 | 4.10 | 4.05 | 4.05 | 0.013 | 0.014 | 0.014 | 0.015 |
2116 | 55% | 4.70 | 4.25 | 4.15 | 4.10 | 4.10 | 0.013 | 0.014 | 0.014 | 0.015 |
2116 | 53% | 4.40 | 4.30 | 4.20 | 4.15 | 4.15 | 0.013 | 0.014 | 0.014 | 0.015 |
2113 | 57% | 3.90 | 4.20 | 4.10 | 4.05 | 4.05 | 0.013 | 0.014 | 0.014 | 0.015 |
1086 | 67% | 3.50 | 3.95 | 3.85 | 3.80 | 3.80 | 0.014 | 0.015 | 0.015 | 0.016 |
1086 | 69% | 3.80 | 3.90 | 3.80 | 3.75 | 3.75 | 0.014 | 0.015 | 0.015 | 0.016 |
1080 | 68% | 3.20 | 3.93 | 3.83 | 3.78 | 3.78 | 0.014 | 0.015 | 0.015 | 0.016 |
1080 | 66% | 3.00 | 3.98 | 3.88 | 3.83 | 3.83 | 0.014 | 0.015 | 0.015 | 0.016 |
1080 | 64% | 2.7 | 4.03 | 3.93 | 3.88 | 3.88 | 0.014 | 0.015 | 0.015 | 0.016 |
1078 | 67% | 3.00 | 3.95 | 3.85 | 3.80 | 3.80 | 0.014 | 0.015 | 0.015 | 0.016 |
1078 | 69% | 3.20 | 3.90 | 3.80 | 3.75 | 3.75 | 0.014 | 0.015 | 0.015 | 0.016 |
106 | 73% | 2.20 | 3.80 | 3.70 | 3.65 | 3.65 | 0.014 | 0.015 | 0.015 | 0.016 |
106 | 75% | 2.40 | 3.75 | 3.65 | 3.60 | 3.60 | 0.014 | 0.015 | 0.015 | 0.016 |
1067 | 72% | 2.00 | 3.83 | 3.73 | 3.68 | 3.68 | 0.014 | 0.015 | 0.015 | 0.016 |
1067 | 74% | 2.40 | 3.78 | 3.68 | 3.63 | 3.63 | 0.015 | 0.016 | 0.016 | 0.017 |
1067 | 78% | 2.80 | 3.69 | 3.59 | 3.54 | 3.54 | 0.015 | 0.016 | 0.016 | 0.017 |
1037 | 73% | 1.80 | 3.80 | 3.70 | 3.65 | 3.65 | 0.014 | 0.015 | 0.015 | 0.016 |
1037 | 75% | 2.00 | 3.75 | 3.65 | 3.60 | 3.60 | 0.015 | 0.016 | 0.016 | 0.017 |
1027 | 71% | 1.50 | 3.85 | 3.75 | 3.70 | 3.70 | 0.014 | 0.015 | 0.015 | 0.016 |
1027 | 73% | 1.60 | 3.80 | 3.70 | 3.65 | 3.65 | 0.014 | 0.015 | 0.015 | 0.016 |
1027 | 75% | 1.80 | 3.75 | 3.65 | 3.60 | 3.60 | 0.015 | 0.016 | 0.016 | 0.017 |
① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.
Laminate Availablity
Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.Laminate Availability
Core thk. (Inches) | Stack-up | Resin Content | DK | DF | ||||||
---|---|---|---|---|---|---|---|---|---|---|
@ 1GHz | @ 2GHz | @ 5GHz | @ 10GHz | @ 1GHz | @ 2GHz | @ 5GHz | @ 10GHz | |||
0.002 | 1-1067 | 65% | 3.85 | 3.75 | 3.70 | 3.70 | 0.015 | 0.016 | 0.016 | 0.017 |
0.003 | 1-2112 | 52% | 4.13 | 4.08 | 4.03 | 4.03 | 0.013 | 0.014 | 0.014 | 0.015 |
0.004 | 1-2116 | 46% | 4.31 | 4.26 | 4.21 | 4.21 | 0.013 | 0.014 | 0.014 | 0.015 |
0.004 | 2-1067 | 65% | 3.85 | 3.75 | 3.70 | 3.70 | 0.015 | 0.016 | 0.016 | 0.017 |
0.005 | 1-2116 | 55% | 4.04 | 3.99 | 3.94 | 3.94 | 0.014 | 0.015 | 0.015 | 0.016 |
0.006 | 1-1506 | 45% | 4.34 | 4.29 | 4.24 | 4.24 | 0.012 | 0.013 | 0.013 | 0.014 |
0.007 | 1-7628 | 41% | 4.47 | 4.42 | 4.37 | 4.37 | 0.012 | 0.013 | 0.013 | 0.014 |
0.008 | 1-7628 | 46% | 4.31 | 4.26 | 4.21 | 4.21 | 0.013 | 0.014 | 0.014 | 0.015 |
0.008 | 2-2116 | 46% | 4.31 | 4.26 | 4.21 | 4.21 | 0.013 | 0.014 | 0.014 | 0.015 |
0.010 | 2-2116 | 55% | 4.04 | 3.99 | 3.94 | 3.94 | 0.014 | 0.015 | 0.015 | 0.016 |
0.012 | 2-1506 | 45% | 4.34 | 4.29 | 4.24 | 4.24 | 0.012 | 0.013 | 0.013 | 0.014 |
0.015 | 2-7628 | 43% | 4.58 | 4.48 | 4.43 | 4.43 | 0.011 | 0.012 | 0.012 | 0.013 |
0.021 | 3-7628 | 42% | 4.61 | 4.51 | 4.46 | 4.46 | 0.011 | 0.012 | 0.012 | 0.013 |
0.024 | 3-7628 | 42% | 4.61 | 4.51 | 4.46 | 4.46 | 0.011 | 0.012 | 0.012 | 0.013 |
0.028 | 4-7628 | 42% | 4.61 | 4.51 | 4.46 | 4.46 | 0.011 | 0.012 | 0.012 | 0.013 |
0.031 | 4-7628 | 44% | 4.55 | 4.45 | 4.40 | 4.40 | 0.011 | 0.012 | 0.012 | 0.013 |
0.036 | 5-7628 | 43% | 4.58 | 4.48 | 4.43 | 4.43 | 0.011 | 0.012 | 0.012 | 0.013 |
0.045 | 6-7628 | 43% | 4.58 | 4.48 | 4.43 | 4.43 | 0.011 | 0.012 | 0.012 | 0.013 |
0.049 | 7-7628 | 42% | 4.61 | 4.51 | 4.46 | 4.46 | 0.011 | 0.012 | 0.012 | 0.013 |
0.056 | 8-7628 | 42% | 4.61 | 4.51 | 4.46 | 4.46 | 0.011 | 0.012 | 0.012 | 0.013 |
0.059 | 8-7628 | 44% | 4.55 | 4.45 | 4.40 | 4.40 | 0.011 | 0.012 | 0.012 | 0.013 |
Press Condition
1. Heating rate(Rise of Rate) of material [Material Temperature]
Programmable Press: ≥3.0ºC/min
2. Curing Temperature & Time: >60min at more than 190ºC and peak temperature >200ºC
3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 80ºC
4. Vacuuming should be continued until over 140ºC [Material Temperature]
5. Cushion for pressure evenness is needed.

Typical Drilling Parameters
- Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc - Please adjust drilling parameters after checking qualities of through holes - Suggest Drilling parameter as below:Diameter (mm) | Spindle Speed (krpm) | Feed Rate (mm/sec) | Chip Load (um/rev) | Hit Counts |
---|---|---|---|---|
0.25 | 125 | 25 | 10~15 | 500 |
1.00 | 53 | 31 | 30~45 | 800 |