• VT-447PP NF/LF

    UL Approval: E214381 Version: 30/07/2024 31/07/2024 /127/128/130

    General Information

    VT-447 No Flow and Low Flow product is designed to meet friendly environment requirement. It has good bonding and thermal performance in applications of heat sink bonding and rigid-flex board, and have a minimal flow range with a consistent lamination.

    • High Tg & High Td
    • Halogen Free & Lead Free Compatible
    • IPC-4101E /127 /128 /130
    • Optimized flow range for camera module

    Storage Condition & Shelf Life

    Shelf life

    Prepreg
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉)
    Relative Humidity < 55% /
    Shelf Life 3 Months 6 Months

    The prepreg exceeding shelf life should be retested.

    Availability

    Product Type Glass Type Flow Range Pressed Thickness
    (mil) (mm) (mil) (mm)
    VT-447 PP, Lead free & Environment friendly High Tg 1027 NF-25 1027 10~50 0.25~1.25 1.0 0.025
    1027 NF-30 1027 10~50 0.25~1.25 1.2 0.030
    1037 NF-40 1037 10~50 0.25~1.25 1.6 0.040
    1067 NF-50 1067 10~50 0.25~1.25 2.0 0.050
    1067 NF-60 1067 10~50 0.25~1.25 2.4 0.060
    1078 NF-80 1078 10~50 0.25~1.25 3.1 0.080
    1086 NF-90 1086 10~50 0.25~1.25 3.6 0.090
    1086 NF-100 1086 10~50 0.25~1.25 4.0 0.100
    1067 LF-56 1067 60~120 1.50~3.00 2.2 0.056
    1067 LF-66 1067 60~120 1.50~3.00 2.6 0.066
    1078 LF-84 1078 60~120 1.50~3.00 3.3 0.084

    * Measured by micrometer “NF” ---- No Flow PP, “LF” ---- Low Flow PP 1) Press Temperature ---- 171ºC 2) 3plys per pressing 3) Press Pressure ---- 200psi Built per IPC-TM-650 2.3.17.2

    Properties Sheet of Pressed No Flow Prepreg

    Test Item Test Method (IPC-TM-650) Unit VT-447
    Tg DSC 2.4.24 ℃ 180
    Td TGA ASTM D3850 ℃ 370
    Electric Strength 2.5.6.2 KV/mm 54
    Peel Strength with 1oz Cu 2.4.8 Lb/in 8-9
    Peel Strength with CVL 2.4.8 Lb/in 7.0
    Moisture Absorption D24/23 2.6.21 % 0.10
    After PCT 1atm., 121℃, 1hour % 0.12
    X,Y-axis CTE 30~125℃ 2.4.24 ppm/℃ 12~15
    Z-axis CTE Before Tg 2.4.24 ppm/℃ 70
    After Tg 300
    Thermal Stress Solder dip at 288℃ 2.4.13.1 Second >300
    Breakdown Voltage D48/50+D0.5/23 2.5.6 KV >60
    Arc Resistance D48/50+D0.5/23 2.5.1 Second 120
    Dk (RC60% at 1GHz) C24/23/50 2.5.5.9 - 3.9
    Df (RC60% at 1GHz) C24/23/50 2.5.5.9 - 0.015
    Flammability As Received UL-94 Rating V-0

    All test data provided are typical values and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Press Condition

    VT-447PP
    Heating rate of materials 3.0-5.0ºC/min (5~10ºF/min)
    Cure Temperature ≥185ºC
    Cure Time >60min
    Vacuum should be continued until over 140ºC (284ºF) [Material Temperature]
    Pressure on materials: Start with 100psi, Full pressure: 300~450psi
    Cold Press: Keep Plate @ Room Temperature by water; Pressure:100psi; Dwell Time: 60minutes

    Contact Ventec technical service to discuss the specific condition.

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