To Download Datasheets Select Below and Click Download
-
pro-bond 8C: Ultra Low Dk/Df Resin Coated Copper Bondply
UL Approval: E214381 20/03/2024Resin Coated Copper (RCC) Bondply is an unreinforced adhesive system coated onto ultra-thin copper foil (1.5-5.0μm supported on an 18μm carrier foil) for use in high performance and high reliability multilayer PCB stack-ups.
VT-463H is a high Tg, ceramic-filled, low Dk (2.9) & low Df (0.0016), halogen-free thermoset resin system, specifically designed for use in multilayer PCBs with Ventec tec-speed laminates & prepregs, and it is also fully compatible with other resin systems in hybrid stack-ups.
General Information
- Halogen free, Dk 2.9 & Df 0.0016
- Ultra-thin dielectric layer
- Suitable for sequential laminations
- Unreinforced adhesive for better electrical isotropic consistency
- Excellent flow characteristics and filling ability, designed for fine line and space
- Laser drillable
- Excellent laser hole pattern consistency
Application
- Interposers
- Anti-shake Coils
- Probe Cards
- Embedded IC Substrates
Storage Condition
RCC Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F) Relative Humidity Below 55% RH / Properties
Properties Test Method Units Typical Value Dk (RC 50%) @ 1GHz IPC-TM-650 2.5.5.13 - 3.2 @ 10GHz 2.9 Df @ 1GHz IPC-TM-650 2.5.5.13 - 0.0011 @ 10GHz 0.0016 Tg DMA IPC-TM-650 2.4.24.4 °C 230 Td TGA ASTM D3850 °C 410 CTE α1 (<Tg) IPC-TM-650 2.4.24 ppm/°C 18 α2 (>Tg) 50 Thermal Stress @ 288˚C (10s/Cycle) IPC-TM-650 2.4.13.1 Second >300 Thermal Conductivity ASTM D5470 W/mK 0.5 Peel Strength - 5μm (Plated to 20μm) IPC-TM-650 2.4.8 N/mm (lb/in) 0.61 (3.5) Tensile Modulus 40˚C IPC-TM-650 2.4.24.4 GPa 8~10 Moisture Absorption IPC-TM-650 2.6.2.1 % 0.08 Flammability (in Lab) UL-94 Rating V-0 All test data provided are typical and not intended to be specification values.
Availability RCC
RCC
Press Ply Thickness 25μ/50μ (0.0010”/0.0020”) Copper Foil Thickness (18μm Carrier Foil) 1.5μm/2.0μm/3.0μm/5.0μm Panel Size 610mmx457mm (24”x18”) RCC Part Numbers
Description Part Number pro-bond 8C RCC Cu 1.5μm Die 25μm 463H-C15-25 pro-bond 8C RCC Cu 2.0μm Die 25μm 463H-C20-25 pro-bond 8C RCC Cu 3.0μm Die 25μm 463H-C30-25 pro-bond 8C RCC Cu 5.0μm Die 25μm 463H-C50-25 pro-bond 8C RCC Cu 1.5μm Die 50μm 463H-C15-50 pro-bond 8C RCC Cu 2.0μm Die 50μm 463H-C20-50 pro-bond 8C RCC Cu 3.0μm Die 50μm 463H-C30-50 pro-bond 8C RCC Cu 5.0μm Die 50μm 463H-C50-50