• pro-bond 8C: Ultra Low Dk/Df Resin Coated Copper Bondply

    UL Approval: E214381 20/03/2024

    Resin Coated Copper (RCC) Bondply is an unreinforced adhesive system coated onto ultra-thin copper foil (1.5-5.0μm supported on an 18μm carrier foil) for use in high performance and high reliability multilayer PCB stack-ups.

    VT-463H is a high Tg, ceramic-filled, low Dk (2.9) & low Df (0.0016), halogen-free thermoset resin system, specifically designed for use in multilayer PCBs with Ventec tec-speed laminates & prepregs, and it is also fully compatible with other resin systems in hybrid stack-ups.

    General Information

    • Halogen free, Dk 2.9 & Df 0.0016
    • Ultra-thin dielectric layer
    • Suitable for sequential laminations
    • Unreinforced adhesive for better electrical isotropic consistency
    • Excellent flow characteristics and filling ability, designed for fine line and space
    • Laser drillable
    • Excellent laser hole pattern consistency

    Application

    • Interposers
    • Anti-shake Coils
    • Probe Cards
    • Embedded IC Substrates

    Storage Condition

    RCC
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F)
    Relative Humidity Below 55% RH /

    Properties

    Properties Test Method Units Typical Value
    Dk (RC 50%) @ 1GHz IPC-TM-650 2.5.5.13 - 3.2
    @ 10GHz 2.9
    Df @ 1GHz IPC-TM-650 2.5.5.13 - 0.0011
    @ 10GHz 0.0016
    Tg DMA IPC-TM-650 2.4.24.4 °C 230
    Td TGA ASTM D3850 °C 410
    CTE α1 (<Tg) IPC-TM-650 2.4.24 ppm/°C 18
    α2 (>Tg) 50
    Thermal Stress @ 288˚C (10s/Cycle) IPC-TM-650 2.4.13.1 Second >300
    Thermal Conductivity ASTM D5470 W/mK 0.5
    Peel Strength - 5μm (Plated to 20μm) IPC-TM-650 2.4.8 N/mm (lb/in) 0.61 (3.5)
    Tensile Modulus 40˚C IPC-TM-650 2.4.24.4 GPa 8~10
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.08
    Flammability (in Lab) UL-94 Rating V-0

    All test data provided are typical and not intended to be specification values.

    Availability RCC

    RCC

    Press Ply Thickness 25μ/50μ (0.0010”/0.0020”)
    Copper Foil Thickness (18μm Carrier Foil) 1.5μm/2.0μm/3.0μm/5.0μm
    Panel Size 610mmx457mm (24”x18”)

    RCC Part Numbers

    Description Part Number
    pro-bond 8C RCC Cu 1.5μm Die 25μm 463H-C15-25
    pro-bond 8C RCC Cu 2.0μm Die 25μm 463H-C20-25
    pro-bond 8C RCC Cu 3.0μm Die 25μm 463H-C30-25
    pro-bond 8C RCC Cu 5.0μm Die 25μm 463H-C50-25
    pro-bond 8C RCC Cu 1.5μm Die 50μm 463H-C15-50
    pro-bond 8C RCC Cu 2.0μm Die 50μm 463H-C20-50
    pro-bond 8C RCC Cu 3.0μm Die 50μm 463H-C30-50
    pro-bond 8C RCC Cu 5.0μm Die 50μm 463H-C50-50

    Download TDS Datasheet