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pro-bond 4C: Low Dk/Low Df Resin Coated Copper Bondply
UL Approval: E214381 23/03/2024Resin Coated Copper (RCC) Bondply is an unreinforced adhesive system coated onto ultra-thin copper foil (1.5-5.0μm supported on an 18μm carrier foil) for use in high performance and high reliability multilayer PCB stack-ups.
VT-464LT is a high Tg, ceramic-filled, low Dk (3.05) & low Df (0.0065), halogen-free thermoset resin system, specifically designed for use in multilayer PCBs with Ventec tec-speed laminates & prepregs, and it is also fully compatible with other resin systems in hybrid stack-ups.
General Information:
- Halogen free, Dk 3.05 & Df 0.0065
- Ultra-thin dielectric layer
- Suitable for sequential laminations
- Unreinforced adhesive for better electrical isotropic consistency
- Excellent flow characteristics and filling ability, designed for fine line and space
- Laser drillable
- Excellent laser hole pattern consistency
Application
- Interposers
- Probe Cards
- Anti-shake Coils
- Packaging Modules
Storage Condition
RCC Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F) Relative Humidity Below 55% RH / Properties
Properties Test Method Units Typical Value Dk (RC 50%) @ 1GHz IPC-TM-650 2.5.5.13 - 3.50 @ 10GHz 3.05 Df @ 1GHz IPC-TM-650 2.5.5.13 - 0.0050 @ 10GHz 0.0065 Tg DMA IPC-TM-650 2.4.24.4 °C 295 Td TGA ASTM D3850 °C 380 CTE α1 (<Tg) IPC-TM-650 2.4.24 ppm/°C 15.5 α2 (>Tg) 45 Thermal Stress @ 288˚C (10s/Cycle) IPC-TM-650 2.4.13.1 Second >300 Thermal Conductivity ASTM D5470 W/mK 0.5 Peel Strength - 5μm (Plated to 20μm) IPC-TM-650 2.4.8 N/mm (lb/in) 0.65 (3.7) Tensile Modulus 40˚C IPC-TM-650 2.4.24.4 GPa 9.2 Moisture Absorption IPC-TM-650 2.6.2.1 % 0.08 Flammability (in Lab) UL-94 Rating V-0 All test data provided are typical and not intended to be specification values.
Availability
Press Ply Thickness 25μ/50μ (0.0010”/0.0020”) Copper Foil Thickness (18μm Carrier Foil) 1.5μm/2.0μm/3.0μm/5.0μm Panel Size 610mmx457mm (24”x18”)