• VT-447C Laminate/Prepreg

    UL Approval: E214381 Version: 31/08/2024 /127/128/130

    General Information

    • Phenolic Cured System
    • Halogen Free & High Tg
    • FR15.1 & MOT 150˚C
    • CTI 600V
    • UV Blocking
    • High Voltage CAF Resistance
    • Low Z-CTE
    • Excellent Thermal Reliability

    Application

    PEV & HEV Automotive, BAPV, Instrumentation, Communication Equipment, Electronic Game Machine, White Goods, etc.

    Availability

    • Core Thickness: 0.004” (0.10mm) to .200” (5mm), available in sheet or panel form
    • Copper Foil: 1/2oz to 6oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 2116, 1080

    Storage Condition

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F) Room
    Relative Humidity Below 55% RH / /

    Properties

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg IPC-TM-650 2.4.25 °C 170 min 175
    Td ASTM D3850 °C 340 385
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >20
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >200
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 35
    After Tg ppm/°C 300 maximum 190
    Total Expansion (50~260°C) % 3.5 maximum 2.2
    MOT UL 746E °C - 150
    Electrical Properties
    Dk @ 1GHz IPC-TM-650 2.5.5.9 - 5.4 maximum 4.6
    Df @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.011
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+6 minimum 5.0E+8
    E-24/125 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 0 (>600)
    Arc Resistance ASTM D495 Second - 187
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 8 (1.4)
    After thermal stress 6 (1.05) minimum 8 (1.4)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 72 (500)
    Fill 50 (345) minimum 58 (400)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.18
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Download TDS Datasheet

  • VT-447C Laminate/Prepreg

    UL Approval: E214381 Version: 24/12/2024 /127/128/130

    Precautions In Handling

    Designing and Inner Layer Process

    • Please be careful when single ply of 1080 prepreg is designed to the dielectric layer.
    • VT-447C has weaker thermal resistance than regular VT-447. Please be very careful when 8L and higher
      layer count is designed or dielectric with single ply of 1080.
    • In order to satisfy CTI≥600V, 1 ply 2116 and 7628 or 2ply1080 is suggested to be used for outer layer.
    • Please be noticed that the surface roughness and clearness affects CTI rating 

    Storage and Shelf life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /
    Shelf Life 3 Months 6 Months 24 Months
    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

    Prepreg Availability

    G/F Type Resin Content Press Thickness (mil) Dk Df
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    7628 50% 8.00 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    7628 46% 7.50 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    2116 60% 5.40 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    2116 58% 5.00 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    1080 68% 3.10 4.30 4.30 4.20 4.20 0.012 0.012 0.013 0.013
    106 76% 2.3 4.1 4.1 4.0 4.0 0.013 0.013 0.014 0.014

    More types available upon request. When 2116PP or/and 1080PP is used as the outmost layer, 2-ply minimum is required to ensure CTI600. 2-ply 106 prepreg can only withstand CTI400V.

    Laminate Availablity

    Core Thickness Stack-up Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.004 1-2113 57% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.005 1-2116 55% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.006 1-1506 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.008 2-2113 57% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.008 1-7628 50% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.010 2-2116 55% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.012 2-1506 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.012 3-2113 57% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.015 2-7628 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.016 2-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012
    0.018 2-7628 + 1-1080 48% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012
    0.020 2-7628 + 1-2116 47% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012
    0.024 3-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012
    0.028 4-7628 42% 4.7 4.7 4.6 4.6 0.011 0.011 0.012 0.012
    0.030 4-7628 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.060 8-7628 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.110 15-7628 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012

    In order to satisfy CTI ≥600V, please don’t design 0.10mm in outer layer; More types could be available upon request.

    Press Condition

    1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥2.0ºC/min. 2. Curing Temperature & Time: >60min at more than 185ºC [Material Temperature]. Peak temperature: 200-205ºC 3. Full Pressure: ≥300psi and temperature to apply full pressure ≤80ºC 4. Vacuuming should be continued until over 140ºC [Material Temperature] VT-447C Press Condition.jpg

    Typical Drilling Condition

    Diameter Stack Height Spindle (KRPM) Infeed (mm/s) Retract (mm/s) Hit Count
    0.25mm 1 PNL/Stack 130 38 300 800
    0.30mm 1 PNL/Stack 130 38 300 800
    0.60mm 1 PNL/Stack 80 43 300 800

    1. Excessive wear of carbide drill bits. Diamond coated drill bits preferred; 2. LE Aluminum sheet and white phenolic entry board are preferred;

    Desmearing Process

    The de-smearing rate of VT-447C is less than regular VT-447. 1 time vertical de-smearing is preferred. Please examine hole wall to check de-smearing effect. Typical de-smearing rate for reference only:

    1x De-smearing Supplier Chemical
    0.27mg/cm2 Atotech Alkaline Permanganate

    Packaging and Baking Recommendation

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.  
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil  vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.
    Download PGL Datasheet