• VT-447C Laminate/Prepreg

    UL Approval: E214381 Version: 31/08/2024 /127/128/130

    General Information

    • Phenolic Cured System
    • Halogen Free & High Tg
    • FR15.1 & MOT 150˚C
    • CTI 600V
    • UV Blocking
    • High Voltage CAF Resistance
    • Low Z-CTE
    • Excellent Thermal Reliability

    Application

    PEV & HEV Automotive, BAPV, Instrumentation, Communication Equipment, Electronic Game Machine, White Goods, etc.

    Availability

    • Core Thickness: 0.004” (0.10mm) to .200” (5mm), available in sheet or panel form
    • Copper Foil: 1/2oz to 6oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 2116, 1080

    Storage Condition

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F) Room
    Relative Humidity Below 55% RH / /

    Properties

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg IPC-TM-650 2.4.25 °C 170 min 175
    Td ASTM D3850 °C 340 385
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >20
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >200
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 35
    After Tg ppm/°C 300 maximum 190
    Total Expansion (50~260°C) % 3.5 maximum 2.2
    MOT UL 746E °C - 150
    Electrical Properties
    Dk @ 1GHz IPC-TM-650 2.5.5.9 - 5.4 maximum 4.6
    Df @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.011
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+6 minimum 5.0E+8
    E-24/125 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 0 (>600)
    Arc Resistance ASTM D495 Second - 187
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 8 (1.4)
    After thermal stress 6 (1.05) minimum 8 (1.4)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 72 (500)
    Fill 50 (345) minimum 58 (400)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.18
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Download TDS Datasheet

  • VT-447C Laminate/Prepreg

    UL Approval: E214381 Version: 24/12/2024 /127/128/130

    Shelf life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /
    Shelf Life 3 Months 6 Months 24 Months

    Prepreg exceeding shelf life should be retested.

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Prepreg Availability

    G/F Type Resin Content Press Thickness (mil) Dk Df
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    7628 50% 8.00 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    7628 46% 7.50 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    2116 60% 5.40 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    2116 58% 5.00 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    1080 68% 3.10 4.30 4.30 4.20 4.20 0.012 0.012 0.013 0.013

    In order to satisfy CTI≥600V, 1 ply 2116 and 7628 or 2ply1080 is suggested to be used for outer layer. Remark: More types available upon request

    Laminate Availablity

    Core Thickness Stack-up Resin Content DK DF
    mm inches @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.100 0.004 1-2113 57% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.125 0.005 1-2116 55% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.20 0.008 2-2113 57% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.20 0.008 1-7628 50% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.25 0.010 2-2116 55% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.30 0.012 2-1506 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.30 0.012 3-2113 57% 4.50 4.50 4.40 4.40 0.012 0.012 0.013 0.013
    0.38 0.015 2-7628 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    0.76 0.030 4-7628 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    1.50 0.060 8-7628 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012
    2.80 0.110 15-7628 46% 4.60 4.60 4.50 4.50 0.011 0.011 0.012 0.012

    Remark: 1) Copper foil: Hoz~6oz 2) More types available upon request 3) In order to satisfy CTI≥600V，please don’t design 0.10mm in outer layer

    Baking Cycles During PCB Fabrication

    There are a few baking cycles during PCB fabrication. Please take into consideration when appropriate.

    Process Purpose Cycle
    After Cutting (for thin core below 10 mil) To get a stable dimension; To eliminate moisture 2~4 hours @ 150ºC
    Before Drill To get a stable dimension or full cure 1 hour @ 150ºC
    Before HASL To eliminate moisture 2 hours @ 125ºC
    After Routing To get a stable dimension 1 hour @ 150ºC
    Before OSP To prevent solder mask shelling 1 hour @ 140ºC
    Before shipment (stored for over 3 months) To eliminate moisture 2~4 hours @ 105ºC

    - Dimension stability is the better than Standard FR4 material. - For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use. - Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in. - After oxide, it is preferred to press them within 12 hours. Anyhow, not more than 24 hours.

    Pressing

    Item Hot Start Press
    Rate of Rise ≥2.0ºC/min
    Cure Time ≥185ºC 60~90min
    Max Temperature 200~205ºC
    Full Pressure ≥300 PSI
    Temperature to Apply Full Pressure Vacuuming should be continued until over 140ºC [Material Temperature] ≤80ºC

    Typical Press Cycle

    Picture1 VT-447C.png

    Typical Drilling Condition

    Diameter Stack Height Spindle (KRPM) Infeed (mm/s) Retract (mm/s) Hit Count
    0.25mm 1 PNL/Stack 130 38 300 800
    0.30mm 1 PNL/Stack 130 38 300 80
    0.60mm 1 PNL/Stack 80 43 300 800

    1. Excessive wear of carbide drill bits. Diamond coated drill bits preferred; 2. LE Aluminum sheet and white phenolic entry board are preferred;

    Desmearing Process

    The de-smearing rate of VT-447C is less than regular VT-447. 1 time vertical de-smearing is preferred. Please examine hole wall to check de-smearing effect. Typical de-smearing rate for reference only:

    1x De-smearing Supplier Chemical
    0.27mg/cm2 Atotech Alkaline Permanganate

    Download PGL Datasheet