Product Name Industry Approval Description
pro-bond 4C (VT-464LT RCC) Low Dk/Low Df Resin Coated Copper Bondply
pro-bond 7C & 7F (VT-770 RCC & RCF) Ultra Low Dk/Df Resin Coated Copper & Resin Coated Film Bondply
pro-bond 8C (VT-463H RCC) Ultra Low Dk/Df Resin Coated Copper Bondply
pro-bond 20F (VT-8728 RCF) Ultra Low Dk/Df Resin Coated Film Bondply
thermal-bond 3.0F (VT-4B3H RCF) Thermally Conductive Resin Coated Film Bondply
thermal-bond 5.0F (VT-4B7H RCF) Thermally Conductive Resin Coated Film Bondply

pro-bond & thermal-bond:

Flexible bondply materials for high-performance, high-reliability multilayer PCB stack-ups

Our range of pro-bond and thermal-bond bondply dielectrics are formulated for high-speed signal integrity with low losses and thermal management in ML PCB stack ups, needed for cutting-edge computing and networking applications such as high layer count multilayers, high-performance motherboards and server backplanes and cellular network power amplifiers.

The initial range includes Resin Coated Copper (RCC) and Resin Coated Film (RCF) bondply b-stage dielectric materials.

RCC bondply is an unreinforced adhesive system coated onto ultra-thin copper foil (1.5-5.0μm supported on an 18μm carrier foil) for use in high performance and high reliability multilayer PCB stack-ups.

RCF bondply is an unreinforced adhesive system coated onto PET film for use in high performance and high reliability multilayer PCB stack-ups.