• VT-463H Laminate/Prepreg

    UL Approval: E214381 Version: 20/07/2022

    General Information

    • Halogen Free & High Tg
    • Very Low Dk & Ultra Low Loss
    • Excellent Thermal Reliability

    Application

    • High Speed Network Equipment
    • IC Tester
    • High Frequency Measuring Instruments & Devices

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.030” (0.762mm), available in sheet or panel form
    • Copper Foil: 1/3oz to 3oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 2116, 3313, 1078, 1067, etc.
    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /91 /102

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DMA IPC-TM-650 2.4.24.4 °C 170 minimum 220
    TMA IPC-TM-650 2.4.24.4 °C 170 minimum 175
    Td ASTM D3850 °C 340 minimum 430
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >120
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 45
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 200
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.5 maximum 2.2
    Electrical Properties
    DK (RC 55%) @ 1GHz IPC-TM-650 2.5.5.9 - 5.2 maximum 3.7
    @ 10GHz Cavity Resonator - - 3.6
    DF (RC 55%) @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.0018
    @ 10GHz Cavity Resonator - - 0.0028
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1372 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance IPC-TM-650 2.5.1 Second - 195
    Mechanical Properties
    Peel Strength (HVLP 1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 4.5 (0.8)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) - 4.5 (0.8)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 80 (560)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 65 (450)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.10
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical values and not intended to be specification values.

    Published on: 20/07/2022

    Download TDS Datasheet

  • VT-463H Laminate/Prepreg

    UL Approval: E214381 Version: 03/02/2025

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
    Relative Humidity Below 55% / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Prepreg exceeding shelf life should be retested.

    Precautions in Handling

    • Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
    • Prepreg should be stored flat in a cool dry controlled environment 23ºC or less and 50% RH or less. Extended storage of prepreg should be at a reduced temperature of 5ºC.
    • Open bags of prepreg must be resealed. Prepreg should not be exposed to open environments for more than 8 hours total cumulatively under the above conditions or as agreed upon between user and supplier.
    • A first-in-first-out inventory system and a method to track material lot numbers through PWB processing and delivery of finished circuits is recommended.

     

    Designing and Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
    • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
    • Holding time between brown oxide and press process: best control within 6 hours.

    Prepreg Availability

    E-Glass styles: 2116, 3313, 1078, 106, etc.

    Delivered Thickness (Inches) Glass Style Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.0025 1067 72% 3.24 3.23 3.23 3.21 3.19 0.0014 0.0015 0.0017 0.0019 0.0021
    0.0028 1067 75% 3.18 3.17 3.17 3.15 3.13 0.0012 0.0013 0.0015 0.0017 0.0019
    0.003 1067 77% 3.16 3.16 3.16 3.12 3.11 0.0012 0.0013 0.0015 0.0017 0.0019
    0.0032 1078 67% 3.36 3.35 3.35 3.33 3.32 0.0017 0.0018 0.0023 0.0027 0.0029
    0.0035 1078 69% 3.32 3.32 3.31 3.3 3.28 0.0017 0.0018 0.0023 0.0027 0.0029
    0.0041 1078 73% 3.24 3.23 3.23 3.21 3.19 0.0014 0.0015 0.0017 0.0019 0.0021
    0.0039 3313 56% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
    0.0042 3313 59% 3.58 3.58 3.57 3.56 3.55 0.0019 0.002 0.0026 0.0029 0.0031
    0.0052 2116 56% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003

    Remark: ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.002 1067 1 69% 3.32 3.32 3.31 3.3 3.28 0.0017 0.0018 0.0023 0.0027 0.0029
    0.003 1078 1 65% 3.39 3.38 3.38 3.36 3.34 0.0017 0.0018 0.0023 0.0027 0.0029
    0.004 3313 1 57% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
    0.004 1067 2 69% 3.32 3.32 3.31 3.3 3.28 0.0017 0.0018 0.0023 0.0027 0.0029
    0.005 2116 1 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
    0.005 1067 2 72% 3.24 3.23 3.23 3.21 3.19 0.0014 0.0015 0.0017 0.0019 0.0021
    0.006 1078 2 65% 3.39 3.38 3.38 3.36 3.34 0.0017 0.0018 0.0023 0.0027 0.0029
    0.008 3313 2 57% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
    0.01 2116 2 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
    0.012 3313 3 57% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
    0.016 3313 4 57% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
    0.018 3312x2+ 2116x2 4 56% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
    0.02 2116 4 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
    0.025 2116 5 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
    0.03 2116 6 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
    0.059 1067 1 69% 3.32 3.32 3.31 3.3 3.28 0.0017 0.0018 0.0023 0.0027 0.0029

    More types could be available upon request.

    Press Condition

    1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥4ºC/min

    2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 80 ºC

    4. Vacuuming should be continued until over 140ºC [Material Temperature]

    5. Cushion for pressure evenness is needed

    VT-463H PressCondition.jpg

    Typical Drilling Parameters

    • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
    • Please adjust drilling parameters after checking qualities of through holes.
    • Suggest Drilling parameter as below:

     

    Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Chip Load (μm/rev) Hit Counts
    0.2 160 1.6~2.4 10~15 700~1000
    0.25 160 1.8~2.8 11~18 700~1000
    0.3 160 1.9~3.2 12~20 700~1000
    0.35 137 1.8~3.0 13~22 700~1000
    0.4 120 1.8~2.9 15~24 700~1000
    0.45 107 1.8~2.7 17~25 700~1000
    0.5 96 1.8~2.7 19~28 1400~2000
    0.55 87 1.8~2.6 21~30 1400~2000
    0.6 80 1.7~2.6 21~33 1400~2000
    0.65 74 1.7~2.6 23~35 1400~2000
    0.7 68 1.7~2.6 25~38 1400~2000
    0.75 64 1.6~2.6 25~41 1400~2000
    0.8 60 1.6~2.5 27~42 1400~2000
    0.85 56 1.6~2.4 29~43 1400~2000
    0.9 53 1.6~2.4 30~45 1400~2000

    Desmearing Process

    • Before using plasma or desmear, a post baking @150ºC for 120min is preferred. • 1 cycle Plasma and 1 cycle desmear is recommended. • Typical plasma conditions.

    Process Temperature ℃ Gas Mixture Power (W) Duration (min)
    Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

    Typical Chemical conditions. (Atotech chemical)

    Process Temperature ℃ Duration (min)
    Sewll 60-70 5-10
    Permanganate Oxidizer 70-80 10-15

    If use other chemical, please consult the chemical supplier for suggested conditions.

    Packaging and Baking Recommendation

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

     

    Download PGL Datasheet