• VT-464G Laminate/Prepreg

    UL Approval: E214381 Version: 02/12/2024 /130

    General Information

    • Halogen Free & High Tg
    • Very Low Dk & Very Low Loss
    • Excellent Thermal Reliability

    Application

    Servers, Storage, Switches, Routers, High Performance Computing, High Speed Network Equipment, etc.

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.030” (0.762mm), available in sheet or panel form
    • Copper Foil: 1/3oz to 2oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 3313, 2116, 1078, 1067, 106, etc
    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /130

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg TMA IPC-TM-650 2.4.24 °C 170 minimum 175
    DMA IPC-TM-650 2.4.24.4 200
    Td ASTM D3850 °C 340 minimum 400
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >30
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 35
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 200
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.5 maximum 2.1
    Electrical Properties
    DK (RC50%/70%) @ 1GHz IPC-TM-650 2.5.5.9 - 5.2 maximum 3.81
    @ 10GHz Cavity Resonator - - 3.62
    DF (RC50%/70%) @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.0031
    @ 10GHz Cavity Resonator - - 0.0050
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 6.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 6.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.4.17.1 MΩ 1.0E+4 minimum 6.0E+7
    E-24/125 IPC-TM-650 2.4.17.1 MΩ 10E+3 minimum 6.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1372 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance IPC-TM-650 2.5.1 Second 60 minimum 124
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 5.0 (0.88)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 5.0 (0.88)
    Flexural Modulus Warp IPC-TM-650 2.4.24.4 GPa 60 (415) minimum 80 (560)
    Fill IPC-TM-650 2.4.24.4 GPa 50 (345) minimum 65 (450)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.08
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical values and not intended to be specification values.

    Published on: 02/12/2024

    Download TDS Datasheet

  • VT-464 G Laminate/Prepreg

    UL Approval: E214381 Version: 03/02/2025 /130

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
    Relative Humidity Below 55% / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Prepreg exceeding shelf life should be retested.

    Precautions in Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing and Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
    • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
    • Holding time between brown oxide and press process: best control within 6 hours.

     

    Prepreg Availability

    E-Glass styles: 2116, 3313, 1078, 1067 ,etc.

    Delivered Thickness (Inches) Glass Style Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.002 1067 66% 3.61 3.57 3.5 3.43 3.36 0.0029 0.0033 0.0038 0.0047 0.0052
    0.0023 1067 70% 3.52 3.48 3.42 3.35 3.28 0.0028 0.0032 0.0036 0.0045 0.0049
    0.0025 1067 72% 3.49 3.45 3.39 3.32 3.25 0.0027 0.0031 0.0035 0.0044 0.0048
    0.003 1078 65% 3.63 3.59 3.52 3.45 3.38 0.0029 0.0033 0.0038 0.0047 0.0052
    0.0035 1078 69% 3.56 3.52 3.45 3.38 3.31 0.0029 0.0032 0.0037 0.0046 0.0051
    0.0045 3313 60% 3.74 3.69 3.62 3.55 3.48 0.003 0.0034 0.0039 0.0049 0.0054
    0.005 2116 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.002 1067 1 66% 3.61 3.57 3.5 3.43 3.36 0.0029 0.0033 0.0038 0.0047 0.0052
    0.0025 1067 1 72% 3.49 3.45 3.39 3.32 3.25 0.0027 0.0031 0.0035 0.0044 0.0048
    0.003 1078 1 65% 3.63 3.59 3.52 3.45 3.38 0.0029 0.0033 0.0038 0.0047 0.0052
    0.004 3313 1 57% 3.79 3.74 3.67 3.6 3.53 0.0031 0.0035 0.004 0.005 0.0055
    0.004 1067 2 66% 3.61 3.57 3.5 3.43 3.36 0.0029 0.0033 0.0038 0.0047 0.0052
    0.005 2116 1 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
    0.005 1067 2 72% 3.49 3.45 3.39 3.32 3.25 0.0027 0.0031 0.0035 0.0044 0.0048
    0.006 1078 2 65% 3.63 3.59 3.52 3.45 3.38 0.0029 0.0033 0.0038 0.0047 0.0052
    0.008 3313 2 57% 3.79 3.74 3.67 3.6 3.53 0.0031 0.0035 0.004 0.005 0.0055
    0.01 2116 2 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
    0.015 2116 3 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
    0.02 2116 4 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
    0.025 2116 5 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055
    0.03 2116 6 56% 3.81 3.76 3.69 3.62 3.55 0.0031 0.0035 0.004 0.005 0.0055

    More types could be available upon request.

    Press Condition

    1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥4ºC/min

    2. Curing Temperature & Time: >90min at more than 210ºC and peak temperature>215 ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

    4. Vacuuming should be continued until over 140ºC [Material Temperature]

    5. Cushion for pressure evenness is needed

     

    250203 VT-464G PRESS CONDITION.jpg

    Typical Drilling Parameters

    • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
    • Please adjust drilling parameters after checking qualities of through holes.
    • Suggest Drilling parameter as below:

     

    Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
    0.25 145 25 8~13 500
    1.0 53 31 30~45 1000

    Desmearing Process

    1. Before using plasma or desmear, a post baking @150ºC for 120min is preferred. 2. 1 cycle Plasma and 1 cycle desmear is recommended. 3. Typical plasma conditions:

    Process Temperature ℃ Gas Mixture Power (W) Duration (min)
    Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

    Typical Chemical conditions. (Atotech chemical)

    Process Temperature ℃ Duration (min)
    Sewll 60-70 5-10
    Permanganate Oxidizer 70-80 10-15

    If use other chemical, please consult the chemical supplier for suggested conditions.

    Packaging and Baking Recommendation

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

     

    Download PGL Datasheet