• VT-464H-PK Laminate/Prepreg

    UL Approval: E214381 Version: 23/10/2024 /130

    General Information

    • Halogen Free High Tg & Low CTE
    • Low Dk & Low Loss
    • Excellent Thermal Reliability

    Application

    Handheld Equipment, High Frequency & High Speed, Satellite Communication, Navigation, GPS, CPU, CSP, MCP, SD Card, DRAM, DDR, BGA, IC Packaging, etc.

    Availability

    • Core Thickness: 0.0012” (0.05mm) to 0.039” (1.0mm), available in sheet or panel form
    • Copper Foil: 1/7oz to 6oz
    • Prepregs are available in roll or panel form
    • E-Glass Styles: 7628, 1506, 2113, 3313, 2116, 1080, 1086, 1078, 106 & 1067, 1037, 1027, 1017, etc.

    Note: Note: It is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is ≈1-2lbs/in (0.35Kg/m) less than standard foil.

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /130

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DMA IPC-TM-650 2.4.24.4 °C 170 minimum 260
    Td ASTM D3850 °C 340 minimum 430
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >60
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 25~30
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 120~140
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.5 maximum 1.2~1.4
    XY-axis CTE IPC-TM-650 2.4.24 ppm/°C - 9/10
    Electrical Properties
    Dk (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 5.2 maximum 4.0
    @ 10GHz IPC-TM-650 2.5.5.13 - - 3.9
    Df (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.0050
    @ 10GHz IPC-TM-650 2.5.5.13 - - 0.0068
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second 60 minimum 195
    Mechanical Properties
    Peel Strength (RTF Hoz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 5.5 (0.96)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 5.0 (0.87) minimum 5.5 (0.96)
    Flexural Strength Warp IPC-TM-650 2.4.4 GPa - 24~26
    Fill IPC-TM-650 2.4.4 GPa - 23~25
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.12
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical values and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Published on: 23/10/2024

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  • VT-464 LT Laminate/Prepreg

    UL Approval: E214381 Version: 03/02/2025 /130

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
    Relative Humidity Below 55% / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Prepreg exceeding shelf life should be retested.

    Precautions in Handling

    • Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
    • Prepreg should be stored flat in a cool dry controlled environment 23ºC or less and 50% RH or less. Extended storage of prepreg should be at a reduced temperature of 5ºC.
    • Open bags of prepreg must be resealed. Prepreg should not be exposed to open environments for more than 8 hours total cumulatively under the above conditions or as agreed upon between user and supplier.
    • A first-in-first-out inventory system and a method to track material lot numbers through PCB processing and delivery of finished circuits is recommended.

     

    Designing and Inner Layer Process

    • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. A racked bake at 150 ºC for 120 minutes is preferred.
    • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
    • Holding time between brown oxide and press process: best control within 24 hours.

    Prepreg Availability

    Prepreg Type R/C (%) Delivered Thickness DK DF
    (μm) @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    1017 75% 25 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
    79% 30 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092
    1027 69% 35 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
    73% 40 3.63 3.58 3.58 3.54 3.50 0.0066 0.0069 0.0074 0.0084 0.0089
    75% 45 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
    1037 75% 50 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
    77% 55 3.58 3.53 3.53 3.48 3.44 0.0067 0.0070 0.0075 0.0085 0.0090
    79% 60 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092
    1067 74% 60 3.63 3.58 3.58 3.54 3.50 0.0066 0.0069 0.0074 0.0084 0.0089
    76% 65 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
    78% 72 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092
    1078 62% 69 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084
    64% 72 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084
    66% 77 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
    1086 66% 80 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
    68% 85 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
    3313 55% 93 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
    57% 100 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
    2116 53% 112 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077
    55% 119 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
    57% 125 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
    59% 136 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080

    Laminate Availablity

    Laminate Thickness (μm) Glass Style Piles Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    30 1027 1 65% 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
    50 1067 1 70% 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
    60 1078 1 59% 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080
    80 1086 1 63% 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084
    90 3313 1 53% 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077
    100 3313 1 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
    1067 2 70% 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
    110 2116 1 53% 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077
    125 1078 2 59% 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080
    2116 1 55% 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
    150 1086 2 63% 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084
    200 3313 2 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
    254 2116 2 55% 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
    305 3313 3 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079

    Press Condition

    1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥2.8ºC/min

    2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

    4. Cushion for pressure evenness is needed

    250203 VT-464LT PRESS CYCLE.jpg

    Typical Drilling Parameters

    • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
    • Please adjust drilling parameters after checking qualities of through holes.
    • Suggest Drilling parameter as below:

     

    Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
    0.25 145 25 8~13 500
    1.0 53 31 30~45 1000

    Desmearing Process

    • Please test desmear rate and check whether the smear is cleaned clearly by SEM , Ventec could provide the specimen for pilot. • 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear is recommended. • Holding time from desmear to PTH process: < 24 hours

    Packaging and Baking Recommendation

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

     

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