• VT-464 Laminate/Prepreg

    UL Approval: E214381 Version: 02/12/2024 /127/128/130

    General Information

    • Halogen Free
    • FR4.1
    • Mid Dk & Mid Loss
    • Excellent Thermal Reliability
    • Lead Free Process Compatible
    • High Tg
    • Ease of Manufacturing

     

     

    Application

    Server, Router, Satellite Communication, Storage, Backpanel, Navigation, etc

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form
    • Copper Foil: 1/4oz to 12oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106 & 1067, etc
    • Ability of Processing Copper Type: HTE, RTF, VLP & HVLP

     

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /127 /128 /130

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg TMA IPC-TM-650 2.4.24 °C 170 minimum 180
    DMA IPC-TM-650 2.4.24.4 °C 170 minimum 200
    Td ASTM D3850 °C 340 minimum 390
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >30
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 45
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 220
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.0 maximum 2.4
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL 94 °C - 130
    Electrical Properties
    Dk (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 5.2 maximum 3.9
    @ 10GHz IPC-TM-650 2.5.5.13 - - 3.8
    Df (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.0075
    @ 10GHz IPC-TM-650 2.5.5.13 - - 0.0095
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1372 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second 60 minimum 195
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 8.0 (1.40)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 8.0 (1.40)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 80 (560)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 65 (450)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.10
    Flammability UL-94 Rating V-0 V-0
    Halogen Free SGS - - Yes

    All test data provided are typical values and not intended to be specification values.

    Published on: 02/12/2024

    Download TDS Datasheet

  • VT-464 Laminate/Prepreg

    UL Approval: E214381 Version: 03/02/2025 /127/128/130

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Prepreg exceeding shelf life should be retested.

    Precautions in Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing and Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
    • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
    • Holding time between brown oxide and press process: best control within 6 hours.

     

    Prepreg Availability

    E-Glass styles: 7628, 2116, 2113, 1080, 106, etc.

    Delivered Thickness (Inches) Glass Style Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.002 106 72% 3.45 3.25 3.21 3.18 3.13 0.0101 0.0106 0.0112 0.0121 0.0126
    0.0024 106 76% 3.35 3.18 3.15 3.1 3.05 0.0104 0.0109 0.0113 0.0124 0.0129
    0.0031 1080 66% 3.55 3.5 3.44 3.37 3.32 0.0098 0.0101 0.0109 0.0116 0.0121
    0.0033 1080 68% 3.48 3.44 3.39 3.35 3.3 0.0100 0.0105 0.0110 0.0118 0.0123
    0.0038 2113 56% 3.82 3.76 3.72 3.62 3.57 0.0082 0.0085 0.0091 0.0102 0.0107
    0.0048 2116 54% 3.85 3.81 3.75 3.65 3.6 0.0078 0.0081 0.0088 0.0099 0.0104
    0.0051 2116 56% 3.82 3.76 3.72 3.62 3.57 0.0082 0.0085 0.0091 0.0102 0.0107
    0.0078 7628 45% 4.07 4.03 3.97 3.88 3.83 0.0067 0.007 0.0078 0.0088 0.0093
    0.0085 7628 48% 4.01 3.97 3.91 3.81 3.76 0.0068 0.0071 0.0079 0.0089 0.0094

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.002 1067 1 66% 3.55 3.5 3.44 3.37 3.32 0.0098 0.0101 0.0109 0.0116 0.0121
    0.0025 1078 1 57% 3.78 3.76 3.72 3.58 3.57 0.0086 0.0085 0.0091 0.0104 0.0107
    0.003 2112 1 53% 3.86 3.82 3.75 3.66 3.61 0.0078 0.0081 0.0088 0.0099 0.0104
    0.0035 2113 1 52% 3.86 3.82 3.75 3.66 3.61 0.0078 0.0081 0.0088 0.0099 0.0104
    0.004 2113 1 56% 3.82 3.76 3.72 3.62 3.57 0.0082 0.0085 0.0091 0.0102 0.0107
    0.005 2116 1 55% 3.85 3.79 3.75 3.65 3.6 0.0080 0.0083 0.0089 0.0100 0.0105
    0.006 2112 2 53% 3.86 3.82 3.75 3.66 3.61 0.0078 0.0081 0.0088 0.0099 0.0104
    0.007 2113 2 52% 3.86 3.82 3.75 3.66 3.61 0.0078 0.0081 0.0088 0.0099 0.0104
    0.008 2113 2 56% 3.82 3.76 3.72 3.62 3.57 0.0082 0.0085 0.0091 0.0102 0.0107
    0.01 2116 2 55% 3.85 3.79 3.75 3.65 3.6 0.0080 0.0083 0.0089 0.0100 0.0105
    0.012 1506 2 44% 4.13 4.09 4.03 3.94 3.89 0.0066 0.0069 0.0077 0.0087 0.0092
    0.014 7628 2 41% 4.22 4.18 4.12 4.03 3.98 0.0064 0.0067 0.0075 0.0085 0.0090
    0.015 7628 2 44% 4.13 4.09 4.03 3.94 3.89 0.0066 0.0069 0.0077 0.0087 0.0092
    0.016 7628 2 46% 4.07 4.03 3.97 3.88 3.83 0.0067 0.0070 0.0078 0.0088 0.0093
    0.021 7628 3 41% 4.22 4.18 4.12 4.03 3.98 0.0064 0.0067 0.0075 0.0085 0.0090
    0.022 7628 3 44% 4.13 4.09 4.03 3.94 3.89 0.0066 0.0069 0.0077 0.0087 0.0092
    0.024 7628 3 46% 4.07 4.03 3.97 3.88 3.83 0.0067 0.0070 0.0078 0.0088 0.0093

    More types could be available upon request.

    Press Condition

    1. Heating rate(Rise of Rate) of material [Material Temperature] Programmable Press: ≥3.0℃/min

    2. Curing Temperature & Time: >60min at more than 190ºC and peak temperature>195 ºC

    3. Full Pressure: ≥350psi (25Kg/cm2) should be applied full pressure before 80 ºC

    4. Vacuuming should be continued until over 140℃ [Material Temperature]  

    5. Cushion for pressure evenness is needed

    250203 VT-464 PressCondition.jpg

    Typical Drilling Parameters

    • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
    • Please adjust drilling parameters after checking qualities of through holes.
    • Suggest Drilling parameter as below:

    Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
    0.25 125 25 10~15 500
    1.0 53 31 30~45 800

    Desmearing Process

    1. Use 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear based upon customers’ process condition. 2. Please test desmear rate and check whether the smear is cleaned clearly by SEM , Ventec could provide the specimens. 3. Typical plasma conditions:

    Process Temperature ℃ Gas Mixture Power (W) Duration (min)
    Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

    Typical Chemical conditions. (Atotech chemical)

    Process Temperature ℃ Duration (min)
    Sewll 60-70 5-10
    Permanganate Oxidizer 70-80 10-15

    If use other chemical, please consult the chemical supplier for suggested conditions.

    Packaging and Baking Recommendation

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.
    Download PGL Datasheet