Datasheet

To Download Datasheets Select Below and Click Download

VT-901 Laminate / Prepreg

UL Approval: E214381 Version: 23/03/2024 /40/41/42/43

General Information

Tg 250℃
High Td 408℃
Low Z-axis CTE
Non-Brominated Chemistry

180507IPCLOGOWEBValidation-listed.jpg (1)

Application

Chip Manufacturers
Engine/Flight Controls
Power Supply/Backplane
Military & Aerospace
Burn-in Board
Downhole Drilling

Availability

Core Thickness: 0.002” (0.05mm) to 0.125” (3mm), available in sheet or panel form
Copper Foil: 1/4oz to 6oz
Prepregs are available in roll or panel form
E-Glass styles: 7628, 1506, 2113, 2313, 3313, 2116, 1080, 106 etc


Storage Condition	Temperature	Below 23°C (73°F)	Below 5°C (41°F)	Room
Storage Condition	Relative humidity	Below 55% RH	/	/
Shelf Life		3 months	6 months	24 months (airproof)

The prepreg exceeding shelf life should be retested.

Properties Sheet IPC-4101E /40 /41

Properties		Test Method	Units	Specification	Typical Value


Thermal Properties
Tg	DSC	IPC-TM-650 2.4.25	°C	-	-
Tg	TMA	IPC-TM-650 2.4.24	°C	200 minimum	250
Td		ASTM D3850	°C	-	408
T260		IPC-TM-650 2.4.24.1	Minute	-	>60
T288		IPC-TM-650 2.4.24.1	Minute	-	>60
Thermal Stress @ 288°C		IPC-TM-650 2.4.13.1	Second	Pass 10s	>1200
Z-axis CTE	Before Tg	IPC-TM-650 2.4.24	ppm/°C	-	50
	After Tg	IPC-TM-650 2.4.24	ppm/°C	-	145
	Total Expansion (50~260°C)	IPC-TM-650 2.4.24	%	-	1.2
X-Y CTE		IPC-TM-650 2.4.24	ppm/°C	-	11~12
MOT		UL 94	°C	-	140
Electrical Properties
Dielectric Constant @ 1GHz RC 40%		IPC-TM-650 2.5.5.9	-	5.4 maximum	4.05
Dissipation Factor @ 1GHz RC 40%		IPC-TM-650 2.5.5.9	-	0.035 maximum	0.012
Volume Resistivity	After Moisture Resistance	IPC-TM-650 2.4.17.1	MΩ-cm	1.0E+6 minimum	5.0E+8
Volume Resistivity	E-24/125	IPC-TM-650 2.5.17.1	MΩ-cm	1.0E+6 minimum	9.0E+8
Surface Resistivity	After Moisture Resistance	IPC-TM-650 2.5.17.1	MΩ	1.0E+6 minimum	5.0E+7
Surface Resistivity	E-24/204	IPC-TM-650 2.5.17.1	MΩ	1.0E+6 minimum	1.0E+8
Electrical Strength		IPC-TM-650 2.5.6.2	Volt/mil (KV/mm)	762 (30) minimum	1200~1400 (54)
Dielectric Breakdown		IPC-TM-650 2.5.6	KV	40 minimum	60
Comparative Tracking Index (CTI)		ASTM D3638	Rating (Volt)	-	Grade 4 (100~175)
Arc Resistance		ASTM D495	Second	120 minimum	150
Mechanical Properties
Peel Strength (1oz)	As received	IPC-TM-650 2.4.8	lb/in (N/mm)	-	6~9 (1.05~1.58)
Peel Strength (1oz)	After thermal stress	IPC-TM-650 2.4.8	lb/in (N/mm)	5.14 (0.90) minimum	6~9 (1.05~1.58)
Flexural Strength	Warp	IPC-TM-650 2.4.4	KPsi (MPa)	60 (415) minimum	87 (600)
Flexural Strength	Fill	IPC-TM-650 2.4.4	KPsi (MPa)	47 (325) minimum	72 (500)
Physical Properties
Moisture Absorption		IPC-TM-650 2.6.2.1	%	1.0 maximum	0.28
Flammability		UL-94	Rating	HB minimum	HB

Note: All test data provided are typical values and are not intended to be specification values.

Published on: 23/03/2024

Download TDS Datasheet

VT-90H CCL/Laminate VT-90H PP/Prepreg

UL Approval: E214381 Version: 21/02/2020 /40/41/42/43

Storage Condition & Shelf Life

		Prepreg		Laminate


Storage Condition	Temperature	< 23℃ (73℉)	< 5℃ (41℉)	Room
Storage Condition	Relative Humidity	< 55%	/	/
Shelf Life		3 Months	6 Months	24 Months

Prepreg exceeding shelf life should be retested.

Precautions In Handling

The prepreg exceeding shelf time should be retested.
Take care in handling thin core laminates as they are easily damaged.
If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

Designing And Inner Layer Process

Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
Dimension stability is the same as Standard FR4 material.
Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

Prepreg Availability

E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106, 1067 etc.

Prepreg Availability

PP Type	Resin Content	Press Thickness (mil)	DK				DF				Remark
PP Type	Resin Content	Press Thickness (mil)	@ 1GHz	@ 2GHz	@ 5GHz	@ 10GHz	@ 1GHz	@ 2GHz	@ 5GHz	@ 10GHz	Remark


7628	44%	8.00	4.30	4.25	4.25	4.20	0.011	0.011	0.012	0.012	Standard
7628	40%	7.30	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
1506	46%	6.80	4.25	4.20	4.20	4.15	0.011	0.011	0.012	0.012	Standard
2116	56%	5.40	3.98	3.93	3.93	3.88	0.012	0.012	0.013	0.013	Standard
2116	53%	5.10	4.10	4.05	4.02	3.97	0.011	0.011	0.012	0.012	Standard
2116	50%	4.70	4.15	4.10	4.10	4.05	0.011	0.011	0.012	0.012	Standard
2113	57%	4.30	3.98	3.93	3.93	3.88	0.012	0.012	0.013	0.013	Standard
1080	63%	3.10	3.72	3.67	3.67	3.62	0.012	0.012	0.013	0.013	Standard
1080	60%	2.80	3.80	3.75	3.75	3.70	0.012	0.012	0.013	0.013	Standard
106	70%	2.00	3.55	3.50	3.50	3.45	0.013	0.013	0.014	0.014	Standard

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

Core thk. (Inches)	Stack-up	Resin Content	DK				DF				Remark
Core thk. (Inches)	Stack-up	Resin Content	@ 1GHz	@ 2GHz	@ 5GHz	@ 10GHz	@ 1GHz	@ 2GHz	@ 5GHz	@ 10GHz	Remark


0.002	1-106	70%	3.55	3.50	3.50	3.45	0.013	0.013	0.014	0.014	Standard
0.003	1-1080	63%	3.72	3.67	3.67	3.62	0.012	0.012	0.013	0.013	Standard
0.0035	1-2113	49%	4.12	4.07	4.07	4.02	0.011	0.011	0.012	0.012	Standard
0.0035	2-1067	58%	3.98	3.93	3.93	3.88	0.012	0.012	0.013	0.013	2ply
0.004	1-2116	44%	4.30	4.25	4.25	4.20	0.011	0.011	0.012	0.012	Standard
0.004	2-1078	45%	4.30	4.25	4.25	4.20	0.011	0.011	0.012	0.012	2ply
0.005	1-2116	53%	4.10	4.05	4.02	3.97	0.012	0.012	0.013	0.013	Standard
0.005	2-1078	54%	4.10	4.05	4.02	3.97	0.012	0.012	0.013	0.013	2ply
0.006	1-1506	42%	4.35	4.30	4.30	4.25	0.010	0.010	0.011	0.011	Standard
0.006	2-1080	63%	3.72	3.67	3.67	3.62	0.012	0.012	0.013	0.013	2ply
0.007	1-7628	40%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.007	2-2113	48%	4.22	4.17	4.17	4.12	0.011	0.011	0.012	0.012	2ply
0.008	1-7628	44%	4.30	4.25	4.25	4.20	0.011	0.011	0.012	0.012	Standard
0.008	2-2116	44%	4.30	4.25	4.25	4.20	0.011	0.011	0.012	0.012	2ply
0.010	2-2116	53%	4.10	4.05	4.02	3.97	0.011	0.011	0.012	0.012	Standard
0.012	2-1506	42%	4.35	4.30	4.30	4.25	0.010	0.010	0.011	0.011	Standard
0.014	2-7628	40%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.014	3-2116	53%	4.10	4.05	4.02	3.97	0.011	0.011	0.012	0.012	Non-7628
0.016	2-7628	44%	4.30	4.25	4.25	4.20	0.011	0.011	0.012	0.012	Standard
0.018	2-7628+1-2116	40%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.020	2-7628+1-2116	41%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.024	3-7628	44%	4.30	4.25	4.25	4.20	0.011	0.011	0.012	0.012	Standard
0.028	4-7628	40%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.029	4-7628	41%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.031	4-7628	43%	4.33	4.28	4.28	4.23	0.010	0.010	0.011	0.011	Standard
0.036	5-7628	40%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.039	5-7628	43%	4.33	4.28	4.28	4.23	0.010	0.010	0.011	0.011	Standard
0.042	6-7628	40%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.045	6-7628	41%	4.38	4.33	4.33	4.28	0.010	0.010	0.011	0.011	Standard
0.049	7-7628	40%	4.40	4.35	4.35	4.30	0.010	0.010	0.011	0.011	Standard
0.059	8-7628	42%	4.35	4.30	4.30	4.25	0.010	0.010	0.011	0.011	Standard

Press Condition

1. Heating rate(Rise of Rate) of material [Material Temperature]
Programmable Press: 1.5-3.0℃/min (3~5℉/min). Manual Press:3~6℃ /min (5~10℉/min)

2. Curing Temperature & Time:

1)120~150min at more than 218℃(424℉) [Material Temperature] depending on total thickness. Boards thicker than 3 mm may need longer curing time.

2)For sequential lamination use 120 minutes for the first lamination and 150 minutes for the final. After pressing, Tg should be performed for further verification.

3. Full Pressure : ≥400psi

4. Vacuuming should be continued until over 200℃ (392℉) [Material Temperature]

5. Cold Press condition:
Keep Plate @ Room Temperature by water, Pressure:100psi, Keep Time:60minutes

Typical Drilling Parameters (φ0.3-1.0 mm)

Desmearing Process

1. Adjustments to the desmear process are necessary for the polyimide materials; 2. Check with your chemical supplier for recommendations.

Download PGL Datasheet

搜索…