VT-481 CCL/Laminate VT-481 PP/Prepreg

UL Approval: E214381 Version: 12/02/2025 /97/98/99/101

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
Relative Humidity < 55% / /
Shelf Life 3 Months 6 Months 24 Months

Prepreg exceeding shelf life should be retested.

Precautions In Handling

  • The prepreg exceeding shelf time should be retested.
  • Take care in handling thin core laminates as they are easily damaged.
  • If the pre-preg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing And Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Dimension stability is same as Normal FR4 material
  • Please check with your oxide vendor to make sure that our material is suitable with your oxide process.
    We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
  • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

 

Prepreg Availability

E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106, 1067 etc.

PP Type Resin Content Press Thickness (mil) DK DF Remark
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
7628 48% 8.0 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
7628 46% 7.6 4.34 4.29 4.24 4.24 0.014 0.014 0.015 0.016 Standard
1506 52% 7.1 4.21 4.16 4.11 4.11 0.015 0.015 0.016 0.017 Standard
2116 55% 4.8 4.13 4.05 4.00 4.00 0.015 0.015 0.016 0.017 Standard
2116 52% 4.5 4.21 4.16 4.11 4.11 0.015 0.015 0.016 0.017 Standard
2113 57% 3.8 4.08 4.03 3.98 3.98 0.016 0.016 0.017 0.018 Standard
1080 68% 3.3 3.81 3.76 3.71 3.71 0.018 0.018 0.019 0.020 Standard
1080 66% 3.1 3.87 3.82 3.77 3.77 0.017 0.017 0.018 0.019 Standard
106 76% 2.4 3.55 3.50 3.45 3.45 0.019 0.019 0.020 0.021 Standard

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated pre-preg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

Core thk. (Inches) Stack-up Resin Content DK DF Remark
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
0.002 1-1067 66% 3.87 3.82 3.77 3.77 0.017 0.017 0.018 0.019 Preferred
0.002 1-106 72% 3.70 3.65 3.60 3.60 0.018 0.018 0.019 0.020 Standard
0.003 1-2112 50% 4.23 4.18 4.13 4.13 0.015 0.016 0.016 0.017 Preferred
0.003 1-1080 66% 3.87 3.82 3.77 3.77 0.017 0.017 0.018 0.019 Standard
0.004 1-2116 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
0.004 2-1067 66% 3.87 3.82 3.77 3.77 0.017 0.017 0.018 0.019 2ply preferred
0.004 2-106 72% 3.70 3.65 3.60 3.60 0.018 0.018 0.019 0.020 2ply
0.005 1-2116 55% 4.13 4.05 4.00 4.00 0.015 0.015 0.016 0.017 Standard
0.006 1-1506 45% 4.35 4.30 4.25 4.25 0.014 0.014 0.015 0.016 Standard
0.007 1-7628 41% 4.45 4.38 4.30 4.30 0.014 0.014 0.015 0.016 Standard
0.008 1-7628 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
0.008 2-2116 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 2ply
0.010 2-2116 55% 4.13 4.05 4.00 4.00 0.015 0.015 0.016 0.017 Standard
0.012 2-1506 45% 4.35 4.30 4.25 4.25 0.014 0.014 0.015 0.016 Standard
0.014 2-7628 41% 4.45 4.38 4.30 4.30 0.014 0.014 0.015 0.016 Standard
0.016 2-7628 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
0.018 2-7628 + 1-1080 47% 4.27 4.22 4.17 4.17 0.014 0.014 0.015 0.016 Standard
0.020 2-7628 + 1-2116 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
0.024 3-7628 42% 4.43 4.36 4.29 4.29 0.014 0.014 0.015 0.016 Standard
0.028 4-7628 41% 4.45 4.38 4.30 4.30 0.014 0.014 0.015 0.016 Standard
0.036 5-7628 43% 4.41 4.35 4.28 4.28 0.014 0.014 0.015 0.016 Standard
0.039 5-7628 43% 4.41 4.35 4.28 4.28 0.014 0.014 0.015 0.016 Standard
0.042 6-7628 42% 4.43 4.36 4.29 4.29 0.014 0.014 0.015 0.016 Standard
0.045 6-7628 46% 4.30 4.25 4.20 4.20 0.014 0.014 0.015 0.016 Standard
0.049 7-7628 41% 4.45 4.38 4.30 4.30 0.014 0.014 0.015 0.016 Standard
0.059 8-7628 44% 4.38 4.32 4.25 4.25 0.014 0.014 0.015 0.016 Standard

Press Condition

1.  Heating rate (Rise of Rate) of material [Material Temperature]:
     Programmable Press: 1.5-3.0ºC/min (3~5ºF/min). Manual Press: 3~6ºC /min (5~10ºF/min)
2.  Curing Temperature & Time: >60min at more than 180ºC (365ºF); [Material Temperature].
3.  Full Pressure: ≥250-300psi
4.  Vacuuming should be continued until over 140ºC (284ºF) [Material Temperature]
5.  Cold Press condition: Keep Plate @ Room Temperature by water; Pressure:100psi; Keep Time: 60minutes

481 PC-1.png 481 PC-2.png 481 PC-3.png

Typical Drilling Parameters

Hole Size (mm) Spindle Speed (KRPM) Feed Rate (IPM) Retract Rate (IPM) Chip Load (Mil/Rev)
0.20~0.25 150 110 700 0.73
0.30~0.35 150 130 700 0.87
0.40~0.55 120 130 900 1.08
0.60~0.65 80 80 900 1.00
0.70~1.00 70 80 900 1.14
1.10~1.25 60 80 900 1.33
1.30~1.35 55 80 900 1.45
1.40~1.45 50 80 600 1.60
1.50~1.80 45 80 600 1.78
2.05~3.00 30 80 500 2.67

The use of undercut drill bits has yielded better quality on smaller holes. Check with you drill bit supplier for more information.

Desmearing Process

1. Desmear rate is less than that of the conventional FR4; 2. Adjustments to the desmear process are necessary for the lead-free materials; 3. Check with your chemical supplier for recommendations.

Packaging and Baking Recommendations

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil  vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before use.

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