• VT-47LT Prepreg

    UL Approval: E214381 Version: 25/02/2025 /126

    General Information

    • High Tg, Low CTE
    • High Reliability for HDI Designs
    • Better Dimensional Stability

    Application

    • Any-layer HDI Designs
    • Sequential Laminations
    • Automotive
    • Power System
    • Server

    Availability

    • Prepregs are available in roll or panel form
    • E-Glass styles: 1078, 1067 and 1037

    Glass Type R/C % Pressed Thickness DK DF
    mil μm @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    1037 70 1.7 43 4.00 3.95 3.90 3.79 0.013 0.015 0.016 0.017
    1037 72 1.8 46 3.96 3.91 3.86 3.75 0.014 0.016 0.017 0.018
    *1037 74 2.0 51 3.92 3.87 3.82 3.71 0.014 0.016 0.017 0.018
    1037 76 2.2 56 3.88 3.83 3.78 3.67 0.014 0.016 0.017 0.018
    1037 78 2.3 58 3.84 3.79 3.74 3.63 0.014 0.016 0.017 0.018
    1067 70 2.2 56 4.00 3.95 3.90 3.79 0.013 0.015 0.016 0.017
    1067 72 2.4 61 3.96 3.91 3.86 3.75 0.014 0.016 0.017 0.018
    *1067 74 2.5 64 3.92 3.87 3.82 3.71 0.014 0.016 0.017 0.018
    1067 76 2.8 71 3.88 3.83 3.78 3.67 0.014 0.016 0.017 0.018
    1067 78 2.9 74 3.84 3.79 3.74 3.63 0.014 0.016 0.017 0.018
    *1078 66 3.0 76 4.08 4.03 3.98 3.87 0.013 0.015 0.016 0.017
    1078 68 3.2 81 4.04 3.99 3.94 3.83 0.013 0.015 0.016 0.017
    1078 70 3.4 86 4.00 3.95 3.90 3.79 0.013 0.015 0.016 0.017
    1078 72 3.6 91 3.96 3.91 3.86 3.75 0.014 0.016 0.017 0.018

    *Standard Availability

    Storage Condition

    Properties Prepreg
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F)
    Relative Humidity Below 55% RH /
    Shelf Life 3 months 6 months

    The prepreg exceeding shelf life should be retested.

    Properties

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DMA IPC-TM-650 2.4.24.4 °C 170 minimum 215
    DSC IPC-TM-650 2.4.25 °C 170 minimum 195
    TMA IPC-TM-650 2.4.24 °C 170 minimum 185
    Td @5%weight loss ASTM D3850 °C 340 minimum 360
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >60
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 25
    After Tg ppm/°C 300 maximum 130
    Total Expansion (50~260°C) % 3.0 maximum 1.5
    XY-axis CTE IPC-TM-650 2.4.24.5 °ppm/˚C - 10/12
    Electrical Properties
    Dk (RC 50%) @ 1GHz Cavity Resonator - 5.2 maximum 4.4
    @ 10GHz Cavity Resonator - 5.2 maximum 4.2
    Df (RC 50%) @ 1GHz Cavity Resonator - 0.035 maximum 0.011
    @ 10GHz Cavity Resonator - 0.035 maximum 0.015
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 7.0E+8
    E-24/125 1.0E+3 minimum 8.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 7.0E+7
    E-24/125 1.0E+3 minimum 8.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second 60 minimum 195
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 8.0 (1.4)
    After thermal stress 6.0 (1.05) minimum 8.0 (1.4)
    Flexural Modulus Warp IPC-TM-650 2.4.2.4 MPa - 650
    Fill - 550
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.10
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Download TDS Datasheet

  • VT-47LT Prepreg

    UL Approval: E214381 Version: 27/03/2025 /126

    Storage Condition & Shelf Life

    Prepreg
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉)
    Relative Humidity < 55% /
    Shelf Life 3 Months 6 Months

    Prepreg exceeding shelf life should be retested.

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing And Inner Layer Process

    • Please be careful when single ply of 1037, 1067 or 1078 prepreg is designed to the dielectric layer.
    • Dimension stability is the same as Standard FR4 material.
    • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.

    Prepreg Availability

    E-Glass styles: 1078, 1067, 1037 etc.

    PP Type Resin Content Press Thickness Dk DF
    mil μm @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    1037 70 1.7 43 4.00 3.95 3.90 3.79 0.013 0.015 0.016 0.017
    1037 72 1.8 46 3.96 3.91 3.86 3.75 0.014 0.016 0.017 0.018
    *1037 74 2.0 51 3.92 3.87 3.82 3.71 0.014 0.016 0.017 0.018
    1037 76 2.2 56 3.88 3.83 3.78 3.67 0.014 0.016 0.017 0.018
    1037 78 2.3 58 3.84 3.79 3.74 3.63 0.014 0.016 0.017 0.018
    1067 70 2.2 56 4.00 3.95 3.90 3.79 0.013 0.015 0.016 0.017
    1067 72 2.4 61 3.96 3.91 3.86 3.75 0.014 0.016 0.017 0.018
    *1067 74 2.5 64 3.92 3.87 3.82 3.71 0.014 0.016 0.017 0.018
    1067 76 2.8 71 3.88 3.83 3.78 3.67 0.014 0.016 0.017 0.018
    1067 78 2.9 74 3.84 3.79 3.74 3.63 0.013 0.016 0.017 0.018
    *1078 66 3.0 76 4.08 4.03 3.98 3.87 0.013 0.015 0.016 0.017
    1078 68 3.2 81 4.04 3.99 3.94 3.83 0.013 0.015 0.016 0.017
    1078 70 3.4 86 4.00 3.95 3.90 3.79 0.013 0.015 0.016
    1078 72 3.6 91 3.96 3.91 3.86 3.75 0.014 0.016 0.017

    * Standard Availability ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated pre-preg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Press Condition

    1. Heating rate(Rise of Rate) of material [Material Temperature] Programmable Press: 2~4℃/min (4~7℉/min).  Manual Press:3~6℃ /min (5~10℉/min)

    2. Curing Temperature & Time: >60min at more than 190℃ (374℉)[Material Temperature]

    3. Full Pressure : ≥300psi

    4. Vacuuming should be continued until over 140℃ (284℉) [Material Temperature]  

    5. Cold Press condition: Keep Plate @ Room Temperature by water, Pressure:100psi, Keep Time:60minutes

    Hot Start Cycle VT-47LT.jpg

    Typical Drilling Parameters

    Diameter (mm) Spindle Speed (KRPM) Feed Rate (IPM) Retract Rate (IMP) Chip Load (mil/rev)
    0.20~0.25 135 75 791 0.56
    0.30~0.35 155 120 984 0.77
    0.40~0.45 120 125 900 1.04
    0.50~0.55 95 90 700 0.95
    0.60~0.65 80 110 765 1.38
    0.70~0.75 72 120 765 1.67
    0.80~0.95 68 120 850 1.76
    1.00~1.05 60 140 984 2.33
    1.10~1.15 54 150 984 2.78
    1.20~1.25 52 160 984 3.08
    1.30~1.45 50 150 984 3.00
    1.50~1.55 45 130 984 2.89
    1.60~1.75 40 120 800 3.00
    1.80~2.00 35 80 600 2.29
    2.05~2.45 30 80 500 2.67
    2.50~2.75 25 70 500 2.80
    2.80~3.20 20 60 500 3.00
    3.20~3.60 20 60 500 3.00
    3.65~4.00 20 35 500 1.75
    4.50~4.80 20 25 400 1.25
    4.81~6.50 20 20 300 1.00

    Desmearing Process

    Standard FR4 Desmear Process.

    Packing and Baking Recommendations

    • Desmear rate is less than that of the conventional FR4.
    • Adjustments to the desmear process are necessary for the lead-free materials.
    • Check with your chemical supplier for recommendations.
    Download PGL Datasheet