• VT-447V Laminate/Prepreg

    UL Approval: E214381 Version: 30/01/2024 /127/128/130/154

    General Information

    • Phenolic Cured System
    • Halogen free
    • High Td & High Tg (190℃)
    • FR15.1 & MOT 150℃
    • CAF Resistance
    • Low Z-CTE
    • Excellent Thermal Reliability
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    Application

    Automotive, Mobile Phone, Smart Phone, Automotive, High Power Application, Server, Computer, Communication Equipment, Instrumentation, Electronic Game Machine, VCR, etc.

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form
    • Copper Foil: 1/4oz to 12oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 1506, 2113, 2116, 1080, 1086, 1078, 106,1067,1037 & 1027 etc

    Note: For cores ≤ 0.005”, it is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is ≈1-2lbs/in (0.35Kg/m) less than standard foil.

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E WAM1 /127 /128 /130 /154

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DSC IPC-TM-650 2.4.25 °C - 190
    TMA IPC-TM-650 2.4.24 °C 170 minimum 180
    Td ASTM D3850 °C 340 minimum 390
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >60
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 40
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 165
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.0 maximum 1.8
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL-746E °C - 150
    Electrical Properties
    DK @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 5.4 maximum 4.40
    DF @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 0.035 maximum 0.012
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second - 195
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 7~9 (1.2~1.6)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 7~9 (1.2~1.6)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 87 (600)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 77 (530)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.12
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical values and are not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Published on: 30/01/2024

    Download TDS Datasheet

  • VT-447V CCL/Laminate VT-447V PP/Prepreg

    UL Approval: E214381 Version: 19/12/2024 /127/128/130/154

    Shelf life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Prepreg exceeding shelf life should be retested.

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing And Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Dimension stability is the same as Standard FR4 material.
    • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
    • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

     

    Prepreg Availability

    E-Glass styles: 7628, 2116, 2113, 1087, 1080, 1067, 106, 1037, 1027, etc.

    Prepreg Availability

    PP Type Resin Content Press Thickness (mil) DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    7628 48% 7.90 4.46 4.36 4.31 4.31 0.012 0.013 0.013 0.014
    7628 45% 7.50 4.52 4.42 4.37 4.37 0.012 0.013 0.013 0.014
    2116 57% 4.90 4.20 4.10 4.05 4.05 0.013 0.014 0.014 0.015
    2116 55% 4.70 4.25 4.15 4.10 4.10 0.013 0.014 0.014 0.015
    2116 53% 4.40 4.30 4.20 4.15 4.15 0.013 0.014 0.014 0.015
    2113 57% 3.90 4.20 4.10 4.05 4.05 0.013 0.014 0.014 0.015
    1086 67% 3.50 3.95 3.85 3.80 3.80 0.014 0.015 0.015 0.016
    1086 69% 3.80 3.90 3.80 3.75 3.75 0.014 0.015 0.015 0.016
    1080 68% 3.20 3.93 3.83 3.78 3.78 0.014 0.015 0.015 0.016
    1080 66% 3.00 3.98 3.88 3.83 3.83 0.014 0.015 0.015 0.016
    1080 64% 2.7 4.03 3.93 3.88 3.88 0.014 0.015 0.015 0.016
    1078 67% 3.00 3.95 3.85 3.80 3.80 0.014 0.015 0.015 0.016
    1078 69% 3.20 3.90 3.80 3.75 3.75 0.014 0.015 0.015 0.016
    106 73% 2.20 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
    106 75% 2.40 3.75 3.65 3.60 3.60 0.014 0.015 0.015 0.016
    1067 72% 2.00 3.83 3.73 3.68 3.68 0.014 0.015 0.015 0.016
    1067 74% 2.40 3.78 3.68 3.63 3.63 0.015 0.016 0.016 0.017
    1067 78% 2.80 3.69 3.59 3.54 3.54 0.015 0.016 0.016 0.017
    1037 73% 1.80 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
    1037 75% 2.00 3.75 3.65 3.60 3.60 0.015 0.016 0.016 0.017
    1027 71% 1.50 3.85 3.75 3.70 3.70 0.014 0.015 0.015 0.016
    1027 73% 1.60 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
    1027 75% 1.80 3.75 3.65 3.60 3.60 0.015 0.016 0.016 0.017

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

    Laminate Availability

    Core thk. (Inches) Stack-up Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.002 1-1067 65% 3.85 3.75 3.70 3.70 0.015 0.016 0.016 0.017
    0.003 1-2112 52% 4.13 4.08 4.03 4.03 0.013 0.014 0.014 0.015
    0.004 1-2116 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015
    0.004 2-1067 65% 3.85 3.75 3.70 3.70 0.015 0.016 0.016 0.017
    0.005 1-2116 55% 4.04 3.99 3.94 3.94 0.014 0.015 0.015 0.016
    0.006 1-1506 45% 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014
    0.007 1-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014
    0.008 1-7628 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015
    0.008 2-2116 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015
    0.010 2-2116 55% 4.04 3.99 3.94 3.94 0.014 0.015 0.015 0.016
    0.012 2-1506 45% 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014
    0.015 2-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
    0.021 3-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
    0.024 3-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
    0.028 4-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
    0.031 4-7628 44% 4.55 4.45 4.40 4.40 0.011 0.012 0.012 0.013
    0.036 5-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
    0.045 6-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
    0.049 7-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
    0.056 8-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
    0.059 8-7628 44% 4.55 4.45 4.40 4.40 0.011 0.012 0.012 0.013

    Press Condition

    1. Heating rate(Rise of Rate) of material [Material Temperature]
    Programmable Press: ≥3.0ºC/min

    2. Curing Temperature & Time: >60min at more than 190ºC and peak temperature >200ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 80ºC

    4. Vacuuming should be continued until over 140ºC [Material Temperature]

    5. Cushion for pressure evenness is needed.

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    Typical Drilling Parameters

    - Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc - Please adjust drilling parameters after checking qualities of through holes - Suggest Drilling parameter as below:

    Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Chip Load (um/rev) Hit Counts
    0.25 125 25 10~15 500
    1.00 53 31 30~45 800

    Desmearing Process

    - Please test desmear rate and check whether the smear is cleaned clearly by SEM, Ventec could provide the specimen for pilot. - 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear is recommended. - Holding time from desmear to PTH process: < 2 hours
    Download PGL Datasheet