Datasheet

To Download Datasheets Select Below and Click Download

VT-447V Laminate/Prepreg

UL Approval: E214381 Version: 30/01/2024 /127/128/130/154

General Information

Phenolic Cured System
Halogen free
High Td & High Tg (190℃)
FR15.1 & MOT 150℃
CAF Resistance
Low Z-CTE
Excellent Thermal Reliability

180507IPCLOGOWEBValidation-listed.jpg (1)

Application

Automotive, Mobile Phone, Smart Phone, Automotive, High Power Application, Server, Computer, Communication Equipment, Instrumentation, Electronic Game Machine, VCR, etc.

Availability

Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form
Copper Foil: 1/4oz to 12oz
Prepregs are available in roll or panel form
E-Glass styles: 7628, 1506, 2113, 2116, 1080, 1086, 1078, 106,1067,1037 & 1027 etc

Note: For cores ≤ 0.005”, it is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is ≈1-2lbs/in (0.35Kg/m) less than standard foil.


Storage Condition	Temperature	Below 23°C (73°F)	Below 5°C (41°F)	Room
Storage Condition	Relative humidity	Below 55% RH	/	/
Shelf Life		3 months	6 months	24 months (airproof)

The prepreg exceeding shelf life should be retested.

Properties Sheet IPC-4101E WAM1 /127 /128 /130 /154

Properties		Test Method	Units	Specification	Typical Value


Thermal Properties
Tg	DSC	IPC-TM-650 2.4.25	°C	-	190
Tg	TMA	IPC-TM-650 2.4.24	°C	170 minimum	180
Td		ASTM D3850	°C	340 minimum	390
T260		IPC-TM-650 2.4.24.1	Minute	30 minimum	>60
T288		IPC-TM-650 2.4.24.1	Minute	15 minimum	>60
Thermal Stress @ 288°C		IPC-TM-650 2.4.13.1	Second	Pass 10s	>600
Z-axis CTE	Before Tg	IPC-TM-650 2.4.24	ppm/°C	60 maximum	40
	After Tg	IPC-TM-650 2.4.24	ppm/°C	300 maximum	165
	Total Expansion (50~260°C)	IPC-TM-650 2.4.24	%	3.0 maximum	1.8
X-Y CTE		IPC-TM-650 2.4.24	ppm/°C	-	11~13
MOT		UL-746E	°C	-	150
Electrical Properties
DK @ 1GHz RC 50%		IPC-TM-650 2.5.5.9	-	5.4 maximum	4.40
DF @ 1GHz RC 50%		IPC-TM-650 2.5.5.9	-	0.035 maximum	0.012
Volume Resistivity	After Moisture Resistance	IPC-TM-650 2.5.17.1	MΩ-cm	1.0E+4 minimum	5.0E+8
Volume Resistivity	E-24/125	IPC-TM-650 2.5.17.1	MΩ-cm	1.0E+3 minimum	5.0E+6
Surface Resistivity	After Moisture Resistance	IPC-TM-650 2.5.17.1	MΩ	1.0E+4 minimum	5.0E+7
Surface Resistivity	E-24/125	IPC-TM-650 2.5.17.1	MΩ	1.0E+3 minimum	5.0E+6
Electrical Strength		IPC-TM-650 2.5.6.2	Volt/mil (KV/mm)	762 (30) minimum	1200~1400 (54)
Dielectric Breakdown		IPC-TM-650 2.5.6	KV	40 minimum	60
Comparative Tracking Index (CTI)		ASTM D3638	Rating (Volt)	-	Grade 3 (175~250)
Arc Resistance		ASTM D495	Second	-	195
Mechanical Properties
Peel Strength (1oz)	As received	IPC-TM-650 2.4.8	lb/in (N/mm)	-	7~9 (1.2~1.6)
Peel Strength (1oz)	After thermal stress	IPC-TM-650 2.4.8	lb/in (N/mm)	6 (1.05) minimum	7~9 (1.2~1.6)
Flexural Strength	Warp	IPC-TM-650 2.4.4	KPsi (MPa)	60 (415) minimum	87 (600)
Flexural Strength	Fill	IPC-TM-650 2.4.4	KPsi (MPa)	50 (345) minimum	77 (530)
Physical Properties
Moisture Absorption		IPC-TM-650 2.6.2.1	%	0.80 maximum	0.12
Flammability		UL-94	Rating	V-0 minimum	V-0

All test data provided are typical values and are not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

Published on: 30/01/2024

Download TDS Datasheet

VT-447V CCL/Laminate VT-447V PP/Prepreg

UL Approval: E214381 Version: 19/12/2024 /127/128/130/154

Shelf life

		Prepreg		Laminate


Storage Condition	Temperature	< 23℃ (73℉)	< 5℃ (41℉)	Room
Storage Condition	Relative Humidity	< 55%	/	/
Shelf Life		3 Months	6 Months	24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions In Handling

The prepreg exceeding shelf time should be retested.
Take care in handling thin core laminates as they are easily damaged.
If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

Designing And Inner Layer Process

Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
Dimension stability is the same as Standard FR4 material.
Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

Prepreg Availability

E-Glass styles: 7628, 2116, 2113, 1087, 1080, 1067, 106, 1037, 1027, etc.

Prepreg Availability

PP Type	Resin Content	Press Thickness (mil)	DK				DF
PP Type	Resin Content	Press Thickness (mil)	@ 1GHz	@ 2GHz	@ 5GHz	@ 10GHz	@ 1GHz	@ 2GHz	@ 5GHz	@ 10GHz


7628	48%	7.90	4.46	4.36	4.31	4.31	0.012	0.013	0.013	0.014
7628	45%	7.50	4.52	4.42	4.37	4.37	0.012	0.013	0.013	0.014
2116	57%	4.90	4.20	4.10	4.05	4.05	0.013	0.014	0.014	0.015
2116	55%	4.70	4.25	4.15	4.10	4.10	0.013	0.014	0.014	0.015
2116	53%	4.40	4.30	4.20	4.15	4.15	0.013	0.014	0.014	0.015
2113	57%	3.90	4.20	4.10	4.05	4.05	0.013	0.014	0.014	0.015
1086	67%	3.50	3.95	3.85	3.80	3.80	0.014	0.015	0.015	0.016
1086	69%	3.80	3.90	3.80	3.75	3.75	0.014	0.015	0.015	0.016
1080	68%	3.20	3.93	3.83	3.78	3.78	0.014	0.015	0.015	0.016
1080	66%	3.00	3.98	3.88	3.83	3.83	0.014	0.015	0.015	0.016
1080	64%	2.7	4.03	3.93	3.88	3.88	0.014	0.015	0.015	0.016
1078	67%	3.00	3.95	3.85	3.80	3.80	0.014	0.015	0.015	0.016
1078	69%	3.20	3.90	3.80	3.75	3.75	0.014	0.015	0.015	0.016
106	73%	2.20	3.80	3.70	3.65	3.65	0.014	0.015	0.015	0.016
106	75%	2.40	3.75	3.65	3.60	3.60	0.014	0.015	0.015	0.016
1067	72%	2.00	3.83	3.73	3.68	3.68	0.014	0.015	0.015	0.016
1067	74%	2.40	3.78	3.68	3.63	3.63	0.015	0.016	0.016	0.017
1067	78%	2.80	3.69	3.59	3.54	3.54	0.015	0.016	0.016	0.017
1037	73%	1.80	3.80	3.70	3.65	3.65	0.014	0.015	0.015	0.016
1037	75%	2.00	3.75	3.65	3.60	3.60	0.015	0.016	0.016	0.017
1027	71%	1.50	3.85	3.75	3.70	3.70	0.014	0.015	0.015	0.016
1027	73%	1.60	3.80	3.70	3.65	3.65	0.014	0.015	0.015	0.016
1027	75%	1.80	3.75	3.65	3.60	3.60	0.015	0.016	0.016	0.017

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

Laminate Availability

Core thk. (Inches)	Stack-up	Resin Content	DK				DF
Core thk. (Inches)	Stack-up	Resin Content	@ 1GHz	@ 2GHz	@ 5GHz	@ 10GHz	@ 1GHz	@ 2GHz	@ 5GHz	@ 10GHz


0.002	1-1067	65%	3.85	3.75	3.70	3.70	0.015	0.016	0.016	0.017
0.003	1-2112	52%	4.13	4.08	4.03	4.03	0.013	0.014	0.014	0.015
0.004	1-2116	46%	4.31	4.26	4.21	4.21	0.013	0.014	0.014	0.015
0.004	2-1067	65%	3.85	3.75	3.70	3.70	0.015	0.016	0.016	0.017
0.005	1-2116	55%	4.04	3.99	3.94	3.94	0.014	0.015	0.015	0.016
0.006	1-1506	45%	4.34	4.29	4.24	4.24	0.012	0.013	0.013	0.014
0.007	1-7628	41%	4.47	4.42	4.37	4.37	0.012	0.013	0.013	0.014
0.008	1-7628	46%	4.31	4.26	4.21	4.21	0.013	0.014	0.014	0.015
0.008	2-2116	46%	4.31	4.26	4.21	4.21	0.013	0.014	0.014	0.015
0.010	2-2116	55%	4.04	3.99	3.94	3.94	0.014	0.015	0.015	0.016
0.012	2-1506	45%	4.34	4.29	4.24	4.24	0.012	0.013	0.013	0.014
0.015	2-7628	43%	4.58	4.48	4.43	4.43	0.011	0.012	0.012	0.013
0.021	3-7628	42%	4.61	4.51	4.46	4.46	0.011	0.012	0.012	0.013
0.024	3-7628	42%	4.61	4.51	4.46	4.46	0.011	0.012	0.012	0.013
0.028	4-7628	42%	4.61	4.51	4.46	4.46	0.011	0.012	0.012	0.013
0.031	4-7628	44%	4.55	4.45	4.40	4.40	0.011	0.012	0.012	0.013
0.036	5-7628	43%	4.58	4.48	4.43	4.43	0.011	0.012	0.012	0.013
0.045	6-7628	43%	4.58	4.48	4.43	4.43	0.011	0.012	0.012	0.013
0.049	7-7628	42%	4.61	4.51	4.46	4.46	0.011	0.012	0.012	0.013
0.056	8-7628	42%	4.61	4.51	4.46	4.46	0.011	0.012	0.012	0.013
0.059	8-7628	44%	4.55	4.45	4.40	4.40	0.011	0.012	0.012	0.013

Press Condition

1. Heating rate(Rise of Rate) of material [Material Temperature]
Programmable Press: ≥3.0ºC/min

2. Curing Temperature & Time: >60min at more than 190ºC and peak temperature >200ºC

3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 80ºC

4. Vacuuming should be continued until over 140ºC [Material Temperature]

5. Cushion for pressure evenness is needed.

Typical Drilling Parameters

- Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc - Please adjust drilling parameters after checking qualities of through holes - Suggest Drilling parameter as below:

Diameter (mm)	Spindle Speed (krpm)	Feed Rate (mm/sec)	Chip Load (um/rev)	Hit Counts


0.25	125	25	10~15	500
1.00	53	31	30~45	800

Desmearing Process

- Please test desmear rate and check whether the smear is cleaned clearly by SEM, Ventec could provide the specimen for pilot. - 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear is recommended. - Holding time from desmear to PTH process: < 2 hours

Download PGL Datasheet

搜索…