VT-447V(I) Prepreg/Laminate

UL Approval: E214381 Version: 01/12/2025

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
Relative Humidity < 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

The prepreg exceeding shelf time should be retested. Take care in handling thin core laminates as they are easily damaged. If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed. Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

Precautions In Handling

  • Please be careful when single ply of 1080, 1086, 1078 106,1067,1037 or 1027 prepreg is designed to the dielectric layer.
  • Dimension stability is the same as Standard FR4 material.
  • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend controlling the peel strength with brown oxide copper over 2 Lb/in.
  • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

 

Prepreg Availability

E-Glass styles: 7628, 2116, 2113, 1087, 1080, 1067, 106, 1037, 1027, etc.

PP Type Resin Content Press Thickness (mil) Dk Df
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
7628 48% 7.9 4.46 4.36 4.31 4.31 0.012 0.013 0.013 0.014
7628 45% 7.5 4.52 4.42 4.37 4.37 0.012 0.013 0.013 0.014
2116 57% 4.9 4.20 4.10 4.05 4.05 0.013 0.014 0.014 0.015
2116 55% 4.7 4.25 4.15 4.10 4.10 0.013 0.014 0.014 0.015
2116 53% 4.4 4.30 4.20 4.15 4.15 0.013 0.014 0.014 0.015
2113 57% 3.9 4.20 4.10 4.05 4.05 0.013 0.014 0.014 0.015
1086 67% 3.5 3.95 3.85 3.80 3.80 0.014 0.015 0.015 0.016
1086 69% 3.8 3.90 3.80 3.75 3.75 0.014 0.015 0.015 0.016
1080 68% 3.2 3.93 3.83 3.78 3.78 0.014 0.015 0.015 0.016
1080 66% 3.0 3.98 3.88 3.83 3.83 0.014 0.015 0.015 0.016
1080 64% 2.7 4.03 3.93 3.88 3.88 0.014 0.015 0.015 0.016
1078 67% 3.0 3.95 3.85 3.80 3.80 0.014 0.015 0.015 0.016
1078 69% 3.2 3.90 3.80 3.75 3.75 0.014 0.015 0.015 0.016
106 73% 2.2 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
106 75% 2.4 3.75 3.65 3.60 3.60 0.014 0.015 0.015 0.016
1067 72% 2.0 3.83 3.73 3.68 3.68 0.014 0.015 0.015 0.016
1067 74% 2.4 3.78 3.68 3.63 3.63 0.015 0.016 0.016 0.017
1067 78% 2.8 3.69 3.59 3.54 3.54 0.015 0.016 0.016 0.017
1037 73% 1.8 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
1037 75% 2.0 3.75 3.65 3.60 3.60 0.015 0.016 0.016 0.017
1027 71% 1.5 3.85 3.75 3.70 3.70 0.014 0.015 0.015 0.016
1027 73% 1.6 3.80 3.70 3.65 3.65 0.014 0.015 0.015 0.016
1027 75% 1.8 3.75 3.65 3.60 3.60 0.015 0.016 0.016 0.017

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST Dk values are for impedance design.

Core Thickness (Inches) Stack-up Resin Content Dk Df
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
0.002 1-1067 68% 3.93 3.83 3.78 3.78 0.014 0.015 0.015 0.016
0.003 1-2112 52% 4.33 4.13 4.08 4.08 0.013 0.014 0.014 0.015
0.004 1-2116 46% 4.50 4.13 4.08 4.08 0.012 0.013 0.013 0.014
0.004 2-1067 68% 3.93 3.83 3.78 3.78 0.014 0.015 0.015 0.016
0.005 1-2116 55% 4.25 4.15 4.10 4.10 0.013 0.014 0.014 0.015
0.006 1-1506 45% 4.52 4.42 4.37 4.37 0.012 0.013 0.013 0.014
0.007 1-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.008 1-7628 44% 4.55 4.45 4.40 4.40 0.012 0.013 0.013 0.014
0.008 2-2116 46% 4.50 4.40 4.35 4.35 0.012 0.013 0.013 0.014
0.010 2-2116 56% 4.23 4.13 4.08 4.08 0.013 0.014 0.014 0.015
0.012 2-1506 45% 4.52 4.42 4.37 4.37 0.012 0.013 0.013 0.014
0.014 2-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.015 2-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
0.021 3-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.024 3-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.028 4-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.031 4-7628 44% 4.55 4.45 4.40 4.40 0.011 0.012 0.012 0.013
0.036 5-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
0.045 6-7628 43% 4.58 4.48 4.43 4.43 0.011 0.012 0.012 0.013
0.049 7-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.056 8-7628 42% 4.61 4.51 4.46 4.46 0.011 0.012 0.012 0.013
0.059 8-7628 44% 4.55 4.45 4.40 4.40 0.011 0.012 0.012 0.013

Press Condition

1. Heating rate(Rise of Rate) of material [Material Temperature]: Programmable Press: ≥3.0ºC/min
2. Curing Temperature & Time: >60min at more than 190ºC and peak temperature >200ºC
3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 80ºC
4. Vacuuming should be continued until over 140ºC [Material Temperature]
5. Cushion for pressure evenness is needed.

251201 VT-447V(I) Hot Cycle.jpg

Typical Drilling Parameters

  • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc
  • Please adjust drilling parameters after checking qualities of through holes
  • Suggest Drilling parameter as below:

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Chip Load (µm/rev) Hit Counts
0.25 125 25 10~15 500
1.0 53 31 30~45 800

Desmearing Process

  • Please test desmear rate and check whether the smear is cleaned clearly by SEM, Ventec could provide the specimen for pilot.
  • 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear is recommended.
  • Holding time from desmear to PTH process: < 2 hours

Packaging and baking recommendation

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

Downloads for VT-447V (I)