VT-447C Laminate/Prepreg
UL Approval: E214381 Version: 24/12/2024
/127/128/130
Precautions In Handling
Designing and Inner Layer Process
- Please be careful when single ply of 1080 prepreg is designed to the dielectric layer.
- VT-447C has weaker thermal resistance than regular VT-447. Please be very careful when 8L and higher
layer count is designed or dielectric with single ply of 1080.
- In order to satisfy CTI≥600V, 1 ply 2116 and 7628 or 2ply1080 is suggested to be used for outer layer.
- Please be noticed that the surface roughness and clearness affects CTI rating
Storage and Shelf life
|
|
Prepreg |
Laminate |
|
Storage Condition |
Temperature |
< 23℃ (73℉) |
< 5℃ (41℉) |
Room |
|
Relative Humidity |
< 55% |
/ |
/ |
|
Shelf Life |
3 Months |
6 Months |
24 Months |
- The prepreg exceeding shelf time should be retested.
- Take care in handling thin core laminates as they are easily damaged.
- If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
- Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.
Prepreg Availability
|
G/F Type |
Resin Content |
Press Thickness (mil) |
Dk |
Df |
|
@ 1GHz |
@ 2GHz |
@ 5GHz |
@ 10GHz |
@ 1GHz |
@ 2GHz |
@ 5GHz |
@ 10GHz |
|
7628 |
50% |
8.00 |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
|
7628 |
46% |
7.50 |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
|
2116 |
60% |
5.40 |
4.50 |
4.50 |
4.40 |
4.40 |
0.012 |
0.012 |
0.013 |
0.013 |
|
2116 |
58% |
5.00 |
4.50 |
4.50 |
4.40 |
4.40 |
0.012 |
0.012 |
0.013 |
0.013 |
|
1080 |
68% |
3.10 |
4.30 |
4.30 |
4.20 |
4.20 |
0.012 |
0.012 |
0.013 |
0.013 |
|
106 |
76% |
2.3 |
4.1 |
4.1 |
4.0 |
4.0 |
0.013 |
0.013 |
0.014 |
0.014 |
More types available upon request.
When 2116PP or/and 1080PP is used as the outmost layer, 2-ply minimum is required to ensure CTI600.
2-ply 106 prepreg can only withstand CTI400V.
Laminate Availablity
|
Core Thickness |
Stack-up |
Resin Content |
DK |
DF |
|
@ 1GHz |
@ 2GHz |
@ 5GHz |
@ 10GHz |
@ 1GHz |
@ 2GHz |
@ 5GHz |
@ 10GHz |
|
0.004 |
1-2113 |
57% |
4.50 |
4.50 |
4.40 |
4.40 |
0.012 |
0.012 |
0.013 |
0.013 |
|
0.005 |
1-2116 |
55% |
4.50 |
4.50 |
4.40 |
4.40 |
0.012 |
0.012 |
0.013 |
0.013 |
|
0.006 |
1-1506 |
46% |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.008 |
2-2113 |
57% |
4.50 |
4.50 |
4.40 |
4.40 |
0.012 |
0.012 |
0.013 |
0.013 |
|
0.008 |
1-7628 |
50% |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.010 |
2-2116 |
55% |
4.50 |
4.50 |
4.40 |
4.40 |
0.012 |
0.012 |
0.013 |
0.013 |
|
0.012 |
2-1506 |
46% |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.012 |
3-2113 |
57% |
4.50 |
4.50 |
4.40 |
4.40 |
0.012 |
0.012 |
0.013 |
0.013 |
|
0.015 |
2-7628 |
46% |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.016 |
2-7628 |
46% |
4.6 |
4.6 |
4.5 |
4.5 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.018 |
2-7628 + 1-1080 |
48% |
4.6 |
4.6 |
4.5 |
4.5 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.020 |
2-7628 + 1-2116 |
47% |
4.6 |
4.6 |
4.5 |
4.5 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.024 |
3-7628 |
46% |
4.6 |
4.6 |
4.5 |
4.5 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.028 |
4-7628 |
42% |
4.7 |
4.7 |
4.6 |
4.6 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.030 |
4-7628 |
46% |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.060 |
8-7628 |
46% |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
|
0.110 |
15-7628 |
46% |
4.60 |
4.60 |
4.50 |
4.50 |
0.011 |
0.011 |
0.012 |
0.012 |
In order to satisfy CTI ≥600V, please don’t design 0.10mm in outer layer;
More types could be available upon request.
Press Condition
1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥2.0ºC/min.
2. Curing Temperature & Time: >60min at more than 185ºC [Material Temperature]. Peak temperature: 200-205ºC
3. Full Pressure: ≥300psi and temperature to apply full pressure ≤80ºC
4. Vacuuming should be continued until over 140ºC [Material Temperature]
Typical Drilling Condition
|
Diameter |
Stack Height |
Spindle (KRPM) |
Infeed (mm/s) |
Retract (mm/s) |
Hit Count |
|
0.25mm |
1 PNL/Stack |
130 |
38 |
300 |
800 |
|
0.30mm |
1 PNL/Stack |
130 |
38 |
300 |
800 |
|
0.60mm |
1 PNL/Stack |
80 |
43 |
300 |
800 |
1. Excessive wear of carbide drill bits. Diamond coated drill bits preferred;
2. LE Aluminum sheet and white phenolic entry board are preferred;
Desmearing Process
The de-smearing rate of VT-447C is less than regular VT-447. 1 time vertical de-smearing is preferred.
Please examine hole wall to check de-smearing effect.
Typical de-smearing rate for reference only:
|
1x De-smearing |
Supplier |
Chemical |
|
0.27mg/cm2 |
Atotech |
Alkaline Permanganate |
Packaging and Baking Recommendation
- It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
- If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
- If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.