• VT-447(B) Laminate/Prepreg

    UL Approval: E214381 Version: 19/03/2020 /127/128/130

    General Information

    • Halogen Free & High Tg
    • Black, Light Blocking
    • Low Z-CTE
    • UV Blocking

    Application

    Reinforcement for FPC, Mobile Phone, Smart Phone, Computer, Communication Equipment, Instrumentation, LED, Eletronic Game Machine, VCR, etc

    Availability

    • Core Thickness: 0.006” (0.15mm) to 0.040” (1mm), other thickness on request
    • Available in roll or panel form
    • Copper Foil: 1/4oz to 12oz
    • E-Glass styles: 7628, 1506, 2116, other glass fabric on request
    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /127 /128 /130

    Properties Test Method Units Specfication Typical Value
    Thermal Properties
    Tg DSC IPC-TM-650 2.4.25 °C - -
    TMA IPC-TM-650 2.4.24 °C 170 minimum 180
    Td ASTM D3850 °C - 380
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum 60
    T288 IPC-TM-650 2.4.24.1 Minute - -
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s 150
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C - 45
    After Tg IPC-TM-650 2.4.24 ppm/°C - 190
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % - 2.3
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL 94 °C - 130
    Electrical Properties
    DK (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 5.4 maximum 4.35
    DF (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.013
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+6 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 4 (100~175)
    Arc Resistance ASTM D495 Second - 240
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 6~8 (1.05~1.40)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) - 6~8 (1.05~1.40)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 72 (500)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 58 (400)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.35
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical values and not intended to be specification values.

    Published on: 19/03/2020

    Download TDS Datasheet

  • VT-447(B) Prepreg/Laminate

    UL Approval: E214381 Version: 12/12/2024 /127/128/130

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% RH / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

    Prepreg Availability

    PP Type Resin Content Press Thickness (mil) Dk Df
    @ 1GHz @ 5GHz @ 1GHz @ 5GHz
    7628 45% 7.6 4.34 4.24 0.012 0.013
    2116 54% 4.8 4.07 3.97 0.014 0.015
    1080 64% 3.5 3.90 3.76 0.015 0.016

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    VT-447(B) Laminates are available in thickness from .003” up to .094” and with the copper foil from 1/4oz to 12oz; Ventec can supply either reverse treated (RT) or double side treated copper foil. DK values are for impedance design.

    Core Thickness (Inches) Stack-up Resin Content Dk Df
    @ 1GHz @ 5GHz @ 1GHz @ 5GHz
    0.003 1-1080 64% 3.85 3.76 0.015 0.016
    0.005 1-2116 54% 4.07 3.97 0.014 0.015
    0.006 2-1080 64% 3.85 3.76 0.015 0.016
    0.008 1-7628 45% 4.34 4.24 0.012 0.013
    0.010 2-2116 54% 4.07 3.97 0.014 0.015
    0.014 2-7628 41% 4.44 4.34 0.012 0.013
    0.016 2-7628 45% 4.31 4.21 0.013 0.014
    0.021 3-7628 41% 4.44 4.34 0.012 0.013
    0.028 4-7628 41% 4.44 4.34 0.012 0.013
    0.031 4-7628 45% 4.34 4.24 0.012 0.013
    0.039 5-7628 45% 4.34 4.24 0.012 0.013
    0.042 6-7628 41% 4.44 4.34 0.012 0.013

    Press Condition

    1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: 1.5-3.0ºC/min (3~5ºF/min). Manual Press:3~6ºC /min (5~10ºF/min)
    2. Curing Temperature & Time: >60min at more than 185ºC and peak temperature>195ºC
    3. Full Pressure: ≥300psi
    4. Vacuuming should be continued until over 140ºC [Material Temperature]
    5. Cold Press condition: Keep Plate @ Room Temperature by water; Pressure:100psi; Keep Time:60minutes     

    VT-447(B) Hot Start Cycle.jpg

    Typical Drilling Parameters

    1. Spindle Speed: 120-180 KRPM
    2. Feed Rate: 120-220 Inch / min
    3. Retract Rate: 596-1000 Inch / min
    4. Chip Load: 0.6-2.0 Mil / Rev
    5. Entry Board: t0.15mm AI -
    6. Stack Amount (t1.6mm): 1-3 stacks -

    Desmearing Process

    • Desmear rate of VT-447(B) is less than that of the conventional FR4;
    • Minor adjustments to the desmear process may be necessary for the higher Tg materials;        
    • Check with your chemical supplier for recommendations.

    Packaging and baking recommendation

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.
    Download PGL Datasheet