• VT-47 HP PP NF/LF

    UL Approval: E214381 Version: 12/12/2024

    General Information

    A generation of  phenolic cured Low and No Flow products using Ventec’s VT-47 HP resin technology with
    optimized resin rheology designed to enhance bond strength, specifically designed for lead free assembly processes.

    It has good bonding and thermal performance in heatsink bonding and rigid-flex board applications, and offers
    controlled flow ranges and constancy through the lamination process.

    • High Tg & High Td
    • Lead Free Compatible
    • IPC-4101E 126

    Availability

    Product Type Glass Type Resin Content Flow Range (mil) Pressed Thickness (mm)
    VT-47 HP LFNF PP 1067NF 1067 61 10 ~ 50 0.045
    1078NF 1078 63 10 ~ 50 0.075
    1067LF 1067 66 60 ~ 120 0.051
    1067LF 1078 64 60 ~ 120 0.076

    * Measured by micrometer “NFLF” ---- No Flow/Low Flow PP

    A generation of  phenolic cured Low and No Flow products using Ventec’s VT-47 HP resin technology with
    optimized resin rheology designed to enhance bond strength, specifically designed for lead free assembly processes.

    It has good bonding and thermal performance in heatsink bonding and rigid-flex board applications, and offers
    controlled flow ranges and constancy through the lamination process.

    • High Tg & High Td
    • Lead Free Compatible
    • IPC-4101E 126

    Storage Condition

    Properties Prepreg
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F)
    Relative Humidity Below 55% /
    Shelf Life 3 months 6 months

    The prepreg exceeding shelf life should be retested.

    Properties

    Properties Test Method Units Typical Value
    Tg TMA IPC-TM-650 2.4.24 °C 170
    Td TGA ASTM D3850 °C 366
    Electrical Strength - KV/mm 54
    Peel Strengh 1oz CU IPC-TM-650 2.4.8 Lb/in 9-10
    CVL IPC-TM-650 2.4.8 Lb/in 6
    Moisture Absorption D24/23 IPC-TM-650 2.6.21 % 0.10
    After PCT 1atm., 121˚C,1hour % 0.12
    XY-axis CTE 30-125˚C IPC-TM-650 2.4.24 °ppm/˚C 12-14
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 °ppm/˚C 60
    After Tg IPC-TM-650 2.4.24 °ppm/˚C 290
    Thermal Stress Solder Dip 288˚C - Second >300
    Breakdown Voltage D48/50+D0.5/23 IPC-TM-650 2.5.6 KV >60
    Arc Resistance D48/50+D0.5/23 IPC-TM-650 2.5.1 Second 120
    Dk (RC 60% @ 1GHz) C24/23/50 - - 3.88
    Df (RC 60% @ 1GHz) C24/23/50 - - 0.016
    Flammability As Received UL-94 Rating V-0

    All test data provided are typical and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Press Condition

    A generation of  phenolic cured Low and No Flow products using Ventec’s VT-47 HP resin technology with
    optimized resin rheology designed to enhance bond strength, specifically designed for lead free assembly processes.

    It has good bonding and thermal performance in heatsink bonding and rigid-flex board applications, and offers
    controlled flow ranges and constancy through the lamination process.

    • High Tg & High Td
    • Lead Free Compatible
    • IPC-4101E 126
    001224 - VT-47 HP PP HOT START CYCLE.jpg

    1) Press Temperature ----  171˚C
    2) 3plys per pressing
    3) Press Pressure ---- 200psi Built per IPC-TM-6502.3.17.2

     

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