thermal-bond 5.0F VT-4B7H RCF

UL Approval: E214381 Version: 01/12/2025

Precautions in Handling

Storage Condition and Shelf Life

RCF
Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉)
Relative Humidity Below 55% /
Shelf Life / 3 Months

The thermal management prepreg should be taken care of when handling and wearing rubber gloves to prevent contamination is strongly recommended during processing.

 

Product Handling & Press Process Flow

250626_VT-4BC RCF Press Process.jpg (1)

The thermal management prepreg should be taken care of when handling and wearing rubber gloves to prevent contamination is strongly recommended during processing.

 

The thermal management prepreg should be taken care of when handling and wearing rubber gloves to prevent contamination is strongly recommended during processing.

 

Press Parameters

The thermal management prepreg should be taken care of when handling and wearing rubber gloves to prevent contamination is strongly recommended during processing.

 

240325 thermal-bond press parameter pic.png

Baking Recommendation During PCB Process

Process Purpose Cycle Potential risk without bake
Before HASL, PCB should be separate (not stacked) and supported in a rack for this process. HASL process should be finished within 24 hours after baking finishing To eliminate moisture 2 hours @ 125°C Potential for measling, blister and de-lamination
Before shipment, if PCB stored for > 1 month, purpose to eliminate moisture cycle potential risk 2 hours @ 125ºC PCB should be baked before packaging To eliminate moisture 2~4 hours @ 125°C Potential for measling, blister and de-lamination

Prepreg exceeding shelf life should be retested.

Typical Drilling Conditions

Without Metal Base (only for reference)

Diameter (mm) Stack Height Spindle Speed (KRPM) Feed Rate (mm/s) Retract Rate (mm/s) Hit Count
0.15~0.30 1 PNL/stack 125~155 17~33 200~250 1200
0.35~0.40 1 PNL/stack 95~110 40~47 250 1200
0.55~1.00 1 PNL/stack 60~88 47 330 1200
>1.00 1 PNL/stack 50~70 30~47 300 800~1200

a) Carbide drill bit is prone to excessive wear, preferably Jinzhou SHD/MDC series drill bit. b) Aluminum and Phenolic Board Covers are recommended.

With Metal Base (only for reference)

Diameter (mm) Stack Height Spindle Speed (KRPM) Feed Rate (mm/s) Retract Rate (mm/s) Hit Count
0.25~0.30 1 PNL/stack 40 25~30 100~200 800
1.0~2.5 1 PNL/stack 36~39 35~50 250~450 200~500
>2.5 1 PNL/stack 30~37 30~40 200~300 200~500

a) Carbide drill bit is prone to excessive wear, preferably Jinzhou SHD/MDC series drill bit b) Recommend Aluminum and Phenolic Board Covers

Image Transfer

Process Recommendation
Dry Film The lamination speed maybe needs slower than standard FR4 to have metal substrate approach proper lamination temperature
Wet Film Both aluminum and copper could be coated to protect aluminum during etching process. Follow instruction details of manufacturers
Developing Masking or film protection on aluminum is better during developing. Follow chemical manufacturer’s recommendation

• Dry filming and wet filming are both applicable process on aluminum base laminate • Before filming, cleaning of panel surface is necessary • Wet film process options: - Curtain - Screen

Etching Stripping

Process Recommendation
Etching Alkaline or acid solution (cupric chloride, ferric chloride) are both applicable. Alkaline etching is faster than acid etching and is fit for below 3oz copper. The acid etching performs well on preventing of undercut and over etch
Stripping Apply sodium hydroxide solution to remove etch resist and conveying process is preferred

Solder Masking

Process Recommendation
Solder Masking Control the thickness between 1~2mil or depends on boards design
Pre-heating Follow manufacturer’s recommendation on the setting of temperature and time. Having a filter system in oven is preferred
Developing Solution concentration, temperature and spray pressure need to be controlled
Curing Follow the details of temperature and time of manufacturer.

• Roughness of board surface is necessary to get better adhesion between boards and solder mask • Before filming, cleaning of panel surface is necessary • Both thermal cured and UV cured solder mask are applicable • Masking options: - Screen Printing - Curtain Coating - Spray Coating - Roller Coating

Surface Finishing Options

Process Recommendation
HASL The most popular surface treatment method. Peel off the protective film from aluminum before HASL
OSP Follow details of manufacturer’s recommendation
ENIG Popular in wire bonding application. Follow chemistry recommendation to avoid defects of black pad and brickle gold
Silver Immersion Silver immersion has a better soldering ability but has disadvantage of silver migration

Routing

Diameter (mm) Spindle Speed (KRPM) Feed Rate (mm/s) Retract Rate (mm/s) Hit Count
0.8 37 10~15 30 12~15
1.0 37 10~15 30 10~12
1.2 37 12~18 30 8~10
1.5 36 15~20 30 5~8
2.0 34 15~20 30 3~5

• Backup board – Phenolic is preferred • Tools material – Tungsten or Diamond carbite with 2 flutes is preferred • Stack height – 1 panel / stack • Consult your tool supplier for more advice

Punching

• Alloy side is upwards when punching • Tonnage – 120T and above is preferred • “D1&D2” should be greater than board thickness • “D3” should be greater than board thickness + 0.5mm • Consult your tool supplier for more advice 250626_VT-4BC RCF Puching.jpg

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