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Pro-bond 9F VT-468 RCF
UL Approval: E214381 Version: 29/10/2025General Information
VT-468 RCF is non-reinforced film type material, which eliminates the skew and variation in high speed digital application with extremely low loss property (Df 0.0005@10GHz). It is designed to bond all circuit board materials and is more friendly to PCB process because of the thermosetting resin system.
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Excellent rheology properties for filling circuits
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Excellent through hole reliability
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Non-glass fabric reinforced, excellent electrical isotropic consistency
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Stable Dk over temperature
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Friendly for laser drill process
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Suitable for sequential laminations
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Halogen free
Application
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Data center
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HPC
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Radar and antenna
Availability
50µm, 100µm, 125µm and other thickness option could be available based upon request
Storage Condition
Properties RCF Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F) Relative Humidity Below 55% RH / Properties
Item Test Method Units Typical Value Dk@10GHz IPC-TM-650 2.5.5.13 - 2.80 Df@10GHz IPC-TM-650 2.5.5.13 - 0.0005 Tg-DMA IPC-TM-650 2.4.24.4 ˚C 205 T288 IPC-TM-650 2.4.24 min >60 Td(5% WT. loss) ASTM D3850 ˚C 440 Peel strength 1oz HTE IPC-TM-650 2.4.8 Lb/in 5.0 1oz RTF 4.5 1oz HVLP 4.0 X/Y-CTE (50~130˚C) IPC-TM-650 2.4.41 ppm/˚C 35 Z-CTE (50~130˚C) IPC-TM-650 2.4.24 ppm/˚C 35 Z-CTE (50~260˚C) IPC-TM-650 2.4.24 % 1.3% Thermal Conductivity ASTM D5470 W/mK 0.6 Moisture Absorption IPC-TM-650 2.6.2.1 % 0.08 Flammability UL 94 ˚C V-0 All test data provided are typical and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.
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