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VT-464H-PK Laminate/Prepreg
UL Approval: E214381 Version: 23/10/2024 /130General Information
- Halogen Free High Tg & Low CTE
- Low Dk & Low Loss
- Excellent Thermal Reliability
Application
Handheld Equipment, High Frequency & High Speed, Satellite Communication, Navigation, GPS, CPU, CSP, MCP, SD Card, DRAM, DDR, BGA, IC Packaging, etc.
Availability
- Core Thickness: 0.0012” (0.05mm) to 0.039” (1.0mm), available in sheet or panel form
- Copper Foil: 1/7oz to 6oz
- Prepregs are available in roll or panel form
- E-Glass Styles: 7628, 1506, 2113, 3313, 2116, 1080, 1086, 1078, 106 & 1067, 1037, 1027, 1017, etc.
Note: Note: It is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is ≈1-2lbs/in (0.35Kg/m) less than standard foil.
Properties Prepreg Laminate Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room Relative humidity Below 55% RH / / Shelf Life 3 months 6 months 24 months (airproof) The prepreg exceeding shelf life should be retested.
Properties Sheet IPC-4101E /130
Properties Test Method Units Specification Typical Value Thermal Properties Tg DMA IPC-TM-650 2.4.24.4 °C 170 minimum 260 Td ASTM D3850 °C 340 minimum 430 T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >60 Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600 Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 25~30 After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 120~140 Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.5 maximum 1.2~1.4 XY-axis CTE IPC-TM-650 2.4.24 ppm/°C - 9/10 Electrical Properties Dk (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 5.2 maximum 4.0 @ 10GHz IPC-TM-650 2.5.5.13 - - 3.9 Df (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.0050 @ 10GHz IPC-TM-650 2.5.5.13 - - 0.0068 Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8 E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6 Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7 E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6 Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54) Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60 Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250) Arc Resistance ASTM D495 Second 60 minimum 195 Mechanical Properties Peel Strength (RTF Hoz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 5.5 (0.96) After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 5.0 (0.87) minimum 5.5 (0.96) Flexural Strength Warp IPC-TM-650 2.4.4 GPa - 24~26 Fill IPC-TM-650 2.4.4 GPa - 23~25 Physical Properties Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.12 Flammability UL-94 Rating V-0 minimum V-0 All test data provided are typical values and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.
Published on: 23/10/2024
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VT-464 LT Laminate/Prepreg
UL Approval: E214381 Version: 03/02/2025 /130Storage Condition & Shelf Life
Prepreg Laminate Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room Relative Humidity Below 55% / / Shelf Life 3 Months 6 Months 24 Months (airproof) Prepreg exceeding shelf life should be retested.
Precautions in Handling
- Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
- Prepreg should be stored flat in a cool dry controlled environment 23ºC or less and 50% RH or less. Extended storage of prepreg should be at a reduced temperature of 5ºC.
- Open bags of prepreg must be resealed. Prepreg should not be exposed to open environments for more than 8 hours total cumulatively under the above conditions or as agreed upon between user and supplier.
- A first-in-first-out inventory system and a method to track material lot numbers through PCB processing and delivery of finished circuits is recommended.
Designing and Inner Layer Process
- Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. A racked bake at 150 ºC for 120 minutes is preferred.
- Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
- Holding time between brown oxide and press process: best control within 24 hours.
Prepreg Availability
Prepreg Type R/C (%) Delivered Thickness DK DF (μm) @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz 1017 75% 25 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090 79% 30 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092 1027 69% 35 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086 73% 40 3.63 3.58 3.58 3.54 3.50 0.0066 0.0069 0.0074 0.0084 0.0089 75% 45 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090 1037 75% 50 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090 77% 55 3.58 3.53 3.53 3.48 3.44 0.0067 0.0070 0.0075 0.0085 0.0090 79% 60 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092 1067 74% 60 3.63 3.58 3.58 3.54 3.50 0.0066 0.0069 0.0074 0.0084 0.0089 76% 65 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090 78% 72 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092 1078 62% 69 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084 64% 72 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084 66% 77 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085 1086 66% 80 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085 68% 85 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086 3313 55% 93 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078 57% 100 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079 2116 53% 112 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077 55% 119 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078 57% 125 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079 59% 136 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080 Laminate Availablity
Laminate Thickness (μm) Glass Style Piles Resin Content DK DF @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz 30 1027 1 65% 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085 50 1067 1 70% 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086 60 1078 1 59% 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080 80 1086 1 63% 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084 90 3313 1 53% 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077 100 3313 1 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079 1067 2 70% 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086 110 2116 1 53% 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077 125 1078 2 59% 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080 2116 1 55% 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078 150 1086 2 63% 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084 200 3313 2 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079 254 2116 2 55% 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078 305 3313 3 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079 Press Condition
1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥2.8ºC/min
2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC
3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC
4. Cushion for pressure evenness is needed
Typical Drilling Parameters
- Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
- Please adjust drilling parameters after checking qualities of through holes.
- Suggest Drilling parameter as below:
Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts 0.25 145 25 8~13 500 1.0 53 31 30~45 1000 Desmearing Process
• Please test desmear rate and check whether the smear is cleaned clearly by SEM , Ventec could provide the specimen for pilot. • 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear is recommended. • Holding time from desmear to PTH process: < 24 hoursPackaging and Baking Recommendation
- It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
- If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
- If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.