06 March 2019

Ventec exhibit at APEC 2019 image

Ventec will showcase its latest power electronics PCB material technology innovations at APEC 2019, which is taking place at the Anaheim Convention Center, USA from March 18-20 in Anaheim, USA. The Ventec technology team will be on hand on booth #438 showcasing unique laminate & prepreg capability solutions designed for the most demanding thermal applications.

Ventec is set to further strengthen its position as a global leader in technology for high performance thermal management and signal integrity materials at the Applied Power Electronics Conference in Anaheim, USA on booth #438.

Show-highlights include:
VT-4B Series IMS – thermal conductivity from 1.0 to 10.0 W/m.K
For superior thermal dissipation of an insulated metal substrate (IMS), VT-4B series materials offer the perfect performance and properties. VT-4B1 is designed for bending and forming with thermal conductivity of 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance: 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*in2/W satisfy demanding applications including high power-density converters and power supplies. For direct-to-metal connection of electrically isolated heat sources, VT-4B5SP selective preference substrates ensure maximum thermal efficiency and place dielectric insulation only where needed.

VT-5A2 - highest performance thermally conductive laminate material
The perfect choice for hybrid multilayer low-loss constructions, VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed. The lead-free assembly compatible material sets itself apart by offering highest performance thermal conductivity 8 times that of FR4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and MOT of 130°C.

tec-speed 20.0 - No more compromises - performance, price & availability
Power amplifiers are one of the world's most demanding Printed Circuit Board applications where high frequency performance, loss characteristics and reliability are key. tec-speed 20.0 (VT-870) offers all three and more: unrivalled performance with Dk 3.00-3.48 and Df 0.002-0.0037, superior loss characteristics and highest reliability, combined with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.

Thermal Interface Materials
As a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s, EMI Thermal’s Thermal Interface Materials (TIM) will be presented on the booth. The range of materials distributed through Ventec includes double sided thermal tape, electrical insulators, natural graphite and void fillers, that ensure reliability and performance and prevent electronic components from overheating and being damaged or burnt out.