Ventec Expands Thermal Interface Materials Range

We are pleased to announce the addition of two new thermally conductive thin isolation foil materials to our range of Thermal Interface Materials (TIM) under our distribution agreement with EMI Thermal.

Initially for the European market, Ventec teamed up with EMI Thermal to provide a range of Thermal Interface Materials (TIM) that are a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s. The range of materials distributed through Ventec, which includes double sided thermal tape, electrical insulators, natural graphite and void fillers, has now been expanded with the addition of two new UL94 V-0-recognized thin isolation/thermal conductive foil materials.

T-P INS 2 and T-P INS 3 A0/A1 are high-performance electrically insulating, thermally conductive interface materials that offer thermal conductivity of 1.8-3W/mK. Further features include high tensile strength (≥0.8-1.0) designed to prevent cut through and electrical shorts, low thermal impedance (0.16˚C in2/W), no viscosity and a thickness of 0.18-0.30mm, making them the ideal material choice for access control, computer and network & communications applications including SMPS, telecom devices, visual devices, networking products, LCD-TV, notebook PC’s, PC’s, etc. Full material specifications can be found at http://www.ventec-group.com/products/thermal-interface-material/.

To offer even greater value to customers, Ventec continues to maintain and build upon its one-stop-service solution for PCB materials to the European PCB and electronics industry, by offering a range of third party products that complement its own extensive product range, including flexible laminates (ThinFlex/Arisawa) and a full range of PCB production consumable products covering standard and specialty (Centrum & Glossback) drill materials, copper foils including ACF.