by: Didier Mauve and Ian Mayoh, Ventec International Group
Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, Sales and Marketing Manager and Ian Mayoh, Technical Support Manager, this book highlights the need to dissipate heat from electronic devices.
Our goal is to provide essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates. The book also guides PCB designers in the selection and specification of materials for particular applications, which will contribute to more reliable and cost-effective designs.
Readers will develop a comprehensive awareness of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies.