• VT-462S Laminate/Prepreg

    UL Approval: E214381 Version: 23/10/2024 /91/102

    General Information

    • Very Low Dk & Very Low Loss
    • Excellent Thermal Reliability
    • Lead Free Process Compatible
    • High Tg
    • Ease of Manufacturing

     

     

    Application

    • High speed Networking Equipment
    • IC Tester
    • High Frequency Measuring Instruments and Devices

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form
    • Copper Foil: 1/3oz to 3oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 2116, 2113, 1078, 106, etc
    • Ability of Processing Copper Type: HTE, RTF, VLP & HVLP

     

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /91 /102

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DMA IPC-TM-650 2.4.24.4 °C 170 minimum 210
    TMA IPC-TM-650 2.4.24 °C 170 minimum 170
    Td ASTM D3850 °C 340 minimum 400
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >30
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 48
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 260
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.5 maximum 2.8
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL 94 °C - 130
    Electrical Properties
    DK (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - - 3.6
    @ 10GHz IPC-TM-650 2.5.5.13 - - 3.5
    DF (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - - 0.003
    @ 10GHz IPC-TM-650 2.5.5.13 - - 0.005
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1372 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second 60 minimum 124
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 6.0 (1.05)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 4.0 (0.70) minimum 6.0 (1.05)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 80 (560)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 65 (450)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.10
    Flammability UL-94 Rating V-1 minimum V-0

    All test data provided are typical values and not intended to be specification values.

    Published on: 23/10/2024

    Download TDS Datasheet

  • VT-462S Laminate/Prepreg

    UL Approval: E214381 Version: 03/02/2025 /91/102

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
    Relative Humidity Below 55% / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Prepreg exceeding shelf life should be retested.

    Precautions in Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing and Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
    • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
    • Holding time between brown oxide and press process: best control within 6 hours.

    Prepreg Availability

    E-Glass styles: 2116, 3313, 1078, 1067,1037,1035, etc.

    Delivered Thickness (mil) Glass Style Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.0021 106 72% 3.27 3.25 3.19 3.16 3.13 0.0027 0.003 0.0035 0.0041 0.0044
    0.0025 106 76% 3.24 3.22 3.16 3.13 3.1 0.0026 0.0029 0.0034 0.004 0.0043
    0.0030 1078 64% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
    0.0033 1078 66% 3.33 3.31 3.27 3.24 3.21 0.0029 0.0032 0.0038 0.0044 0.0047
    0.0035 1078 68% 3.31 3.29 3.25 3.23 3.2 0.0028 0.0031 0.0037 0.0043 0.0046
    0.0041 3313 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
    0.0049 2116 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052

    Remark: ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.002 1067 1 65% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
    0.003 1078 1 64% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
    0.004 2113 1 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
    0.004 1067 2 65% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
    0.005 2116 1 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
    0.005 1078 2 60% 3.42 3.4 3.37 3.32 3.29 0.003 0.0034 0.0041 0.0048 0.0051
    0.006 1078 2 64% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
    0.008 2113 2 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
    0.01 2116 2 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
    0.012 2113 3 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
    0.014 7628 2 43% 3.96 3.94 3.91 3.86 3.83 0.0034 0.0038 0.0045 0.0052 0.0055
    0.016 2113 4 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
    0.018 7628*2+ 2113*1 3 45% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053
    0.020 2116 4 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
    0.024 7628*2+ 2116*2 4 47% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053
    0.025 2116 5 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
    0.025 7628*2+ 2116*2 4 47% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053
    0.028 7628 4 43% 3.96 3.94 3.91 3.86 3.83 0.0034 0.0038 0.0045 0.0052 0.0055
    0.030 2116 6 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
    0.030 7628 4 46% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053
    0.059 7628 8 46% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053

    More types could be available upon request.

    Press Condition

    1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥4ºC/min

    2. Curing Temperature & Time: >90min at more than 210ºC and peak temperature>215 ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

    4. Vacuuming should be continued until over 140ºC [Material Temperature]

    5. Cushion for pressure evenness is needed

    VT-462S HOT START CYCLE.jpg

    Typical Drilling Parameters

    • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
    • Please adjust drilling parameters after checking qualities of through holes.
    • Suggest Drilling parameter as below:

     

    Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
    0.25 145 25 8~13 500
    1.0 53 31 30~45 1000

    Desmearing Process

    • Before using plasma or desmear, a post baking @150ºC for 120min is preferred. • 1 cycle Plasma and 1 cycle desmear is recommended. • Typical plasma conditions.

    Process Temperature ℃ Gas Mixture Power (W) Duration (min)
    Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

    Typical Chemical conditions. (Atotech chemical)

    Process Temperature ℃ Duration (min)
    Sewll 60-70 5-10
    Permanganate Oxidizer 70-80 10-15

    If use other chemical, please consult the chemical supplier for suggested conditions.

    Packaging and Baking Recommendation

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

     

    Download PGL Datasheet