VT-464 LT Laminate/Prepreg

UL Approval: E214381 Version: 03/02/2025 /130

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
Relative Humidity Below 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions in Handling

  • Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
  • Prepreg should be stored flat in a cool dry controlled environment 23ºC or less and 50% RH or less. Extended storage of prepreg should be at a reduced temperature of 5ºC.
  • Open bags of prepreg must be resealed. Prepreg should not be exposed to open environments for more than 8 hours total cumulatively under the above conditions or as agreed upon between user and supplier.
  • A first-in-first-out inventory system and a method to track material lot numbers through PCB processing and delivery of finished circuits is recommended.

 

Designing and Inner Layer Process

  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. A racked bake at 150 ºC for 120 minutes is preferred.
  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
  • Holding time between brown oxide and press process: best control within 24 hours.

Prepreg Availability

Prepreg Type R/C (%) Delivered Thickness DK DF
(μm) @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
1017 75% 25 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
79% 30 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092
1027 69% 35 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
73% 40 3.63 3.58 3.58 3.54 3.50 0.0066 0.0069 0.0074 0.0084 0.0089
75% 45 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
1037 75% 50 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
77% 55 3.58 3.53 3.53 3.48 3.44 0.0067 0.0070 0.0075 0.0085 0.0090
79% 60 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092
1067 74% 60 3.63 3.58 3.58 3.54 3.50 0.0066 0.0069 0.0074 0.0084 0.0089
76% 65 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
78% 72 3.54 3.49 3.49 3.44 3.40 0.0069 0.0072 0.0077 0.0087 0.0092
1078 62% 69 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084
64% 72 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084
66% 77 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
1086 66% 80 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
68% 85 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
3313 55% 93 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
57% 100 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
2116 53% 112 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077
55% 119 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
57% 125 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
59% 136 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080

Laminate Availablity

Laminate Thickness (μm) Glass Style Piles Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
30 1027 1 65% 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
50 1067 1 70% 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
60 1078 1 59% 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080
80 1086 1 63% 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084
90 3313 1 53% 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077
100 3313 1 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
1067 2 70% 3.69 3.65 3.65 3.60 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
110 2116 1 53% 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077
125 1078 2 59% 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080
2116 1 55% 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
150 1086 2 63% 3.76 3.71 3.71 3.66 3.61 0.0061 0.0064 0.0069 0.0079 0.0084
200 3313 2 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
254 2116 2 55% 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
305 3313 3 57% 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079

Press Condition

1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥2.8ºC/min

2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC

3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

4. Cushion for pressure evenness is needed

250203 VT-464LT PRESS CYCLE.jpg

Typical Drilling Parameters

  • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
  • Please adjust drilling parameters after checking qualities of through holes.
  • Suggest Drilling parameter as below:

 

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
0.25 145 25 8~13 500
1.0 53 31 30~45 1000

Desmearing Process

• Please test desmear rate and check whether the smear is cleaned clearly by SEM , Ventec could provide the specimen for pilot. • 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear is recommended. • Holding time from desmear to PTH process: < 24 hours

Packaging and Baking Recommendation

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

 

Downloads for tec-speed 4.0H-PK (VT-464LT)