• VT-464L Laminate/Prepreg

    UL Approval: E214381 Version: 02/12/2024 /130

    General Information

    • Halogen Free & High Tg
    • FR4.1
    • Low Dk & Low Loss
    • Excellent Thermal Reliability
    • Lead Free Process Compatible
    • Ease of Manufacturing

     

     

    Application

    High Frequency & High Speed, Satellite Communication, Navigation, GPS, etc

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form
    • Copper Foil: 1/4oz to 12oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106 & 1067, etc
    • Ability of Processing Copper Type: HTE, RTF, VLP & HVLP

     

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /130

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg TMA IPC-TM-650 2.4.24 °C 170 minimum 175
    DMA IPC-TM-650 2.4.24.4 °C 170 minimum 230
    Td ASTM D3850 °C 340 minimum 390
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >30
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 45
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 210
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.0 maximum 2.4
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL 94 °C - 130
    Electrical Properties
    DK (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 5.2 maximum 3.8
    @ 10GHz IPC-TM-650 2.5.5.13 - - 3.7
    DF (RC 50%) @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.0060
    @ 10GHz IPC-TM-650 2.5.5.13 - - 0.0075
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 10E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1372 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second 60 minimum 195
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 8.0 (1.4)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 4.0 (0.70) minimum 8.0 (1.4)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 80 (560)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 65 (450)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.12
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical values and not intended to be specification values.

    Published on: 02/12/2024

    Download TDS Datasheet

  • VT-464 L Laminate/Prepreg

    UL Approval: E214381 Version: 16/05/2025 /130

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Prepreg exceeding shelf life should be retested.

    Precautions in Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing and Inner Layer Process

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Prepreg Availability

    E-Glass styles: 2116, 2113, 1080, 1067,106, 1037, 1027, etc.

    Delivered Thickness (Inches) Glass Style Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.0016 1027 72% 3.45 3.25 3.21 3.18 0.0066 0.0069 0.0074 0.0084
    0.0018 1027 74% 3.40 3.34 3.30 3.22 0.0067 0.0070 0.0075 0.0085
    0.002 1027 76% 3.35 3.18 3.15 3.10 0.0068 0.0071 0.0076 0.0086
    0.002 1037 72% 3.45 3.25 3.21 3.18 0.0066 0.0069 0.0074 0.0084
    0.0022 1037 74% 3.40 3.34 3.30 3.22 0.0067 0.0070 0.0075 0.0085
    0.0018 106 70% 3.47 3.27 3.24 3.20 0.0065 0.0068 0.0073 0.0083
    0.002 106 72% 3.45 3.25 3.21 3.18 0.0066 0.0069 0.0074 0.0084
    0.0024 106 76% 3.35 3.18 3.15 3.10 0.0068 0.0071 0.0076 0.0086
    0.0023 1067 69% 3.48 3.45 3.39 3.30 0.0065 0.0068 0.0073 0.0083
    0.0027 1067 73% 3.40 3.34 3.30 3.22 0.0067 0.0070 0.0075 0.0085
    0.0029 1080 64% 3.63 3.60 3.53 3.42 0.0062 0.0065 0.0070 0.0080
    0.0031 1080 66% 3.55 3.50 3.44 3.37 0.0063 0.0066 0.0071 0.0081
    0.0033 1080 68% 3.48 3.45 3.39 3.30 0.0064 0.0067 0.0072 0.0082
    0.0038 2113 56% 3.86 3.81 3.74 3.67 0.0059 0.0062 0.0068 0.0078
    0.0048 2116 54% 3.87 3.82 3.75 3.68 0.0058 0.0061 0.0067 0.0077
    0.0051 2116 56% 3.86 3.81 3.74 3.67 0.0059 0.0062 0.0068 0.0078

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.002 1067 1 66% 3.55 3.50 3.44 3.37 0.0063 0.0066 0.0071 0.0081
    0.0025 1078 1 57% 3.82 3.76 3.72 3.62 0.0059 0.0062 0.0068 0.0078
    0.003 1080 1 64% 3.63 3.60 3.53 3.42 0.0062 0.0065 0.0070 0.0080
    0.003 2112 1 53% 3.87 3.82 3.75 3.68 0.0057 0.0060 0.0066 0.0076
    0.0035 2113 1 52% 3.88 3.83 3.76 3.69 0.0057 0.0060 0.0066 0.0076
    0.004 2113 1 56% 3.86 3.81 3.74 3.67 0.0059 0.0062 0.0068 0.0078
    0.005 2116 1 55% 3.88 3.83 3.76 3.69 0.0058 0.0061 0.0067 0.0077
    0.006 2112 2 53% 3.87 3.82 3.75 3.68 0.0057 0.0060 0.0066 0.0076
    0.007 2113 2 52% 3.88 3.83 3.76 3.69 0.0057 0.0060 0.0066 0.0076
    0.008 2113 2 56% 3.86 3.81 3.74 3.67 0.0059 0.0062 0.0068 0.0078
    0.01 2116 2 55% 3.87 3.82 3.75 3.68 0.0058 0.0061 0.0067 0.0077
    0.012 1506 2 44% 4.13 4.09 4.03 3.94 0.0053 0.0056 0.0061 0.0071
    0.014 7628 2 41% 4.22 4.18 4.12 4.03 0.0051 0.0054 0.0059 0.0069
    0.015 7628 2 44% 4.13 4.09 4.03 3.94 0.0053 0.0056 0.0061 0.0071
    0.016 7628 2 46% 4.07 4.03 3.97 3.88 0.0054 0.0057 0.0062 0.0072
    0.021 7628 3 41% 4.22 4.18 4.12 4.03 0.0051 0.0054 0.0059 0.0069
    0.022 7628 3 44% 4.13 4.09 4.03 3.94 0.0053 0.0056 0.0061 0.0071
    0.024 7628 3 46% 4.07 4.03 3.97 3.88 0.0054 0.0057 0.0062 0.0072

    More types could be available upon request.

    Press Condition

    1. Heating rate(Rise of Rate) of material [Material Temperature] Programmable Press: ≥2.8℃/min

    2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

    4. Vacuuming should be continued until over 140℃ [Material Temperature]  

    5. Cushion for pressure evenness is needed

    250516 VT-464L PGL PRESS CONDITION.jpg

    Typical Drilling Parameters

    1. Heating rate(Rise of Rate) of material [Material Temperature] Programmable Press: ≥2.8℃/min

    2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

    4. Vacuuming should be continued until over 140℃ [Material Temperature]  

    5. Cushion for pressure evenness is needed

    Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
    0.25 125 25 10~15 500
    1.0 53 31 30~45 1000

    Desmearing Process

    • Please test desmear rate and check whether the smear is cleaned clearly by SEM , Ventec could provide the specimens. • 1 cycle Plasma and 1 cycle desmearis recommended. • Typical plasma conditions.

    Process Temperature ℃ Gas Mixture Power (W) Duration (min)
    Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

    Typical Chemical conditions. (Atotech chemical)

    Process Temperature ℃ Duration (min)
    Sewll 60-70 5-10
    Permanganate Oxidizer 70-80 10-15

    If use other chemical, please consult the chemical supplier for suggested conditions.

    Packaging and Baking Recommendation

    1. Heating rate(Rise of Rate) of material [Material Temperature] Programmable Press: ≥2.8℃/min

    2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

    4. Vacuuming should be continued until over 140℃ [Material Temperature]  

    5. Cushion for pressure evenness is needed

    Download PGL Datasheet