• tec-speed 20.0 VTM1000i Hydrocarbon Ceramic based Laminate

    UL Approval: E214381 Version: Prelim 1 13/12/2022

    General Information

    • Hydrocarbon & ceramic based laminate
    • High Dk (9.8) and Low Df (0.0023)
    • Excellent thermal reliability


    • Satellite Communication Systems
    • Power Amplifiers
    • Global Positioning System Antennas
    • Filters and Couplers
    • RF and Microwave Circuitry


    Core Thickness 0.015”, 0.020”, 0.025”, 0.030”, 0.050”, 0.060”, 0.075”, 0.100”, 0.125”, and 0.150”

    * Additional copper types are available upon request.

    > Copper base or aluminum base laminate is available.

    > The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Default Copper Type Copper Thickness
    HVLP Hoz and 1oz
    HTE 2oz

    Storage Condition

    Properties Laminate
    Storage Condition Temperature Room
    Relative Humidity /

    Laminate Properties

    Properties Test Method Units Typical Value
    Electrical Properties
    Dielectric Constant @ 10GHz IPC-TM-650 Clamped Stripline - 9.8 ± 0.245
    Design Dk 8~40GHz Differential phase length method - 9.9
    Dissipation Factor @ 10GHz IPC-TM-650 - 0.0023
    TcDK After Moisture Resistance IPC-TM-650 Clamped Stripline ppm/°C -40
    Thermal Properties
    Td ASTM D3850 °C 426
    Z-CTE 50~140˚C IPC-TM-650 2.4.24 ppm/°C 25
    x, y-CTE 50~140˚C IPC-TM-650 2.4.24 ppm/°C 24
    Thermal Stress @ 288°C IPC-TM-650 Second >600
    Thermal Conductivity ASTM D5470 W/mK 1.00
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) 5.0 (0.88)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 5.0 (0.88)
    Flexural Modulus ASTM D790 Mpsi 2.05
    Physical Properties
    Moisture Absorption ASTM D547 % 0.15
    Lead free process compatible - - YES

    All test data provided are typical and not intended to be specification values.

    Download TDS Datasheet