VT-47LT Prepreg

UL Approval: E214381 Version: 27/03/2025 /126

Storage Condition & Shelf Life

Prepreg
Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉)
Relative Humidity < 55% /
Shelf Life 3 Months 6 Months

Prepreg exceeding shelf life should be retested.

Precautions In Handling

  • The prepreg exceeding shelf time should be retested.
  • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing And Inner Layer Process

  • Please be careful when single ply of 1037, 1067 or 1078 prepreg is designed to the dielectric layer.
  • Dimension stability is the same as Standard FR4 material.
  • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.

Prepreg Availability

E-Glass styles: 1078, 1067, 1037 etc.

PP Type Resin Content Press Thickness Dk DF
mil μm @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
1037 70 1.7 43 4.00 3.95 3.90 3.79 0.013 0.015 0.016 0.017
1037 72 1.8 46 3.96 3.91 3.86 3.75 0.014 0.016 0.017 0.018
*1037 74 2.0 51 3.92 3.87 3.82 3.71 0.014 0.016 0.017 0.018
1037 76 2.2 56 3.88 3.83 3.78 3.67 0.014 0.016 0.017 0.018
1037 78 2.3 58 3.84 3.79 3.74 3.63 0.014 0.016 0.017 0.018
1067 70 2.2 56 4.00 3.95 3.90 3.79 0.013 0.015 0.016 0.017
1067 72 2.4 61 3.96 3.91 3.86 3.75 0.014 0.016 0.017 0.018
*1067 74 2.5 64 3.92 3.87 3.82 3.71 0.014 0.016 0.017 0.018
1067 76 2.8 71 3.88 3.83 3.78 3.67 0.014 0.016 0.017 0.018
1067 78 2.9 74 3.84 3.79 3.74 3.63 0.013 0.016 0.017 0.018
*1078 66 3.0 76 4.08 4.03 3.98 3.87 0.013 0.015 0.016 0.017
1078 68 3.2 81 4.04 3.99 3.94 3.83 0.013 0.015 0.016 0.017
1078 70 3.4 86 4.00 3.95 3.90 3.79 0.013 0.015 0.016
1078 72 3.6 91 3.96 3.91 3.86 3.75 0.014 0.016 0.017

* Standard Availability ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated pre-preg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Press Condition

1. Heating rate(Rise of Rate) of material [Material Temperature] Programmable Press: 2~4℃/min (4~7℉/min).  Manual Press:3~6℃ /min (5~10℉/min)

2. Curing Temperature & Time: >60min at more than 190℃ (374℉)[Material Temperature]

3. Full Pressure : ≥300psi

4. Vacuuming should be continued until over 140℃ (284℉) [Material Temperature]  

5. Cold Press condition: Keep Plate @ Room Temperature by water, Pressure:100psi, Keep Time:60minutes

Hot Start Cycle VT-47LT.jpg

Typical Drilling Parameters

Diameter (mm) Spindle Speed (KRPM) Feed Rate (IPM) Retract Rate (IMP) Chip Load (mil/rev)
0.20~0.25 135 75 791 0.56
0.30~0.35 155 120 984 0.77
0.40~0.45 120 125 900 1.04
0.50~0.55 95 90 700 0.95
0.60~0.65 80 110 765 1.38
0.70~0.75 72 120 765 1.67
0.80~0.95 68 120 850 1.76
1.00~1.05 60 140 984 2.33
1.10~1.15 54 150 984 2.78
1.20~1.25 52 160 984 3.08
1.30~1.45 50 150 984 3.00
1.50~1.55 45 130 984 2.89
1.60~1.75 40 120 800 3.00
1.80~2.00 35 80 600 2.29
2.05~2.45 30 80 500 2.67
2.50~2.75 25 70 500 2.80
2.80~3.20 20 60 500 3.00
3.20~3.60 20 60 500 3.00
3.65~4.00 20 35 500 1.75
4.50~4.80 20 25 400 1.25
4.81~6.50 20 20 300 1.00

Desmearing Process

Standard FR4 Desmear Process.

Packing and Baking Recommendations

  • Desmear rate is less than that of the conventional FR4.
  • Adjustments to the desmear process are necessary for the lead-free materials.
  • Check with your chemical supplier for recommendations.

Downloads for VT-47LT