• Bondply VT-447 RCF Resin Coated Bondply

    UL Approval: E214381 Version: 18/01/2026

    General Information

    • Halogen Free
    • Phenolic Cure System
    • High Tg  FR-15.1
    • UV Blocking
    • CAF Resistance
    • Excellent Thermal Reliability
    • Excellent Resin Filling

    Application

    It is specially designed to fill both single sided and double sided heavy copper in multi-layers, which minimize the usage of ultra thin prepreg or relieve PCB makers of the bother of cockamamie pro-coating to heavy copper.

    Availability

    • Dielectric Thickness: .004”(100µm)/.006”(150um)/ .008”(200µm)
    • Standard Size: Width: 24.01”(610mm), Length: 18.11”(460mm)/20.08”(510mm)/20.98”(533mm)*
    • PET film Thickness: 50µm

    Note: *For standard sizes discuss with customer.

    VT-447 RCF Resin_Film Graphic.jpg

    Properties Sheet

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Glass Transition Temp. Tg DSC IPC-TM-650 2.4.25 °C 160 minimum 168
    DMA IPC-TM-650 2.4.24.4 170 minimum 180
    Td ASTM D3850 °C 350 minimum 368
    T288 IPC-TM-650 2.4.24.1 Minute 5 minimum 20
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Electrical Properties
    Dielectric Constant @ 1GHz IPC-TM-650 2.5.5.9 - 5.4 maximum 3.40
    Dissipation Factor @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.016
    Volume Resistivity After Moisture Resistence IPC-TM-650 2.4.17.1 MΩ-cm 1.0E+4 maximum 5.0E+8
    E-24/125 IPC-TM-650 2.4.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistence IPC-TM-650 2.4.17.1 MΩ 1.0E+4 maximum 5.0E+7
    E-24/125 IPC-TM-650 2.4.17.1 MΩ 1.0E+3 maximum 5.0E+6
    Mechanical Properties
    Peel Strength (Hoz) IPC-TM-650 2.4.8 lb/in (N/mm) 4 (0.7) minimum 5 (0.88)
    Flexural Strength IPC-TM-650 2.4.4 Kpsi (MPa) 60 (415) minimum 72 (500)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.18
    Flammability UL-94 Rating V-0 minimum V-0

    Note: All test data provided are typical values and not intended to be specification values.

    Process for Pre-Bonding

    VT-447 RCF Pre-bonding process.jpg
    • Build-up for Pre-Bonding

    Press Profile

    1. Heating rate (Rate of Rise) of material 80-130ºC, Programmable Press: 2.0-3.0ºC/min [Material Temperature]
    2. Curing Temperature & Time: >60min at more than 185ºC [Material Temperature]
    3. Full Pressure: ≥350psi
    4. Full Pressure Temperature: 70-80ºC
    5. Vacuuming should be continued until over 180ºC [Material Temperature]
    6. Cold Press Condition: Keep Plate @ Room Temperature by water; Pressure:100psi; Dwell Time: 60minutes

    Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.
    Download TDS Datasheet