• VT-47 Laminate/Prepreg

    UL Approval: E214381 Version: B3 23/12/2017 /97/98/99/101/126

    General Information

    • High Tg FR4.0
    • Phenolic Cure System & Lead Free Compatible
    • Excellent Thermal Reliability
    • CAF Resistance
    • UV Blocking
    • Low Z-CTE

    Application

    Computer, Communication Equipment, Instrumentation, Precise Apparatus & Instrument, Server, Router, Automotive, Medical, etc

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form.
    • Copper Foil: 1/4oz to 12oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106 & 1067, etc.

    Note: For cores ≤ 0.005”, it is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is ≈1-2lbs/in (0.35Kg/m) less than standard foil.

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /97 /98 /99 /101 /126

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DSC IPC-TM-650 2.4.25 °C 170 minimum 180
    TMA IPC-TM-650 2.4.24 °C - 180
    Td ASTM D3850 °C 340 minimum 355
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >30
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 45
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 190
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.0 maximum 2.3
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL 94 °C - 130
    Electrical Properties
    DK @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 5.2 maximum 4.27
    DF @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 0.035 minimum 0.016
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second 60 minimum 147
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 7.5~10 (1.3~1.75)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 7.5~10 (1.3~1.75)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 72 (500)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 61 (420)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.50 maximum 0.12
    Thermal Conductivity ISO22007-2 W/M·K - 0.5
    Flammability UL-94 Rating V0 minimum V0

    All test data provided are typical values and are not intended to be specification values.

    Published on: 23/12/2017

    Download TDS Datasheet
  • VT-47 CCL/Laminate VT-47 PP/Prepreg

    UL Approval: E214381 Version: Rev. C1 20/08/2019 /97/98/99/101/126

    Storage Condition & Shelf Life

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing And Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Dimension stability is the same as Standard FR4 material.
    • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
    • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

     

    Prepreg Availability

    E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106, 1067 etc.

    Prepreg Availability

    PP Type Resin Content Press Thickness (mil) DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    7628 48% 8.20 4.20 4.15 4.10 4.10 0.015 0.016 0.016 0.017 Standard
    7628 45% 7.60 4.25 4.20 4.15 4.15 0.014 0.015 0.015 0.016 Standard
    1506 52% 7.10 4.10 4.05 4.00 4.00 0.015 0.016 0.016 0.017 Standard
    2116 58% 5.30 3.90 3.85 3.80 3.80 0.016 0.017 0.017 0.018 Standard
    2116 56% 5.10 3.97 3.92 3.87 3.87 0.016 0.017 0.017 0.018 Standard
    2116 54% 4.90 4.03 3.98 3.93 3.93 0.016 0.017 0.017 0.018 Standard
    2113 57% 4.00 3.93 3.88 3.83 3.83 0.016 0.017 0.017 0.018 Standard
    1080 69% 3.50 3.60 3.55 3.50 3.50 0.018 0.019 0.019 0.020 Standard
    1080 66% 3.20 3.70 3.65 3.60 3.60 0.018 0.019 0.019 0.020 Standard
    1080 64% 3.00 3.75 3.70 3.65 3.65 0.017 0.018 0.018 0.019 Standard
    1080 62% 2.80 3.80 3.75 3.70 3.70 0.017 0.018 0.018 0.019 Srandard
    106 76% 2.50 3.45 3.40 3.35 3.35 0.019 0.020 0.020 0.021 Standard
    106 71% 1.90 3.55 3.50 3.45 3.45 0.018 0.019 0.019 0.020 Standard

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated pre-preg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

    Laminate Availability

    Core thk. (Inches) Stack-up Resin Content DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.002 1-1067 65% 3.75 3.70 3.65 3.65 0.017 0.018 0.018 0.019 Standard
    0.003 1-2112 52% 4.10 4.05 4.00 4.00 0.015 0.016 0.016 0.017 Standard
    0.004 1-2116 45% 4.20 4.20 4.15 4.15 0.014 0.015 0.015 0.016 Standard
    0.004 2-1078 46% 4.25 4.20 4.15 4.15 0.014 0.015 0.015 0.016 2ply
    0.005 1-2116 55% 4.00 3.95 3.90 3.90 0.016 0.017 0.017 0.018 Standard
    0.006 1-1506 45% 4.25 4.20 4.15 4.15 0.014 0.015 0.015 0.016 Standard
    0.006 2-2112 52% 4.10 4.05 4.00 4.00 0.015 0.016 0.016 0.017 2ply
    0.007 1-7628 41% 4.30 4.30 4.25 4.25 0.014 0.015 0.015 0.016 Standard
    0.008 1-7628 46% 4.22 4.17 4.13 4.13 0.014 0.015 0.015 0.016 Standard
    0.008 2-2116 45% 4.25 4.20 4.15 4.15 0.014 0.015 0.015 0.016 2ply
    0.010 2-2116 55% 4.00 3.95 3.90 3.90 0.016 0.017 0.017 0.018 Standard
    0.012 2-1506 45% 4.25 4.20 4.15 4.15 0.014 0.015 0.015 0.016 Standard
    0.014 2-7628 41% 4.35 4.30 4.25 4.25 0.014 0.015 0.015 0.016 Standard
    0.016 2-7628 46% 4.22 4.19 4.13 4.13 0.014 0.015 0.015 0.016 Standard
    0.016 2-7628+ 1-1080 42% 4.25 4.20 4.15 4.15 0.014 0.015 0.015 0.016 Standard
    0.020 2-7628+ 1-2116 42% 4.33 4.28 4.23 4.23 0.014 0.015 0.015 0.016 Standard
    0.028 4-7628 41% 4.35 4.30 4.25 4.25 0.014 0.015 0.015 0.016 Standard
    0.036 5-7628 43% 4.30 4.25 4.20 4.20 0.014 0.015 0.015 0.016 Standard
    0.045 6-7628 46% 4.22 4.18 4.13 4.13 0.014 0.015 0.015 0.016 Standard
    0.049 7-7628 41% 4.35 4.30 4.25 4.25 0.014 0.015 0.015 0.016 Standard
    0.059 8-7628 44% 4.28 4.23 4.18 4.18 0.014 0.015 0.015 0.016 Standard

    Press Condition

    1. Heating rate(Rise of Rate) of material [Material Temperature]
    Programmable Press: 1.5-3.0℃/min (3~5℉/min).  Manual Press:3~6℃ /min (5~10℉/min)

    2. Curing Temperature & Time: >60min at more than 185℃ (365℉)[Material Temperature]

    3. Full Pressure : ≥250-300psi

    4. Vacuuming should be continued until over 140℃ (284℉) [Material Temperature]  

    5. Cold Press condition:  
    Keep Plate @ Room Temperature by water, Pressure:100psi, Keep Time:60minutes

    47 PC-1 - 副本.png 47 PC-2 - 副本.png 47 PC-3.png

    Typical Drilling Parameters

    Hole Size (mm) Spindle Speed (KRPM) Feed Rate (IPM) Retract Rate (IPM) Chip Load (Mil/Rev)
    0.20~0.25 135 75 91 0.56
    0.30~0.35 155 120 984 0.77
    0.40~0.45 120 125 900 1.04
    0.50~0.55 95 90 700 0.95
    0.60~0.65 80 110 765 1.38
    0.70~0.75 72 120 765 1.67
    0.80~0.95 68 120 850 1.76
    1.00~1.05 60 140 984 2.33
    1.10~1.15 54 150 984 2.78
    1.20~1.25 52 160 984 3.08
    1.30~1.45 50 150 984 3.00
    1.50~1.55 45 130 984 2.89
    1.60~1.75 40 120 800 3.00
    1.80~2.00 35 80 600 2.29
    2.05~2.45 30 80 500 2.67
    2.50~2.75 25 70 500 2.80
    2.80~3.60 20 60 500 3.00
    3.65~4.00 20 35 500 1.75
    4.50~4.80 20 25 400 1.25
    4.81~6.50 20 20 300 1.00

    The use of undercut drill bits has yielded better quality on smaller holes. Check with you drill bit supplier for more information.

    Desmearing Process

    1. Desmear rate is less than that of the conventional FR4; 2. Adjustments to the desmear process are necessary for the lead-free materials; 3. Check with your chemical supplier for recommendations.
    Download PGL Datasheet