• VT-447V Laminate/Prepreg

    UL Approval: E214381 Version: 30/01/24 30/01/2024 /127/128/130/154

    General Information

    • Phenolic Cured System
    • Halogen free
    • High Td & High Tg (190℃)
    • FR15.1 & MOT 150℃
    • CAF Resistance
    • Low Z-CTE
    • Excellent Thermal Reliability
    180507IPCLOGOWEBValidation-listed.jpg (1)

    Application

    Automotive, Mobile Phone, Smart Phone, Automotive, High Power Application, Server, Computer, Communication Equipment, Instrumentation, Electronic Game Machine, VCR, etc.

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form
    • Copper Foil: 1/4oz to 12oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 1506, 2113, 2116, 1080, 1086, 1078, 106,1067,1037 & 1027 etc

    Note: For cores ≤ 0.005”, it is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is ≈1-2lbs/in (0.35Kg/m) less than standard foil.

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E WAM1 /127 /128 /130 /154

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DSC IPC-TM-650 2.4.25 °C - 190
    TMA IPC-TM-650 2.4.24 °C 170 minimum 180
    Td ASTM D3850 °C 340 minimum 390
    T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >60
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 40
    After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 165
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.0 maximum 1.8
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~13
    MOT UL-746E °C - 150
    Electrical Properties
    DK @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 5.4 maximum 4.40
    DF @ 1GHz RC 50% IPC-TM-650 2.5.5.9 - 0.035 maximum 0.012
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175~250)
    Arc Resistance ASTM D495 Second - 195
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 7~9 (1.2~1.6)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 7~9 (1.2~1.6)
    Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 87 (600)
    Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 77 (530)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.12
    Flammability UL-94 Rating V-0 minimum V-0

    All test data provided are typical values and are not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Published on: 30/01/2024

    Download TDS Datasheet

  • VT-447V CCL/Laminate VT-447V PP/Prepreg

    UL Approval: E214381 Version: Rev. B4 14/04/2023 /127/128/130/154

    Storage Condition

    Prepreg Laminate
    Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
    Relative Humidity < 55% / /

    Prepreg exceeding shelf life should be retested.

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing And Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Dimension stability is the same as Standard FR4 material.
    • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
    • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

     

    Prepreg Availability

    E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106, 1067 etc.

    Prepreg Availability

    PP Type Resin Content Press Thickness (mil) DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    7628 45% 7.60 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014 Standard
    1506 52% 7.00 4.13 4.08 4.03 4.03 0.013 0.014 0.014 0.015 Standard
    2116 58% 5.30 3.96 3.91 3.86 3.86 0.014 0.015 0.015 0.016 Standard
    2116 54% 4.80 4.07 4.02 3.97 3.97 0.014 0.015 0.015 0.016 Standard
    2116 52% 4.60 4.13 4.08 4.03 4.03 0.013 0.014 0.014 0.015 Standard
    2113 57% 3.90 3.99 3.94 3.89 3.89 0.014 0.015 0.015 0.016 Standard
    1080 68% 3.30 3.80 3.70 3.65 3.65 0.015 0.016 0.016 0.017 Standard
    1080 66% 3.10 3.85 3.75 3.70 3.70 0.015 0.016 0.016 0.017 Standard
    1078 68% 3.30 3.80 3.70 3.65 3.65 0.015 0.016 0.016 0.017 Standard
    106 76% 2.30 3.62 3.52 3.47 3.47 0.016 0.017 0.017 0.018 Standard

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST Note: For cores ≤0.005”, it is recommended to use the reverse treated copper due to the low profile. The peel strength for RT foil is 1-2lb/in (0.35Kg/m) less than Standard foil.

    Laminate Availability

    Core thk. (Inches) Stack-up Resin Content DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.002 1-106 72% 3.70 3.60 3.55 3.55 0.016 0.017 0.017 0.018 Standard
    0.003 1-1080 66% 3.85 3.75 3.70 3.70 0.015 0.016 0.016 0.017 Standard
    0.004 1-2116 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 Standard
    0.004 2-106 72% 3.70 3.60 3.55 3.55 0.016 0.017 0.017 0.018 2ply
    0.005 1-2116 55% 4.04 3.99 3.94 3.94 0.014 0.015 0.015 0.016 Standard
    0.006 1-1506 45% 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014 Standard
    0.007 1-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014 Standard
    0.008 1-7628 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 Standard
    0.008 2-2116 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 2ply
    0.010 2-2116 55% 4.04 3.99 3.94 3.94 0.014 0.015 0.015 0.016 Standard
    0.012 2-1506 45% 4.34 4.29 4.24 4.24 0.012 0.013 0.013 0.014 Standard
    0.014 2-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014 Standard
    0.016 2-7628 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 Standard
    0.028 4-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014 Standard
    0.036 5-7628 43% 4.41 4.36 4.31 4.31 0.012 0.013 0.013 0.014 Standard
    0.045 6-7628 46% 4.31 4.26 4.21 4.21 0.013 0.014 0.014 0.015 Standard
    0.049 7-7628 41% 4.47 4.42 4.37 4.37 0.012 0.013 0.013 0.014 Standard
    0.059 8-7628 44% 4.38 4.33 4.28 4.28 0.012 0.013 0.013 0.014 Standard

    Press Condition

     

     

    1. Heating rate(Rise of Rate) of material [Material Temperature]
    Programmable Press: 1.5-3.0℃/min (3~5℉/min).  Manual Press:3~6℃ /min (5~10℉/min)

    2. Curing Temperature & Time: >60min at more than 185℃ (365℉)[Material Temperature], maximum temperature should exceed 195℃ (383℉)

    3. Full Pressure: ≥300psi (21Kg/cm2) should be applied in 15~20 minutes after press starts

    4. Vacuuming should be continued until over 140℃ (284℉) [Material Temperature]  

    5. Cold Press condition: Keep Plate @ Room Temperature by water, Pressure:100psi, Keep Time:60minutes

    190606VT-447V Graphic 1.jpg 190606 VT-447V - Graphic 2.jpg 190606 VT-447V - Graphic 3.jpg

    Typical Drilling Parameters (φ0.3-1.0 mm)

    Desmearing Process

    1. Desmear rate of VT-447 is less than that of the conventional FR4; 2. Adjustments to the desmear process are necessary for the lead-free materials; 3. Check with your chemical supplier for recommendations.
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