• pro-bond 7C & 7F: Ultra Low Dk/Df Resin Coated Copper & Resin Coated Film Bondply

    UL Approval: E214381 23/03/2024

     

    Resin Coated Copper (RCC) Bondply is an unreinforced adhesive system coated onto ultra-thin copper foil (1.5-5.0μm supported on an 18μm carrier foil) for use in high performance and high reliability multilayer PCB stack-ups.

    Resin Coated Film (RCF) Bondply is an unreinforced adhesive system coated onto PET film for use in high performance and high reliability multilayer PCB stack-ups.

    VT-770 is a high Tg, ceramic-filled, ultra low Dk (2.8) & Df (0.0025), halogen-free thermoset resin system, specifically designed for use in multilayer PCBs with Ventec tec-speed laminates & prepregs, and it is also fully compatible with other resin systems in hybrid stack-ups.

    General Information

    • Halogen free, Dk 2.8 & Df 0.0025
    • Ultra-thin dielectric layer
    • Suitable for sequential laminations
    • Unreinforced adhesive for better electrical isotropic consistency
    • Excellent flow characteristics and filling ability, designed for fine line and space
    • Laser drillable
    • Excellent laser hole pattern consistency

    Application

    • Interposers
    • Anti-shake Coils
    • Probe Cards
    • Packaging Modules

    Storage Condition

    RCC & RCF
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F)
    Relative Humidity Below 55% RH /

    Properties

    Properties Test Method Units Typical Value
    Dk (RC 50%) @ 1GHz IPC-TM-650 2.5.5.13 - 3.1
    @ 10GHz 2.8
    Df @ 1GHz IPC-TM-650 2.5.5.13 - 0.0020
    @ 10GHz 0.0025
    Tg DMA IPC-TM-650 2.4.24.4 °C 260
    Td TGA ASTM D3850 °C 410
    CTE α1 (<Tg) IPC-TM-650 2.4.24 ppm/°C 17
    α2 (>Tg) 50
    Thermal Stress @ 288˚C (10s/Cycle) IPC-TM-650 2.4.13.1 Second >300
    Thermal Conductivity ASTM D5470 W/mK 0.55
    Peel Strength - 5μm (Plated to 20μm) IPC-TM-650 2.4.8 N/mm (lb/in) 0.61 (3.5)
    Tensile Modulus 40˚C IPC-TM-650 2.4.24.4 GPa 8~10
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.10
    Flammability (in Lab) UL-94 Rating V-0

    All test data provided are typical and not intended to be specification values.

    Availability RCC

    RCC

    Press Ply Thickness 25μ/50μ (0.0010”/0.0020”)
    Copper Foil Thickness (18μm Carrier Foil) 1.5μm/2.0μm/3.0μm/5.0μm
    Panel Size 610mmx457mm (24”x18”)

    RCC Part Numbers

    Description Part Number
    pro-bond 7C RCC Cu 1.5μm Die 25μm 770-C15-025
    pro-bond 7C RCC Cu 2.0μm Die 25μm 770-C20-025
    pro-bond 7C RCC Cu 3.0μm Die 25μm 770-C30-025
    pro-bond 7C RCC Cu 5.0μm Die 25μm 770-C50-025
    pro-bond 7C RCC Cu 1.5μm Die 50μm 770-C15-050
    pro-bond 7C RCC Cu 2.0μm Die 50μm 770-C20-050
    pro-bond 7C RCC Cu 3.0μm Die 50μm 770-C30-050
    pro-bond 7C RCC Cu 5.0μm Die 50μm 770-C50-050

    RCF

    Carrier Film Type: PET (Standard) T
    Panel Size: 610mmx460mm (24”x18.11”) - Standard

    RCF Part Numbers

    Description Part Number PPT (μm) Flow Range
    pro-bond 7F RCF No Flow PPT 25μm 770-FT N-025 25 10~40
    pro-bond 7F RCF Regular Flow PPT 25μm 770-FT R-025 25 40~80
    pro-bond 7F RCF No Flow PPT 50μm 770-FT N-050 50 10~60
    pro-bond 7F RCF Regular Flow PPT 50μm 770-FT R-050 50 60~100

    Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Download TDS Datasheet