• VT-468 (LK2) / VT-468 (Q) Laminate

    UL Approval: E214381 Version: 13/10/2025

    General Information

    • Halogen free & High Tg
    • Very Low Dk & Extremely Low Loss
    • Excellent Thermal Reliability

     

    Application

    • High-speed Network Equipment 
    • AI GPU
    • 224 Gbps Backplanes

     

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.007” (0.178mm), available in sheet or panel form
    • Copper Foil: Hoz to 2oz
    • Prepregs are available in roll or panel form
    • LK2-Glass Styles: 1035, 1078

    Storage Condition

    Prepreg Laminate
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F) Room
    Relative Humidity Below 55% RH / /
    Shelf Life 3 Months 6 Months 24 months (airproof)

    Properties

    Properties Test Method Units Specification VT-468(LK2) VT-468(Q)
    Tg (DMA) IPC-TM-650 2.4.24.4 °C 170 minimum 220 205
    Td ASTM D3850 °C 340 minimum 440 440
    T288 IPC-TM-650 2.4.24.1 Minute 15 minimum >120 >120
    Thermal Stress @ 288˚C IPC-TM-650 2.4.13.1 Second Pass 10s >600 >600
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/˚C 60 maximum 40 40
    After Tg IPC-TM-650 2.4.24 ppm/˚C 300 maximum 140 140
    Total Expansion (50-260°C) IPC-TM-650 2.4.24 % 3.5 maximum 1.5 1.5
    Dk @ 10GHz (RC 66%) Cavity Resonator - 5.2 maximum 3.1 2.5
    Df @ 10GHz (RC 66%) Cavity Resonator - - 0.0009 0.0005
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 6.00E+08 5.00E+08
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 6.00E+06 5.00E+06
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 6.00E+07 5.00E+07
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 6.00E+06 5.00E+06
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1372 (54) 1400 (55)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 3 (175-250) Grade 3 (175-250)
    Arc Resistance IPC-TM-650 2.5.1 Second 60 minimum 195 195
    Peel Strength (Hoz HVLP3) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 4.5 (0.8) 4.0 (0.7)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) - 4.5 (0.8) 4.0 (0.7)
    Flexural Strength Warp IPC-TM-650 2.4.4 Kpsi (MPa) 60 (415) minimum 80 (560) 72 (500)
    Fill IPC-TM-650 2.4.4 Kpsi (MPa) 50 (345) minimum 65 (450) 61 (420)
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 minimum 0.04 0.04
    Flammability UL-94 Rating V-0 minimum V-0 V-0

    All test data provided are typical and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Download TDS Datasheet

  • VT-468(LK2) / VT-468(Q) Laminate/Prepreg

    UL Approval: E214381 Version: 28/11/2025

    Storage Condition & Shelf Life

    Prepreg Laminate
    Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
    Relative Humidity Below 55% / /
    Shelf Life 3 Months 6 Months 24 Months (airproof)

    Prepreg exceeding shelf life should be retested.

    Precautions in Handling

    • Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.

    • Prepreg should be stored flat in a cool dry controlled environment 23ºC or less and 50% RH or less.
      Extended storage of prepreg should be at a reduced temperature of 5ºC.

    • Open bags of prepreg must be resealed. Prepreg should not be exposed to open environments for more than 8 
      hours total cumulatively under the above conditions or as agreed upon between user and supplier.

    • A first-in-first-out inventory system and a method to track material lot numbers through PWB processing and
      delivery of finished circuits is recommended.

    Designing and Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core.
      Baking at 150ºC for 120 minutes is preferred.
    • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
    • Holding time between brown oxide and press process: best control within 6 hours.

    Prepreg Availability

    Dk values are for impedance design

    VT-468(LK2)

    Delivered Thickness (Inches) Glass Style Resin Content Dk Df
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.0025 1035 75% 3.02 3.02 3.01 3.00 2.98 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0030 1035 78% 2.97 2.97 2.96 2.95 2.93 0.0006 0.0006 0.0007 0.0008 0.0009
    0.0030 1078 66% 3.12 3.12 3.11 3.10 3.08 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0035 1078 71% 3.07 3.07 3.06 3.05 3.03 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0040 1078 75% 3.02 3.02 3.01 3.00 2.98 0.0007 0.0007 0.0008 0.0009 0.0010

    VT-468(Q)

    Delivered Thickness (Inches) Glass Style Resin Content DK DF
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.0022 1035 71% 2.49 2.49 2.48 2.47 2.45 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0025 1035 75% 2.44 2.44 2.43 2.42 2.40 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0030 1035 78% 2.39 2.39 2.38 2.37 2.37 0.0002 0.0002 0.0003 0.0004 0.0005
    0.0030 1078 66% 2.54 2.54 2.53 2.52 2.50 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0035 1078 71% 2.49 2.49 2.48 2.47 2.45 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0040 1078 75% 2.44 2.44 2.43 2.42 2.40 0.0003 0.0003 0.0004 0.0005 0.0006

    Remark: ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Dk values are for impedance design

    VT-468(LK2)

    Laminate Thickness (inch) Glass Style Piles Resin Content Dk Df
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.0020 1035 1ply 68% 3.10 3.10 3.09 3.08 3.06 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0025 1035 1ply 75% 3.02 3.02 3.01 3.00 2.98 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0030 1078 1ply 66% 3.12 3.12 3.11 3.10 3.08 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0035 1078 1ply 71% 3.07 3.07 3.06 3.05 3.03 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0040 1035 2ply 68% 3.10 3.10 3.09 3.08 3.06 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0050 1035 2ply 75% 3.02 3.02 3.01 3.00 3.98 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0060 1078 2ply 66% 3.12 3.12 3.11 3.10 3.08 0.0007 0.0007 0.0008 0.0009 0.0010
    0.0070 1078 2ply 71% 3.07 3.07 3.06 3.05 3.03 0.0007 0.0007 0.0008 0.0009 0.0010

    VT-468(Q)

    Laminate Thickness (inch) Glass Type Piles Resin Content Dk Df
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
    0.0020 1035 1ply 68% 2.52 2.52 2.51 2.50 2.48 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0025 1035 1ply 75% 2.44 2.44 2.43 2.42 2.40 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0030 1078 1ply 66% 2.54 2.54 2.53 2.52 2.50 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0035 1078 1ply 71% 2.49 2.49 2.48 2.47 2.45 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0040 1035 2ply 68% 2.52 2.52 2.51 2.50 2.48 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0050 1035 2ply 75% 2.44 2.44 2.43 2.42 2.40 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0060 1078 2ply 66% 2.54 2.54 2.53 2.52 2.50 0.0003 0.0003 0.0004 0.0005 0.0006
    0.0070 1078 2ply 71% 2.49 2.49 2.48 2.47 2.45 0.0003 0.0003 0.0004 0.0005 0.0006

    More types could be available upon request.

    Press Condition

    1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥3ºC/min

    2. Curing Temperature & Time: >120min at more than 210ºC and peak temperature>215 ºC

    3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

    4. Vacuuming should be continued until over 140ºC [Material Temperature]

    5. Cushion for pressure evenness is needed

    VT-770 770LK PressCycle.jpg

    Typical Drilling Parameters

    • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
    • Please adjust drilling parameters after checking qualities of through holes.
    • Smear, resin cracking or nail heading may occur if drilling condition doesn’t match material.

    Drill Size (mm) Spindle Speed (krpm) In-Feed Rate (inch/min) Retract (inch/min) S.F.M (ft/min) Chip Load (mil/rev.) Max Hit
    0.25 150 98 500 386 0.65 500
    0.30 126 118 500 389 0.93 500
    0.35 109 125 500 392 1.15 500
    0.40 96 130 500 395 1.35 500
    0.45 86 132 500 397 1.53 500
    0.50 78 133 500 400 1.7 1000
    0.55 71 132 500 403 1.85 1000
    0.60 66 131 500 405 1.99 1000
    0.65 61 129 500 408 2.11 1000
    0.70 57 127 500 411 2.21 1000
    0.75 54 124 500 414 2.3 1000
    0.80 51 120 500 416 2.37 1000
    0.85 48 117 500 419 2.43 1000
    0.90 46 113 500 422 2.47 1000
    1.00 41 104 500 427 2.5 1000

    Laser Drilling

    • Brown Oxidation treatment
    • Diameter: 80μm
    • Pulse width: 1st shot (for copper) 15us, 2nd / 3rd shot (for prepreg) 7us
    VT-772+(LK2) Laser Drilling.jpg

    Desmearing Process

    • Before using plasma or desmear, a post baking @150ºC for 120min is preferred.
    • 1 cycle Plasma and 1 cycle desmear is recommended.
    • Typical plasma conditions.

    Process Temperature (ºC) Gas Mixture Power (W) Duration (min)
    Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

    Typical Chemical conditions. (Atotech chemical)

    Process Temperature ℃ Duration (min)
    Sewll 60-70 5-10
    Permanganate Oxidizer 70-80 10-15

    If use other chemical, please consult the chemical supplier for suggested conditions. Please consult the chemical supplier for suggested conditions.

    Packaging and Baking Recommendation

    • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
    • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
    • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.
    Download PGL Datasheet