VT-463H Laminate/Prepreg

UL Approval: E214381 Version: 03/02/2025

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
Relative Humidity Below 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions in Handling

  • Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
  • Prepreg should be stored flat in a cool dry controlled environment 23ºC or less and 50% RH or less. Extended storage of prepreg should be at a reduced temperature of 5ºC.
  • Open bags of prepreg must be resealed. Prepreg should not be exposed to open environments for more than 8 hours total cumulatively under the above conditions or as agreed upon between user and supplier.
  • A first-in-first-out inventory system and a method to track material lot numbers through PWB processing and delivery of finished circuits is recommended.

 

Designing and Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
  • Holding time between brown oxide and press process: best control within 6 hours.

Prepreg Availability

E-Glass styles: 2116, 3313, 1078, 106, etc.

Delivered Thickness (Inches) Glass Style Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
0.0025 1067 72% 3.24 3.23 3.23 3.21 3.19 0.0014 0.0015 0.0017 0.0019 0.0021
0.0028 1067 75% 3.18 3.17 3.17 3.15 3.13 0.0012 0.0013 0.0015 0.0017 0.0019
0.003 1067 77% 3.16 3.16 3.16 3.12 3.11 0.0012 0.0013 0.0015 0.0017 0.0019
0.0032 1078 67% 3.36 3.35 3.35 3.33 3.32 0.0017 0.0018 0.0023 0.0027 0.0029
0.0035 1078 69% 3.32 3.32 3.31 3.3 3.28 0.0017 0.0018 0.0023 0.0027 0.0029
0.0041 1078 73% 3.24 3.23 3.23 3.21 3.19 0.0014 0.0015 0.0017 0.0019 0.0021
0.0039 3313 56% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
0.0042 3313 59% 3.58 3.58 3.57 3.56 3.55 0.0019 0.002 0.0026 0.0029 0.0031
0.0052 2116 56% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003

Remark: ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
0.002 1067 1 69% 3.32 3.32 3.31 3.3 3.28 0.0017 0.0018 0.0023 0.0027 0.0029
0.003 1078 1 65% 3.39 3.38 3.38 3.36 3.34 0.0017 0.0018 0.0023 0.0027 0.0029
0.004 3313 1 57% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
0.004 1067 2 69% 3.32 3.32 3.31 3.3 3.28 0.0017 0.0018 0.0023 0.0027 0.0029
0.005 2116 1 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
0.005 1067 2 72% 3.24 3.23 3.23 3.21 3.19 0.0014 0.0015 0.0017 0.0019 0.0021
0.006 1078 2 65% 3.39 3.38 3.38 3.36 3.34 0.0017 0.0018 0.0023 0.0027 0.0029
0.008 3313 2 57% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
0.01 2116 2 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
0.012 3313 3 57% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0025 0.003
0.016 3313 4 57% 3.36 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
0.018 3312x2+ 2116x2 4 56% 3.63 3.63 3.62 3.61 3.59 0.0018 0.0019 0.0025 0.0028 0.003
0.02 2116 4 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
0.025 2116 5 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
0.03 2116 6 55% 3.66 3.66 3.65 3.64 3.63 0.002 0.0021 0.0024 0.0027 0.0029
0.059 1067 1 69% 3.32 3.32 3.31 3.3 3.28 0.0017 0.0018 0.0023 0.0027 0.0029

More types could be available upon request.

Press Condition

1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥4ºC/min

2. Curing Temperature & Time: >100min at more than 210ºC and peak temperature>215 ºC

3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

4. Vacuuming should be continued until over 140ºC [Material Temperature]

5. Cushion for pressure evenness is needed

VT-463H PressCondition.jpg

Typical Drilling Parameters

  • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
  • Please adjust drilling parameters after checking qualities of through holes.
  • Suggest Drilling parameter as below:

 

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Chip Load (μm/rev) Hit Counts
0.2 160 1.6~2.4 10~15 700~1000
0.25 160 1.8~2.8 11~18 700~1000
0.3 160 1.9~3.2 12~20 700~1000
0.35 137 1.8~3.0 13~22 700~1000
0.4 120 1.8~2.9 15~24 700~1000
0.45 107 1.8~2.7 17~25 700~1000
0.5 96 1.8~2.7 19~28 1400~2000
0.55 87 1.8~2.6 21~30 1400~2000
0.6 80 1.7~2.6 21~33 1400~2000
0.65 74 1.7~2.6 23~35 1400~2000
0.7 68 1.7~2.6 25~38 1400~2000
0.75 64 1.6~2.6 25~41 1400~2000
0.8 60 1.6~2.5 27~42 1400~2000
0.85 56 1.6~2.4 29~43 1400~2000
0.9 53 1.6~2.4 30~45 1400~2000

Desmearing Process

• Before using plasma or desmear, a post baking @150ºC for 120min is preferred. • 1 cycle Plasma and 1 cycle desmear is recommended. • Typical plasma conditions.

Packaging and Baking Recommendation

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

 

Downloads for tec-speed 7.0H (VT-463H)