腾辉集团总部位于中国苏州,是一家全球领先的高品质覆铜箔基板(Copper Clad Laminate)和半固化片(Prepreg)制造销售商,产品广泛应用于各种印刷线路板(PCB)应用。腾辉拥有完整的独立研发能力并致力于持续改善及研发产品以满足客户需求。
腾辉集团足迹遍布全球,在亚洲、欧洲及美国都有制造、销售以及服务中心。
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26 三月 2024
Launching New Bondply Dielectrics and Value-Added Services at IPC APEX 2024
06 三月 2024
Ventec Expands European Technical Sales Team
27 二月 2024
Ventec 高 CTI、无卤素 FR15.1 基板 VT-447C 和 VT-441C 获得 UL 授权
22 二月 2024
Ventec Giga Solutions 宣布独家 PCB 层压板翻新服务