VT-464 Laminate/Prepreg

UL Approval: E214381 Version: 03/02/2025 /127/128/130

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room
Relative Humidity < 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions in Handling

  • The prepreg exceeding shelf time should be retested.
  • Take care in handling thin core laminates as they are easily damaged.
  • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing and Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
  • Holding time between brown oxide and press process: best control within 6 hours.

 

Prepreg Availability

E-Glass styles: 7628, 2116, 2113, 1080, 106, etc.

Delivered Thickness (Inches) Glass Style Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
0.002 106 72% 3.45 3.25 3.21 3.18 3.13 0.0101 0.0106 0.0112 0.0121 0.0126
0.0024 106 76% 3.35 3.18 3.15 3.1 3.05 0.0104 0.0109 0.0113 0.0124 0.0129
0.0031 1080 66% 3.55 3.5 3.44 3.37 3.32 0.0098 0.0101 0.0109 0.0116 0.0121
0.0033 1080 68% 3.48 3.44 3.39 3.35 3.3 0.0100 0.0105 0.0110 0.0118 0.0123
0.0038 2113 56% 3.82 3.76 3.72 3.62 3.57 0.0082 0.0085 0.0091 0.0102 0.0107
0.0048 2116 54% 3.85 3.81 3.75 3.65 3.6 0.0078 0.0081 0.0088 0.0099 0.0104
0.0051 2116 56% 3.82 3.76 3.72 3.62 3.57 0.0082 0.0085 0.0091 0.0102 0.0107
0.0078 7628 45% 4.07 4.03 3.97 3.88 3.83 0.0067 0.007 0.0078 0.0088 0.0093
0.0085 7628 48% 4.01 3.97 3.91 3.81 3.76 0.0068 0.0071 0.0079 0.0089 0.0094

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
0.002 1067 1 66% 3.55 3.5 3.44 3.37 3.32 0.0098 0.0101 0.0109 0.0116 0.0121
0.0025 1078 1 57% 3.78 3.76 3.72 3.58 3.57 0.0086 0.0085 0.0091 0.0104 0.0107
0.003 2112 1 53% 3.86 3.82 3.75 3.66 3.61 0.0078 0.0081 0.0088 0.0099 0.0104
0.0035 2113 1 52% 3.86 3.82 3.75 3.66 3.61 0.0078 0.0081 0.0088 0.0099 0.0104
0.004 2113 1 56% 3.82 3.76 3.72 3.62 3.57 0.0082 0.0085 0.0091 0.0102 0.0107
0.005 2116 1 55% 3.85 3.79 3.75 3.65 3.6 0.0080 0.0083 0.0089 0.0100 0.0105
0.006 2112 2 53% 3.86 3.82 3.75 3.66 3.61 0.0078 0.0081 0.0088 0.0099 0.0104
0.007 2113 2 52% 3.86 3.82 3.75 3.66 3.61 0.0078 0.0081 0.0088 0.0099 0.0104
0.008 2113 2 56% 3.82 3.76 3.72 3.62 3.57 0.0082 0.0085 0.0091 0.0102 0.0107
0.01 2116 2 55% 3.85 3.79 3.75 3.65 3.6 0.0080 0.0083 0.0089 0.0100 0.0105
0.012 1506 2 44% 4.13 4.09 4.03 3.94 3.89 0.0066 0.0069 0.0077 0.0087 0.0092
0.014 7628 2 41% 4.22 4.18 4.12 4.03 3.98 0.0064 0.0067 0.0075 0.0085 0.0090
0.015 7628 2 44% 4.13 4.09 4.03 3.94 3.89 0.0066 0.0069 0.0077 0.0087 0.0092
0.016 7628 2 46% 4.07 4.03 3.97 3.88 3.83 0.0067 0.0070 0.0078 0.0088 0.0093
0.021 7628 3 41% 4.22 4.18 4.12 4.03 3.98 0.0064 0.0067 0.0075 0.0085 0.0090
0.022 7628 3 44% 4.13 4.09 4.03 3.94 3.89 0.0066 0.0069 0.0077 0.0087 0.0092
0.024 7628 3 46% 4.07 4.03 3.97 3.88 3.83 0.0067 0.0070 0.0078 0.0088 0.0093

More types could be available upon request.

Press Condition

1. Heating rate(Rise of Rate) of material [Material Temperature] Programmable Press: ≥3.0℃/min

2. Curing Temperature & Time: >60min at more than 190ºC and peak temperature>195 ºC

3. Full Pressure: ≥350psi (25Kg/cm2) should be applied full pressure before 80 ºC

4. Vacuuming should be continued until over 140℃ [Material Temperature]  

5. Cushion for pressure evenness is needed

250203 VT-464 PressCondition.jpg

Typical Drilling Parameters

  • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
  • Please adjust drilling parameters after checking qualities of through holes.
  • Suggest Drilling parameter as below:

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
0.25 125 25 10~15 500
1.0 53 31 30~45 800

Desmearing Process

1. Use 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear based upon customers’ process condition. 2. Please test desmear rate and check whether the smear is cleaned clearly by SEM , Ventec could provide the specimens. 3. Typical plasma conditions:

Process Temperature ℃ Gas Mixture Power (W) Duration (min)
Parameter 80-100 10%CF4 , 80% O2, 10% N2 4000 60-80

Typical Chemical conditions. (Atotech chemical)

Process Temperature ℃ Duration (min)
Sewll 60-70 5-10
Permanganate Oxidizer 70-80 10-15

If use other chemical, please consult the chemical supplier for suggested conditions.

Packaging and Baking Recommendation

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

Downloads for tec-speed 2.0 (VT-464)