VT-901 CCL/Laminate VT-901 PP/Prepreg

UL Approval: E214381 Version: Rev. B5 18/07/2017 /40/41

Storage Condition & Shelf Life

Precautions In Handling

  • The prepreg exceeding shelf time should be retested.
  • Take care in handling thin core laminates as they are easily damaged.
  • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing And Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Dimension stability is the same as Standard FR4 material.
  • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
  • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

 

Prepreg Availability

E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106, 1067 etc.

Prepreg Availability

PP Type Resin Content Press Thickness (mil) DK DF Remark
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
7628 44% 8.0 3.95 3.90 3.85 3.80 0.013 0.013 0.014 0.015 Standard
7628 40% 7.3 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
1506 46% 6.8 3.95 3.90 3.85 3.80 0.014 0.014 0.015 0.016 Standard
2116 53% 5.1 3.80 3.78 3.72 3.67 0.015 0.015 0.016 0.017 Standard
2116 50% 4.7 3.85 3.80 3.75 3.70 0.015 0.015 0.016 0.017 Standard
2113 57% 4.3 3.78 3.75 3.70 3.65 0.015 0.015 0.016 0.017 Standard
1080 63% 3.1 3.72 3.68 3.63 3.58 0.015 0.015 0.016 0.017 Standard
1080 60% 2.8 3.75 3.70 3.65 3.60 0.015 0.016 0.017 0.018 Standard
106 70% 2.0 3.68 3.65 3.60 3.55 0.016 0.016 0.017 0.018 Standard

① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated pre-preg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

Laminate Availability

Core thk. (Inches) Stack-up Resin Content DK DF Remark
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
0.002 1-106 70% 3.68 3.65 3.60 3.55 0.016 0.016 0.017 0.018 Standard
0.003 1-1080 63% 3.72 3.68 3.63 3.58 0.015 0.015 0.016 0.017 Standard
0.004 1-2116 44% 3.90 3.85 3.80 3.75 0.014 0.014 0.015 0.016 Standard
0.004 2-1078 45% 3.90 3.85 3.80 3.75 0.014 0.014 0.015 0.016 2ply
0.005 1-2116 53% 3.80 3.78 3.72 3.67 0.015 0.015 0.016 0.017 Standard
0.005 2-1078 54% 3.80 3.78 3.72 3.67 0.015 0.015 0.016 0.017 2ply
0.006 1-1506 42% 4.00 3.95 3.90 3.85 0.013 0.013 0.014 0.015 Standard
0.007 1-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
0.008 1-7628 44% 3.95 3.90 3.85 3.80 0.013 0.013 0.014 0.015 Standard
0.008 2-2116 44% 3.90 3.85 3.80 3.75 0.014 0.014 0.015 0.016 2ply
0.010 2-2116 53% 3.80 3.78 3.72 3.67 0.015 0.015 0.016 0.017 Standard
0.012 2-1506 42% 4.00 3.95 3.90 3.85 0.013 0.013 0.014 0.015 Standard
0.014 2-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
0.016 2-7628 44% 3.95 3.90 3.85 3.80 0.013 0.013 0.014 0.015 Standard
0.028 4-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
0.036 5-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
0.045 6-7628 41% 4.05 4.00 3.90 3.85 0.012 0.012 0.013 0.014 Standard
0.049 7-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
0.059 8-7628 42% 4.02 3.98 3.90 3.85 0.013 0.013 0.014 0.015 Standard

Press Condition

1. Heating rate(Rise of Rate) of material [Material Temperature]
Programmable Press: 1.5-3.0℃/min (3~5℉/min).  Manual Press:3~6℃ /min (5~10℉/min)

2. Curing Temperature & Time:

 1)120~150min  at more than  218℃(424℉)  [Material Temperature] depending on total thickness. Boards thicker than 3 mm may need longer curing time. 

 2)For sequential lamination use 120 minutes for the first lamination and 150 minutes for the final. After pressing, Tg should be performed for further verification.

3. Full Pressure : ≥320psi

4. Vacuuming should be continued until over 200℃ (392℉) [Material Temperature]  

5. Cold Press condition:  
Keep Plate @ Room Temperature by water, Pressure:100psi, Keep Time:60minutes

901 Press Cycle.png

Typical Drilling Parameters (φ0.3-1.0 mm)

Desmearing Process

1. Adjustments to the desmear process are necessary for the polyimide materials; 2. Check with your chemical supplier for recommendations.

Downloads for VT-901