• VT-901 Laminate/Prepreg

    UL Approval: E214381 Version: B7 23/12/2017 /40/41

    General Information

    • Tg 250℃
    • High Td
    • Improved Fracture Toughness
    • Low Z-axis CTE
    • Meets NASA requirements for no visible bromine
    180507IPCLOGOWEBValidation-listed.jpg (1)

    Application

    • Chip Manufacturers
    • Engine/Flight Controls
    • Power Supply/Backplane
    • Military and Burn-in Board

    Availability

    • Core Thickness: 0.002” (0.05mm) to 0.125” (3mm), available in sheet or panel form
    • Copper Foil: 1/4oz to 6oz
    • Prepregs are available in roll or panel form
    • E-Glass styles: 7628, 1506, 2113, 2313, 3313, 2116, 1080, 106 etc

    Note: Double side treated copper foil and reverse copper foil are not suggested using on VT-901 laminates because the peel strength would not be as good as conventional materials.

    Properties Prepreg Laminate
    Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room
    Relative humidity Below 55% RH / /
    Shelf Life 3 months 6 months 24 months (airproof)

    The prepreg exceeding shelf life should be retested.

    Properties Sheet IPC-4101E /40 /41

    Properties Test Method Units Specification Typical Value
    Thermal Properties
    Tg DSC IPC-TM-650 2.4.25 °C - -
    TMA IPC-TM-650 2.4.24 °C 200 minimum 250
    Td ASTM D3850 °C - 395
    T260 IPC-TM-650 2.4.24.1 Minute - >60
    T288 IPC-TM-650 2.4.24.1 Minute - >60
    Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >1200
    Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C - 50
    After Tg IPC-TM-650 2.4.24 ppm/°C - 150
    Total Expansion (50~260°C) IPC-TM-650 2.4.24 % - 1.4
    X-Y CTE IPC-TM-650 2.4.24 ppm/°C - 11~12
    MOT UL 94 °C - 140
    Electrical Properties
    DK @ 1GHz RC 40% IPC-TM-650 2.5.5.9 - 5.4 maximum 4.05
    DF @ 1GHz RC 40% IPC-TM-650 2.5.5.9 - 0.035 maximum 0.012
    Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+6 minimum 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+6 minimum 5.0E+6
    Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 1.0E+6 minimum 5.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 1.0E+6 minimum 5.0E+6
    Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54)
    Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60
    Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 4 (100~175)
    Arc Resistance ASTM D495 Second 120 minimum 150
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 6~9 (1.05~1.58)
    After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 5.14 (0.90) minimum 6~9 (1.05~1.58)
    Flexural Strength Warp IPC-TM-650 2.4.4 Kpsi (MPa) 60 (415) minimum 600 (87)
    Fill IPC-TM-650 2.4.4 Kpsi (MPa) 47 (325) minimum 500 (72)
    Physical Properties
    Moisture Absorption IPC-TM-650 2.6.2.1 % 1.0 maximum 0.2
    Flammability UL-94 Rating HB minimum V0

    Note: All test data provided are typical values and are not intended to be specification values.

    Published on: 23/12/2017

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  • VT-901 CCL/Laminate VT-901 PP/Prepreg

    UL Approval: E214381 Version: Rev. B5 18/07/2017 /40/41

    Storage Condition & Shelf Life

    Precautions In Handling

    • The prepreg exceeding shelf time should be retested.
    • Take care in handling thin core laminates as they are easily damaged.
    • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
    • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

     

    Designing And Inner Layer Process

    • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
    • Dimension stability is the same as Standard FR4 material.
    • Please check with your oxide vendor to make sure that our material is suitable with your oxide process. We recommend to control the peel strength with brown oxide copper over 2 Lb/in.
    • For unclad or single sided laminates to be used in multilayer, please brush unclad sides before use.

     

    Prepreg Availability

    E-Glass styles: 7628, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106, 1067 etc.

    Prepreg Availability

    PP Type Resin Content Press Thickness (mil) DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    7628 44% 8.0 3.95 3.90 3.85 3.80 0.013 0.013 0.014 0.015 Standard
    7628 40% 7.3 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
    1506 46% 6.8 3.95 3.90 3.85 3.80 0.014 0.014 0.015 0.016 Standard
    2116 53% 5.1 3.80 3.78 3.72 3.67 0.015 0.015 0.016 0.017 Standard
    2116 50% 4.7 3.85 3.80 3.75 3.70 0.015 0.015 0.016 0.017 Standard
    2113 57% 4.3 3.78 3.75 3.70 3.65 0.015 0.015 0.016 0.017 Standard
    1080 63% 3.1 3.72 3.68 3.63 3.58 0.015 0.015 0.016 0.017 Standard
    1080 60% 2.8 3.75 3.70 3.65 3.60 0.015 0.016 0.017 0.018 Standard
    106 70% 2.0 3.68 3.65 3.60 3.55 0.016 0.016 0.017 0.018 Standard

    ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated pre-preg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

    Laminate Availablity

    Thickness: 0.002” (0.05mm) to 0.200” (5mm), available in sheet or panel form Copper Foil: 1/4 to 12oz, HTE or RTF or DST DK values are for impedance design.

    Laminate Availability

    Core thk. (Inches) Stack-up Resin Content DK DF Remark
    @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz
    0.002 1-106 70% 3.68 3.65 3.60 3.55 0.016 0.016 0.017 0.018 Standard
    0.003 1-1080 63% 3.72 3.68 3.63 3.58 0.015 0.015 0.016 0.017 Standard
    0.004 1-2116 44% 3.90 3.85 3.80 3.75 0.014 0.014 0.015 0.016 Standard
    0.004 2-1078 45% 3.90 3.85 3.80 3.75 0.014 0.014 0.015 0.016 2ply
    0.005 1-2116 53% 3.80 3.78 3.72 3.67 0.015 0.015 0.016 0.017 Standard
    0.005 2-1078 54% 3.80 3.78 3.72 3.67 0.015 0.015 0.016 0.017 2ply
    0.006 1-1506 42% 4.00 3.95 3.90 3.85 0.013 0.013 0.014 0.015 Standard
    0.007 1-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
    0.008 1-7628 44% 3.95 3.90 3.85 3.80 0.013 0.013 0.014 0.015 Standard
    0.008 2-2116 44% 3.90 3.85 3.80 3.75 0.014 0.014 0.015 0.016 2ply
    0.010 2-2116 53% 3.80 3.78 3.72 3.67 0.015 0.015 0.016 0.017 Standard
    0.012 2-1506 42% 4.00 3.95 3.90 3.85 0.013 0.013 0.014 0.015 Standard
    0.014 2-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
    0.016 2-7628 44% 3.95 3.90 3.85 3.80 0.013 0.013 0.014 0.015 Standard
    0.028 4-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
    0.036 5-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
    0.045 6-7628 41% 4.05 4.00 3.90 3.85 0.012 0.012 0.013 0.014 Standard
    0.049 7-7628 40% 4.05 4.00 3.93 3.88 0.012 0.012 0.013 0.014 Standard
    0.059 8-7628 42% 4.02 3.98 3.90 3.85 0.013 0.013 0.014 0.015 Standard

    Press Condition

    1. Heating rate(Rise of Rate) of material [Material Temperature]
    Programmable Press: 1.5-3.0℃/min (3~5℉/min).  Manual Press:3~6℃ /min (5~10℉/min)

    2. Curing Temperature & Time:

     1)120~150min  at more than  218℃(424℉)  [Material Temperature] depending on total thickness. Boards thicker than 3 mm may need longer curing time. 

     2)For sequential lamination use 120 minutes for the first lamination and 150 minutes for the final. After pressing, Tg should be performed for further verification.

    3. Full Pressure : ≥320psi

    4. Vacuuming should be continued until over 200℃ (392℉) [Material Temperature]  

    5. Cold Press condition:  
    Keep Plate @ Room Temperature by water, Pressure:100psi, Keep Time:60minutes

    901 Press Cycle.png

    Typical Drilling Parameters (φ0.3-1.0 mm)

    Desmearing Process

    1. Adjustments to the desmear process are necessary for the polyimide materials; 2. Check with your chemical supplier for recommendations.
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