VT-462S Laminate/Prepreg

UL Approval: E214381 Version: 03/02/2025 /91/102

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
Relative Humidity Below 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions in Handling

  • The prepreg exceeding shelf time should be retested.
  • Take care in handling thin core laminates as they are easily damaged.
  • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing and Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core. Baking at 150ºC for 120 minutes is preferred.
  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications.
  • Holding time between brown oxide and press process: best control within 6 hours.

Prepreg Availability

E-Glass styles: 2116, 3313, 1078, 1067,1037,1035, etc.

Delivered Thickness (mil) Glass Style Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
0.0021 106 72% 3.27 3.25 3.19 3.16 3.13 0.0027 0.003 0.0035 0.0041 0.0044
0.0025 106 76% 3.24 3.22 3.16 3.13 3.1 0.0026 0.0029 0.0034 0.004 0.0043
0.0030 1078 64% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
0.0033 1078 66% 3.33 3.31 3.27 3.24 3.21 0.0029 0.0032 0.0038 0.0044 0.0047
0.0035 1078 68% 3.31 3.29 3.25 3.23 3.2 0.0028 0.0031 0.0037 0.0043 0.0046
0.0041 3313 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
0.0049 2116 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052

Remark: ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Laminate Thickness (Inches) Glass Style Piles Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
0.002 1067 1 65% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
0.003 1078 1 64% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
0.004 2113 1 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
0.004 1067 2 65% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
0.005 2116 1 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
0.005 1078 2 60% 3.42 3.4 3.37 3.32 3.29 0.003 0.0034 0.0041 0.0048 0.0051
0.006 1078 2 64% 3.35 3.33 3.29 3.26 3.23 0.0029 0.0032 0.0038 0.0044 0.0047
0.008 2113 2 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
0.01 2116 2 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
0.012 2113 3 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
0.014 7628 2 43% 3.96 3.94 3.91 3.86 3.83 0.0034 0.0038 0.0045 0.0052 0.0055
0.016 2113 4 56% 3.64 3.63 3.6 3.54 3.51 0.0031 0.0035 0.0041 0.0048 0.0051
0.018 7628*2+ 2113*1 3 45% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053
0.020 2116 4 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
0.024 7628*2+ 2116*2 4 47% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053
0.025 2116 5 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
0.025 7628*2+ 2116*2 4 47% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053
0.028 7628 4 43% 3.96 3.94 3.91 3.86 3.83 0.0034 0.0038 0.0045 0.0052 0.0055
0.030 2116 6 54% 3.69 3.67 3.64 3.59 3.56 0.0031 0.0035 0.0042 0.0049 0.0052
0.030 7628 4 46% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053
0.059 7628 8 46% 3.91 3.89 3.86 3.81 3.78 0.0033 0.0036 0.0043 0.005 0.0053

More types could be available upon request.

Press Condition

1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥4ºC/min

2. Curing Temperature & Time: >90min at more than 210ºC and peak temperature>215 ºC

3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

4. Vacuuming should be continued until over 140ºC [Material Temperature]

5. Cushion for pressure evenness is needed

VT-462S HOT START CYCLE.jpg

Typical Drilling Parameters

  • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
  • Please adjust drilling parameters after checking qualities of through holes.
  • Suggest Drilling parameter as below:

 

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
0.25 145 25 8~13 500
1.0 53 31 30~45 1000

Desmearing Process

• Before using plasma or desmear, a post baking @150ºC for 120min is preferred. • 1 cycle Plasma and 1 cycle desmear is recommended. • Typical plasma conditions.

Packaging and Baking Recommendation

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

 

Downloads for tec-speed 6.0 (VT-462S)